www.osram-os.com
Produktdatenblatt | Version 1.1
BP 104 FASR
BP 104 FASR
DIL SMT
Silicon PIN Photodiode with Daylight Blocking Filter
Applications
——Rain sensors
Features:
——Package: black epoxy
——Qualifications: The product qualification test plan is based on the guidelines of AEC-Q101-REV-C,
Stress Test Qualification for Automotive Grade Discrete Semiconductors.
——ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
——Especially suitable for applications from 730 nm to 1100 nm
——Short switching time (typ. 20 ns)
——Suitable for SMT
Ordering Information
Type
Photocurrent
Photocurrent
Ordering Code
typ.
Ee = 1 mW/cm²; λ = 870 nm; VR = 5 V Ee = 1 mW/cm²; λ = 870 nm; VR = 5 V
IP
IP
BP 104 FASR-Z ≥ 25 µA
1 Version 1.3 | 2018-05-30
34 µA
Q65110A4263
BP 104 FASR
Maximum Ratings
TA = 25 °C
Parameter
Symbol
Operating Temperature
Top
min.
max.
-40 °C
100 °C
Storage temperature
Tstg
min.
max.
-40 °C
100 °C
Reverse voltage
VR
max.
20 V
Total power dissipation
Ptot
max.
150 mW
ESD withstand voltage
acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
VESD
2 Version 1.3 | 2018-05-30
Values
2 kV
BP 104 FASR
Characteristics
TA = 25 °C
Parameter
Symbol
Wavelength of max sensitivity
λS max
typ.
880 nm
Spectral range of sensitivity
λ10%
typ.
730 ... 1100
nm
Radiant sensitive area
A
typ.
4.84 mm²
Dimensions of active chip area
LxW
typ.
2.2 x 2.2
mm x mm
Half angle
φ
typ.
60 °
Dark current
VR = 10 V
IR
typ.
max.
Spectral sensitivity of the chip
λ = 870 nm
Sλ
typ.
0.63 A / W
Quantum yield of the chip
λ = 870 nm
η
typ.
0.90 Electrons
/ Photon
Open-circuit voltage
Ee = 0.5 mW/cm²; λ = 870 nm
VO
min.
typ.
250 mV
330 mV
Short-circuit current
Ee = 0.5 mW/cm²; λ = 870 nm
ISC
typ.
16 µA
Rise time
VR = 5 V; RL = 50 Ω; λ = 850 nm
tr
typ.
0.02 µs
Fall time
VR = 5 V; RL = 50 Ω; λ = 850 nm
tf
typ.
0.02 µs
Forward voltage
IF = 100 mA; E = 0
VF
typ.
1.3 V
C0
typ.
48 pF
Temperature coefficient of voltage
λ = 870 nm
TCV
typ.
-2.6 mV / K
Temperature coefficient of short-circuit current
λ = 870 nm
TCI
typ.
0.03 % / K
Noise equivalent power
VR = 10 V; λ = 870 nm
NEP
typ.
0.040 pW /
Hz1/2
Detection limit
D*
typ.
5.5e12 cm x
Hz1/2 / W
Capacitance
VR = 0 V; f = 1 MHz; E = 0
3 Version 1.3 | 2018-05-30
Values
2 nA
30 nA
BP 104 FASR
Relative Spectral Sensitivity
1), 2)
Srel = f (λ)
OHF01430
100
Srel %
80
70
60
50
40
30
20
10
0
400
Directional Characteristics
600
800
1000 nm 1200
λ
1), 2)
Srel = f (φ)
40
50
30
20
10
60
ϕ
0
1.0
0.8
0.6
70
0.4
80
0.2
0
90
1.0
0.8
100
OHF01402
4 Version 1.3 | 2018-05-30
0.6
0.4
0
20
40
60
80
100
120
BP 104 FASR
Photocurrent/Open-Circuit Voltage
IP (VR = 5 V) / VO = f (Ee)
Dark Current
1), 2)
IR = f (VR) ; E = 0
OHF01056
10 3
µA
ΙP
1), 2)
10 2
10 4
mV
OHF00080
4000
VO
ΙR
pA
10 3
3000
10 2
2000
10 1
1000
10 0
0
VO
10 1
ΙP
10 0
10 -1
10 0
10
1
10
2
2
µW/cm
10 4
Ee
Dark Current
1), 2)
IR = f (VR) ; E = 0
OHF02284
10 2
nA
ΙR
10 1
10 0
10 -1
0
2
4
6
8 10 12 14 16 V 20
VR
5 Version 1.3 | 2018-05-30
0
5
10
15
V
VR
20
BP 104 FASR
Capacitance
1), 2)
C = f (VR); f = 1 MHz; E = 0;
OHF01778
60
pF
C
50
40
30
20
10
0 -2
10
10 -1
Dark Current
10 0
10 1 V 10 2
VR
2)
IR = f (TA); E = 0; VR = 10 V
OHF05717
104
IR
nA
103
102
101
100
10-1
0
20
40
60
80 ˚C 100
TA
6 Version 1.3 | 2018-05-30
BP 104 FASR
Power Consumption
Ptot = f (TA);
OHF00394
160
mW
Ptot
140
120
100
80
60
40
20
0
0
20
40
60
80 ˚C 100
TA
7 Version 1.3 | 2018-05-30
BP 104 FASR
Chip position
6.2 (0.244)
0.9 (0.035)
0.7 (0.028)
4.5 (0.177)
4.3 (0.169)
0...5
6.7 (0.264)
˚
0.2 (0.008)
0.1 (0.004)
1.1 (0.043)
0.9 (0.035)
1.6 (0.063) ±0.2 (0.008)
1.7 (0.067)
1.5 (0.059)
4.0 (0.157)
3.7 (0.146)
0.3 (0.012)
3)
1.2 (0.047)
1.1 (0.043)
0...0.1
(0...0.004)
Dimensional Drawing
Photosensitive area Cathode lead
2.20 (0.087) x 2.20 (0.087)
GPLY7049
Approximate Weight:
44.0 mg
Package marking:
Cathode
8 Version 1.3 | 2018-05-30
BP 104 FASR
Recommended Solder Pad
3)
Reflow Soldering Profile
Product complies to MSL Level 4 acc. to JEDEC J-STD-020E
OHA04525
300
˚C
T 250
Tp 245 ˚C
240 ˚C
tP
217 ˚C
200
150
tL
tS
100
50
25 ˚C
0
0
50
100
150
200
250
s 300
t
9 Version 1.3 | 2018-05-30
BP 104 FASR
Profile Feature
Symbol
Pb-Free (SnAgCu) Assembly
Minimum
Recommendation Maximum
2
3
100
120
2
3
Ramp-up rate to preheat*)
25 °C to 150 °C
tS
Time tS
TSmin to TSmax
60
Ramp-up rate to peak*)
TSmax to TP
Unit
K/s
s
K/s
Liquidus temperature
TL
217
Time above liquidus temperature
tL
80
100
s
Peak temperature
TP
245
260
°C
Time within 5 °C of the specified peak
temperature TP - 5 K
tP
20
30
3
