FP1107R1-R07-R

Technical Data 4342 Effective June 2020 Supersedes June 2017 FP1107R High frequency, high current power inductors Applications Product features • High current carrying capacity • Low core loss, magnetically shielded • Tight tolerance DCR for sensing circuits • Magnetically shielded • Inductance range from 70 nH to 510 nH • Current range from 42 A to 140 A • Frequency range up to 2 MHz • 11 mm x 7.2 mm and 11.2 mm x 8.0 mm footprint surface mount package in 6.5 mm, 7.2 and 7.5 mm heights • Ferrite core material • Moisture sensitivity level (MSL): 1 • Multi-phase and Vcore regulators • Voltage Regulator Modules (VRMs) • Server and desktop • Central processing unit (CPU) • Graphics processing unit (GPU) • Application specific integrated circuit (ASIC) • High power density • Data networking and storage systems • Graphics cards and battery power systems • Point-of-load modules • DCR Sensing circuits Environmental compliance and general specifications • Storage temperature range (Component): -40 °C to +125 °C • Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise) • Solder reflow temperature: J-STD-020 (latest revision) compliant HALOGEN Pb HF FREE FP1107R High frequency, high current power inductors  Technical Data 4342 Effective June 2020 Product Specifications OCL1 (nH) ±10% FLL2 (nH) minimum Irms3 (A) Isat14 (A) Isat25 (A) Isat36 (A) Isat47 (A) DCR (mΩ) @ +20°C K-factor8 FP1107R1-R07-R 70 50 55 140 na na 123 0.29 ±8% 361.1 FP1107R1-R12-R 120 86 55 90 na na 72 0.29 ±8% 361.1 FP1107R1-R15-R 150 108 55 70 na na 56 0.29 ±8% 361.1 FP1107R1-R23-R 230 166 55 45 na na 36 0.29 ±8% 361.1 FP1107R1-R30-R 300 217 55 35 na na 28 0.29 ±8% 361.1 FP1107R1-R40-R 400 288 55 25 na na 20 0.29 ±8% 361.1 FP1107R1-R51-R 510 364 55 18 na na 14.5 0.29 ±8% 361.1 FP1107R2-R07-R 70 50 42 140 na na 123 0.47 ±6.4% 363.3 FP1107R2-R12-R 120 86 42 90 na na 72 0.47 ±6.4% 363.3 FP1107R2-R15-R 150 108 42 70 na na 56 0.47 ±6.4% 363.3 FP1107R2-R23-R 230 166 42 45 na na 36 0.47 ±6.4% 363.3 FP1107R2-R30-R 300 217 42 35 na na 28 0.47 ±6.4% 363.3 FP1107R2-R40-R 400 288 42 25 na na 20 0.47 ±6.4% 363.3 FP1107R2-R51-R 510 364 42 18 na na 14.5 0.47 ±6.4% 363.3 180 130 50 62 55 53 50 0.29 ±5% 361 FP1107R5-R070-R 70 50 55 140 na na 123 0.29 ±5% 361.1 FP1107R5-R120-R 120 86 55 90 na na 72 0.29 ±5% 361.1 FP1107R5-R150-R 150 108 55 70 na na 56 0.29 ±5% 361.1 FP1107R5-R230-R 230 166 55 45 na na 36 0.29 ±5% 361.1 FP1107R5-R300-R 300 217 55 35 na na 28 0.29 ±5% 361.1 FP1107R5-R400-R 400 288 55 25 na na 20 0.29 ±5% 361.1 FP1107R5-R510-R 510 364 55 18 na na 14.5 0.29 ±5% 361.1 Part number9 R1 version R2 version R4 version FP1107R4-R180-R R5 version 1. Open circuit inductance (OCL) Test parameters: 100 kHz, 0.1 Vrms, 0.0 Adc, +25 °C 2. Full load inductance (FLL) Test parameters: 100 kHz, 0.1 Vrms, Isat1, +25 °C 3. Irms: DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst case operating conditions verified in the end application. 2 www.eaton.com/electronics 4. Isat1: Peak current for approximately 20% rolloff @ +25 °C 5. Isat2: Peak current for approximately 20% rolloff @ +85 °C 6. Isat3: Peak current for approximately 20% rolloff @ +100 °C 7. Isat4: Peak current for approximately 20% rolloff @ +125 °C 8. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in nH), Symbol I (Peak to peak ripple current in Amps). 