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637-M15-232-BT2

637-M15-232-BT2

  • 厂商:

    EDAC

  • 封装:

  • 描述:

    637M SERIES VERTICAL D-SUB PLUG

  • 详情介绍
  • 数据手册
  • 价格&库存
637-M15-232-BT2 数据手册
637M/638M SERIES Machined D-Sub Connectors: Vertical, High Density Features: • • • • • • • • High density with machined contacts 0.090”(2.29mm) contact spacing X 0.078”(1.98mm) row spacing Plug and receptacle in 15, 26, 44 or 62 contact sizes Pin and socket contact mating design with P.C. tail and solder cup termination Metal shell provides EMI/RFI shielding, plug shell indents provide grounding and additional mating retention Grounding features include 4-prong boardlock for exceptional retention to P.C. board Mounting options for panel mount or connector mating include through hole, threaded inserts, boardlocks and removable threaded standoffs D-shaped connector mating outline provides polarization Specifications: Insulator Material PA9T, UL 94V-0, Color: Black (PA6T, UL 94V-0 for 62 Contacts) Contact Material Copper Alloy Contact Plating Gold Plating over Nickel All Over Shell Material Nickel or Tin Plated Steel Current Rating 5 amps Contact Resistance 10 Milliohms maximum Dielectric Withstanding Voltage 5000 megaohms minimum Insulation Resistance 1000 V AC rms at Sea Level Operating Temperature -55°C To +125°C Ordering Code: SERIES: 637: PLUG (PIN) 638: RECEPTACLE (SOCKET) MACHINED CONTACTS NO. OF CONTACTS: 15 - 15 CONTACTS 26 - 26 CONTACTS 44 - 44 CONTACTS 62 - 62 CONTACTS CONTACT FINISH CODE: 2 - GOLD FLASH PLATING 3 - 15 MICROINCHES OF GOLD PLATING 6 - 30 MICROINCHES OF GOLD PLATING CONTACT CODE: 30 - P.C.B. TAIL 5.90 (0.232) LONG 32 - SOLDER CUP www.edac.net MOUNTING & GROUNDING OPTIONS: 1 - Ø 3.05 (0.120) THRU HOLE 2 - 4-40 UNC INSERT 3 - 4-40 UNC INSERT + BOARD SPACER 4 - 4-40 UNC INSERT + BOARD SPACER + STANDOFF 5 - 4-40 UNC INSERT + BOARD SPACER + 4 PRONG BOARDLOCKS 6 - 4-40 UNC INSERT + BOARD SPACER + STANDOFF + 4 PRONG BOARDLOCKS SHELL PLATING CODE: N - NICKEL T - TIN MATERIAL CODE: B- BLACK customerservice@edac.net 637M/638M SERIES Machined D-Sub Connectors: Vertical, High Density PLUG SOLDER CUP RECEPTACLE SOLDER CUP PCB TAIL PCB TAIL www.edac.net customerservice@edac.net 637M/638M SERIES Machined D-Sub Connectors: Vertical, High Density MOUNTING & GROUNDING OPTIONS CODE - 1 CODE - 2 Ø 3.05 CODE - 3 4-40 UNC 4-40 UNC 2.70 CODE - 4 CODE - 5 4-40 UNC 7.40 CODE - 6 4-40 UNC 4-40 UNC 6.00 6.00 7.40 44 POS. 25.00 4.83 Ø1.10 47.05 2.29 Ø1.10 62 POS. 33.30 3.96 2.29 Ø1.10 63.50 1.98 16.65 9.73 1.98 3.96 23.53 16.60 16.60 Ø2.56 2.29 9.73 Ø3.20 1.98 3.96 12.50 5.47 26 POS. 10.70 PCB LAYOUT (PLUG ) 15 POS. Ø3.20 7.40 7.40 10.70 1.98 3.96 31.75 Ø3.20 24.70 24.70 2.41 Ø1.10 PCB LAYOUT (RECEPTACLE ) 15 POS. 44 POS. 25.00 3.96 1.98 12.50 4.83 5.47 2.29 26 POS. 3.96 1.98 16.65 9.73 23.53 16.60 Ø1.10 33.30 9.73 Ø3.20 Ø1.10 47.05 3.96 1.98 Ø3.20 16.60 Ø1.10 2.29 62 POS. 2.29 www.edac.net Ø3.20 3.96 1.98 63.50 31.75 24.70 2.41 Ø3.20 24.70 Ø1.10 customerservice@edac.net
637-M15-232-BT2
- 物料型号:637M/638M系列,分别代表插头和插座。 - 器件简介:这些是垂直安装的高密度D-Sub连接器,具有机加工接触点。 - 引脚分配:提供15、26、44或62个接触点的尺寸。 - 参数特性: - 绝缘体材料:PA9T, PA6T - 接触材料:铜合金 - 接触镀层:镍上镀金 - 壳体材料:镍或锡镀钢 - 电流额定值:5安培 - 接触电阻:最大10毫欧姆 - 介质耐压:至少5000兆欧 - 绝缘电阻:海平面1000V交流有效值 - 工作温度:-55°C至+125°C - 功能详解:金属壳体提供EMI/RFI屏蔽,插头壳体提供接地和额外的配对保持力。 - 应用信息:适用于需要高密度和EMI/RFI屏蔽的应用。 - 封装信息:包括不同的安装和接地选项,如通孔、螺纹嵌入件、板锁和可拆卸螺纹支架。

订购代码示例:637-M15-230-BN1,其中包含系列编号、插头或插座类型、机加工接触点、安装和接地选项、接触点数量、接触镀层代码、壳体镀层代码和材料代码。
637-M15-232-BT2 价格&库存

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