Technical Data 4342
Effective June 2020
Supersedes June 2017
FP1107R
High frequency, high current power inductors
Applications
Product features
•
High current carrying capacity
•
Low core loss, magnetically shielded
•
Tight tolerance DCR for sensing circuits
•
Magnetically shielded
•
Inductance range from 70 nH to 510 nH
•
Current range from 42 A to 140 A
•
Frequency range up to 2 MHz
•
11 mm x 7.2 mm and 11.2 mm x 8.0 mm
footprint surface mount package in 6.5 mm, 7.2
and 7.5 mm heights
•
Ferrite core material
•
Moisture sensitivity level (MSL): 1
•
Multi-phase and Vcore regulators
•
Voltage Regulator Modules (VRMs)
• Server and desktop
•
Central processing unit (CPU)
•
Graphics processing unit (GPU)
•
Application specific integrated circuit (ASIC)
•
High power density
•
Data networking and storage systems
•
Graphics cards and battery power systems
•
Point-of-load modules
•
DCR Sensing circuits
Environmental compliance and general
specifications
•
Storage temperature range (Component):
-40 °C to +125 °C
•
Operating temperature range: -40 °C to +125 °C
(ambient plus self-temperature rise)
•
Solder reflow temperature: J-STD-020
(latest revision) compliant
HALOGEN
Pb HF
FREE
FP1107R
High frequency, high current power inductors
Technical Data 4342
Effective June 2020
Product Specifications
OCL1
(nH) ±10%
FLL2 (nH)
minimum
Irms3
(A)
Isat14
(A)
Isat25
(A)
Isat36
(A)
Isat47
(A)
DCR (mΩ)
@ +20°C
K-factor8
FP1107R1-R07-R
70
50
55
140
na
na
123
0.29 ±8%
361.1
FP1107R1-R12-R
120
86
55
90
na
na
72
0.29 ±8%
361.1
FP1107R1-R15-R
150
108
55
70
na
na
56
0.29 ±8%
361.1
FP1107R1-R23-R
230
166
55
45
na
na
36
0.29 ±8%
361.1
FP1107R1-R30-R
300
217
55
35
na
na
28
0.29 ±8%
361.1
FP1107R1-R40-R
400
288
55
25
na
na
20
0.29 ±8%
361.1
FP1107R1-R51-R
510
364
55
18
na
na
14.5
0.29 ±8%
361.1
FP1107R2-R07-R
70
50
42
140
na
na
123
0.47 ±6.4%
363.3
FP1107R2-R12-R
120
86
42
90
na
na
72
0.47 ±6.4%
363.3
FP1107R2-R15-R
150
108
42
70
na
na
56
0.47 ±6.4%
363.3
FP1107R2-R23-R
230
166
42
45
na
na
36
0.47 ±6.4%
363.3
FP1107R2-R30-R
300
217
42
35
na
na
28
0.47 ±6.4%
363.3
FP1107R2-R40-R
400
288
42
25
na
na
20
0.47 ±6.4%
363.3
FP1107R2-R51-R
510
364
42
18
na
na
14.5
0.47 ±6.4%
363.3
180
130
50
62
55
53
50
0.29 ±5%
361
FP1107R5-R070-R
70
50
55
140
na
na
123
0.29 ±5%
361.1
FP1107R5-R120-R
120
86
55
90
na
na
72
0.29 ±5%
361.1
FP1107R5-R150-R
150
108
55
70
na
na
56
0.29 ±5%
361.1
FP1107R5-R230-R
230
166
55
45
na
na
36
0.29 ±5%
361.1
FP1107R5-R300-R
300
217
55
35
na
na
28
0.29 ±5%
361.1
FP1107R5-R400-R
400
288
55
25
na
na
20
0.29 ±5%
361.1
FP1107R5-R510-R
510
364
55
18
na
na
14.5
0.29 ±5%
361.1
Part number9
R1 version
R2 version
R4 version
FP1107R4-R180-R
R5 version
1. Open circuit inductance (OCL) Test parameters: 100 kHz, 0.1 Vrms, 0.0 Adc, +25 °C
2. Full load inductance (FLL) Test parameters: 100 kHz, 0.1 Vrms, Isat1, +25 °C
3. Irms: DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents.
PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the
temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst case operating
conditions verified in the end application.
2
www.eaton.com/electronics
4. Isat1: Peak current for approximately 20% rolloff @ +25 °C
5. Isat2: Peak current for approximately 20% rolloff @ +85 °C
6. Isat3: Peak current for approximately 20% rolloff @ +100 °C
7. Isat4: Peak current for approximately 20% rolloff @ +125 °C
8. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3. Bp-p:(Gauss),
K: (K-factor from table), L: (Inductance in nH), Symbol I (Peak to peak ripple current in Amps).