6
10
Ramp-down rate*
TP to 100 °C
°C
480
Time
25 °C to TP
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
1.5 (0.059)
2 (0.079)
0.8 (0.031)
4.1 (0.161)
6.9 (0.272)
4 (0.157)
5.5 (0.217)
Cathode/Collector Side
12 (0.472)
3)
1.75 (0.069)
Taping
OHAY2287
10 Version 1.3 | 2018-05-30
s
K/s
s
BP 104 FASR
Tape and Reel
4)
W1
D0
P0
A
N
F
W
E
13.0 ±0.25
P2
Label
P1
Direction of unreeling
Direction of unreeling
W2
Leader: min. 400 mm *
Trailer: min. 160 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D
OHAY0324
Reel dimensions [mm]
A
W
Nmin
W1
W2 max
Pieces per PU
180 mm
12 + 0.3 / - 0.1
60
12.4 + 2
18.4
1500
11 Version 1.3 | 2018-05-30
BP 104 FASR
Barcode-Product-Label (BPL)
Dry Packing Process and Materials
3)
Moisture-sensitive label or print
Barcode label
L
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see
lab
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If
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inf pa
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of
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(pe
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RA
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Humidity indicator
Barcode label
Please check the HIC immidiately after
bag opening.
Discard if circles overrun.
Avoid metal contact.
Do not eat.
Comparator
check dot
WET
If wet,
examine units, if necessary
bake units
15%
If wet,
examine units, if necessary
bake units
10%
5%
If wet,
parts still adequately dry.
change desiccant
Humidity Indicator
MIL-I-8835
Desiccant
AM
OSR
OHA00539
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
12 Version 1.3 | 2018-05-30
BP 104 FASR
Transportation Packing and Materials
3)
DE
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+Q
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Barcode label
Packing
Sealing label
Dimensions of transportation box in mm
Width
Length
Height
195 ± 5 mm
195 ± 5 mm
30 ± 5 mm
13 Version 1.3 | 2018-05-30
OHA02044
BP 104 FASR
Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the LED specified in this
data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the
eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light
sources have a high secondary exposure potential due to their blinding effect. When looking at bright light
sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this LED contain, in addition to other substances, metal filled materials including silver.
Metal filled materials can be affected by environments that contain traces of aggressive substances. Therefore, we recommend that customers minimize LED exposure to aggressive substances during storage, production, and use. LEDs that showed visible discoloration when tested using the described tests above did
show no performance deviations within failure limits during the stated test duration. Respective failure limits
are described in the IEC60810.
For further application related informations please visit www.osram-os.com/appnotes
14 Version 1.3 | 2018-05-30
BP 104 FASR
Disclaimer
Disclaimer
Language english will prevail in case of any discrepancies or deviations between the two language wordings.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version in the OSRAM OS Webside.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For
packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to
invoice you for any costs incurred.
Product safety devices/applications or medical devices/applications
OSRAM OS components are not developed, constructed or tested for the application as safety relevant
component or for the application in medical devices.
In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety
devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales
partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordinate the customer-specific request between OSRAM OS and Buyer and/or Customer.
15 Version 1.3 | 2018-05-30
BP 104 FASR
Glossary
1)
Testing temperature: TA = 25°C
2)
Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data
or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical
data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical
improvements, these typ. data will be changed without any further notice.
3)
Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and
dimensions are specified in mm.
4)
Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.
16 Version 1.3 | 2018-05-30
BP 104 FASR
Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.
17 Version 1.3 | 2018-05-30