QTS-050-01-F-D-RA-WT-LS1

F-215 QTS–025–01–L–D–A ® QTS–050–01–F–D–A QTS–075–01–F–D–A (0,635 mm) .025" QTS SERIES HIGH SPEED GROUND PLANE HEADER SPECIFICATIONS Board Mates: QSS For complete specifications and recommended PCB layouts see www.samtec.com?QTS Cable Mates: SQCD Insulator Material: Liquid Crystal Polymer Contact Material: Phosphor Bronze Plating: Au or Sn over 50µ" (1,27 µm) Ni Current Rating: Contact: 1.8 A per pin (1 pin powered per row) Ground Plane: 23.1 A per ground plane (1 ground plane powered) Operating Temp: -55°C to +125°C Voltage Rating: 285 VAC Max Cycles: 100 RoHS Compliant: Yes Processing: Lead–Free Solderable: Yes SMT Lead Coplanarity: (0,10 mm) .004" max (025-075) Board Stacking: For applications requiring more than two connectors per board contact ipg@samtec.com Integral metal plane for power or ground Alignment Pin QTS/QSS Type Rated @ 3dB Insertion Loss* 5 mm Stack Height Single-Ended Signaling –D 9 GHz / 18 Gbps Differential Pair Signaling –D 8.5 GHz / 17 Gbps Differential Pair Signaling –DP 8.5 GHz / 17 Gbps *Performance data includes effects of a non-optimized PCB. Performance data for other stack heights and complete test data available at www.samtec.com?QTS or contact sig@samtec.com NO. OF POSITIONS PER ROW QTS Polarized (0,635 mm) .025" pitch OTHER SOLUTIONS • Board spacing standoffs (See SO Series) LEAD STYLE PLATING OPTION D OTHER OPTION A RECOGNITIONS For complete scope of recognitions see www.samtec.com/quality –025, –050, –075 (50 total positions per bank) Specify LEAD STYLE from chart. ALSO AVAILABLE (MOQ Required) • 11 mm & 16 mm stack height (Caution: Some automatic placement/ inspection machines may have component height restrictions. Please consult machinery specifications.) • 30µ" (0,76 µm) Gold • Differential Pair and “Partitionable” (combine differential & single-ended banks in same connector) available. • 100 & 125 positions per row • Edge Mount Contact Samtec. –F = Gold Flash on Signal Pins and Ground Plane, Matte Tin on tails –K –L = (7,00 mm) .275" DIA Polyimide film Pick & Place Pad = 10µ" (0,25 µm) Gold on Signal Pins and Ground Plane, Matte Tin on tails = Tape & Reel –TR –C* = Electro-Polished Selective 50µ" (1,27 µm) min Au over 150µ" (3,81 µm) Ni on Signal Pins in contact area, 10µ" (0,25 µm) min Au over 50µ" (1,27 µm) Ni on Ground Plane in contact area, Matte Tin over 50µ" (1,27 µm) min Ni on all solder tails (No. of Positions per Row/25) x (20,00) .7875 (20,00) .7875 01 (5,97) .235 (7,11) .280 02 (0,635) .025 (0,20) .008 (0,76) .030 A (0,89) .035 DIA *Note: –C Plating passes 10 year MFG testing STACK HEIGHTS LEAD MATED A STYLE HEIGHT –01 –02 (4,27) .168 (5,00) .197 (7,26) .286 (8,00) .315 Processing conditions will affect mated height. Note: Some lengths, styles and options are non-standard, non-returnable. WWW.SAMTEC.COM Due to technical progress, all designs, specifications and components are subject to change without notice.