9. Part Number Definition: FP1107Rx-Rxxx-R
FP1107R= Product code and size
x= Version indicator
-Rxxx= Inductance value in μH, R= decimal point
-R suffix = RoHS compliant
Technical Data 4342
FP1107R
High frequency, high current power inductors
Effective June 2020
Dimensions (mm)
FP1107R1, R2, R5
R ecom m ended P ad Layout
7.2 m ax
A
1.90
+/-0.15
b
S chem atic
2.1
1
3.1
1107R x
R xx
11.0
m ax
5.0
5.8 typ
xxxx
B
2
a
Dimension A
Dimension B
FP1107R1, R5
7.5 maximum
FP1107R1, R5
2.5 ±0.2
FP1107R2
7.2 maximum
FP1107R2
2.2 ±0.2
Part marking: 1107Rx (x = Version indicator), Rxxx = Inductance value in uH (R= decimal point)
xxxx= lot code
Tolerances are ±0.15 millimeters unless stated otherwise
All soldering surfaces to be coplanar within 0.1016 millimeters
Pad layout tolerances are ±0.1 millimeters unless stated otherwise
DCR measured from point “a” to point “b”
Traces or vias underneath the inductor is not recommended
FP1107R4
Recommended pad layout
b
8.0 max
2.70
2.2 nom
11.2 max
6.3 nom
5.70
a
FP1107Rx
Rxxx
xxxx
Schematic
6.5
max
2.4 nom
2.70
Part marking: FP1107Rx (x = Version indicator), Rxxx = Inductance value in uH (R= decimal point)
xxxx= lot code
Tolerances are ±0.15 millimeters unless stated otherwise
All soldering surfaces to be coplanar within 0.1millimeters
Pad layout tolerances are ±0.1 millimeters unless stated otherwise
DCR measured from point “a” to point “b”
Traces or vias underneath the inductor is not recommended
www.eaton.com/electronics
3
FP1107R
High frequency, high current power inductors
Technical Data 4342
Effective June 2020
Packaging information (mm)
FP1107R1, R2 Supplied in tape and reel packaging , 640 parts per 13” diameter reel
FP1107R5
Supplied in tape and reel packaging , 600 parts per 13” diameter reel
1.5 dia.
4.0
2.0
1.75
1
11.5
11.2
24
+/-0.3
1107Rx
Rxx
xxxx
2
7.6
1.5 dia.
12.0
Section A-A
Section B-B
User direction of feed
7.4
Packaging information (mm)
FP1107R4 Supplied in tape and reel packaging , 750 parts per 13” diameter reel
-
D0
T
B0
W
FP1107Rx
Rxxx
xxxx
P1
K0
+
P2
D1
+
-
P0
F
W±0.3 24.00
F±0.1 11.50
E1 ±0.1 1.75
P0±0.1 4.00
P1±0.1 12.00
P2±0.1 2.00
D0 0.1
1.50
0.0
1.50
D1 0.1
0.0
A0±0.1 8.3
A1±0.1
B0±0.1 11.5
B1±0.1
K0±0.1 6.7
T±0.05 0.4
E1
User Direction of Unreeling
A0
4
www.eaton.com/electronics
Technical Data 4342
FP1107R
High frequency, high current power inductors
Effective June 2020
Temperature rise vs. total loss
FP1107R1, R2, R5
FP1107R4
70
80
Temperature rise (°C)
Temperature rise (°C)
60
60
40
20
50
40
30
20
FP1107R1, R5
FP1107R2
0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
10
2.4
0
0.0
Total loss (W)
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
Total loss (W)
Core loss vs. Bp-p
1 MHz
FP1107R1, R2, R5
FP1107R4
1
10
500 kHz
300 kHz
200 kHz
1
0.1
Core loss (W)
Co re L o ss (W )
100 kHz
0 .1
0.01
3.0 MHz
1 MHz
700 kHz
2.0 MHz
0 .0 1
0.001
1.5 MHz
0 .0 0 1
100
1000
10000
0.0001
100
B p - p (G a u ss)
1000
10000
Bp-p (Gauss)
Inductance characteristics
FP1107R4-R180-R
FP1107R1, R2, R5
200
100%
180
-40°C
80%
160
+ 25°C
Inductance (nH)
% of OCL
140
60%
40%
+ 125°C
120
100
80
-40 °C
60
20%
+25 °C
+85 °C
40
0%
0%
20%
40%
60%
80%
% o f I sa t1
100%
120%
140%
+100 °C
20
0
+125 °C
0
20
40
60
80
100
120
Idc (A)
www.eaton.com/electronics
5
FP1107R
High frequency, high current power inductors
Technical Data 4342
Effective June 2020
Solder reflow profile
TP
TC -5°C
tP
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Temperature
TL
Preheat
A
T smax
Package
thickness
Volume
mm3
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