9. Part Number Definition: FP1107Rx-Rxxx-R FP1107R= Product code and size x= Version indicator -Rxxx= Inductance value in μH, R= decimal point -R suffix = RoHS compliant Technical Data 4342 FP1107R High frequency, high current power inductors Effective June 2020  Dimensions (mm) FP1107R1, R2, R5 R ecom m ended P ad Layout 7.2 m ax A 1.90 +/-0.15 b S chem atic 2.1 1 3.1 1107R x R xx 11.0 m ax 5.0 5.8 typ xxxx B 2 a Dimension A Dimension B FP1107R1, R5 7.5 maximum FP1107R1, R5 2.5 ±0.2 FP1107R2 7.2 maximum FP1107R2 2.2 ±0.2 Part marking: 1107Rx (x = Version indicator), Rxxx = Inductance value in uH (R= decimal point) xxxx= lot code Tolerances are ±0.15 millimeters unless stated otherwise All soldering surfaces to be coplanar within 0.1016 millimeters Pad layout tolerances are ±0.1 millimeters unless stated otherwise DCR measured from point “a” to point “b” Traces or vias underneath the inductor is not recommended FP1107R4 Recommended pad layout b 8.0 max 2.70 2.2 nom 11.2 max 6.3 nom 5.70 a FP1107Rx Rxxx xxxx Schematic 6.5 max 2.4 nom 2.70 Part marking: FP1107Rx (x = Version indicator), Rxxx = Inductance value in uH (R= decimal point) xxxx= lot code Tolerances are ±0.15 millimeters unless stated otherwise All soldering surfaces to be coplanar within 0.1millimeters Pad layout tolerances are ±0.1 millimeters unless stated otherwise DCR measured from point “a” to point “b” Traces or vias underneath the inductor is not recommended www.eaton.com/electronics 3 FP1107R High frequency, high current power inductors  Technical Data 4342 Effective June 2020 Packaging information (mm) FP1107R1, R2 Supplied in tape and reel packaging , 640 parts per 13” diameter reel FP1107R5 Supplied in tape and reel packaging , 600 parts per 13” diameter reel 1.5 dia. 4.0 2.0 1.75 1 11.5 11.2 24 +/-0.3 1107Rx Rxx xxxx 2 7.6 1.5 dia. 12.0 Section A-A Section B-B User direction of feed 7.4 Packaging information (mm) FP1107R4 Supplied in tape and reel packaging , 750 parts per 13” diameter reel - D0 T B0 W FP1107Rx Rxxx xxxx P1 K0 + P2 D1 + - P0 F W±0.3 24.00 F±0.1 11.50 E1 ±0.1 1.75 P0±0.1 4.00 P1±0.1 12.00 P2±0.1 2.00 D0 0.1 1.50 0.0 1.50 D1 0.1 0.0 A0±0.1 8.3 A1±0.1 B0±0.1 11.5 B1±0.1 K0±0.1 6.7 T±0.05 0.4 E1 User Direction of Unreeling A0 4 www.eaton.com/electronics Technical Data 4342 FP1107R High frequency, high current power inductors Effective June 2020  Temperature rise vs. total loss FP1107R1, R2, R5 FP1107R4 70 80 Temperature rise (°C) Temperature rise (°C) 60 60 40 20 50 40 30 20 FP1107R1, R5 FP1107R2 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 10 2.4 0 0.0 Total loss (W) 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Total loss (W) Core loss vs. Bp-p 1 MHz FP1107R1, R2, R5 FP1107R4 1 10 500 kHz 300 kHz 200 kHz 1 0.1 Core loss (W) Co re L o ss (W ) 100 kHz 0 .1 0.01 3.0 MHz 1 MHz 700 kHz 2.0 MHz 0 .0 1 0.001 1.5 MHz 0 .0 0 1 100 1000 10000 0.0001 100 B p - p (G a u ss) 1000 10000 Bp-p (Gauss) Inductance characteristics FP1107R4-R180-R FP1107R1, R2, R5 200 100% 180 -40°C 80% 160 + 25°C Inductance (nH) % of OCL 140 60% 40% + 125°C 120 100 80 -40 °C 60 20% +25 °C +85 °C 40 0% 0% 20% 40% 60% 80% % o f I sa t1 100% 120% 140% +100 °C 20 0 +125 °C 0 20 40 60 80 100 120 Idc (A) www.eaton.com/electronics 5 FP1107R High frequency, high current power inductors  Technical Data 4342 Effective June 2020 Solder reflow profile TP TC -5°C tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Temperature TL Preheat A T smax Package thickness Volume mm3