TS19720CX6 RFG

TS19720 Taiwan Semiconductor Single-Stage PFC Buck Current Control LED Driver DESCRIPTION FEATURES The TS19720 is a high power factor and high accuracy ● Low THD 0.9 optimization by an external resistor. TS19720 achieves ● Low BOM Cost high power factor and high efficiency by boundary ● Boundary Conduction Mode Control conduction mode (BCM). The line and load regulation of ● Gate Output Voltage Clamp LED current are within ±2.5%. TS19720 also provides ● LED Open Protection gate ● LED Short Protection ● Over Current Protection (OCP) ● ● Over Thermal Protection (OTP) Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC. Halogen-free according to IEC 61249-2-21 harmonic driving protection, distortion voltage and (THD) clamping, system output and VCC over-voltage open/short circuit protection to increase IC performance. ● APPLICATION SOT-26 ● LED lighting ● Down lights, Tube lamps, PAR Lamps, Bulbs Pin Definition: 1. VCC 2. GND 3. OUT 4. RT 5. COM 6. CS Note: MSL 3 (Moisture Sensitivity Level) per J-STD-020 ABSOLUTE MAXIMUM RATINGS (Note 1) PARAMETER SYMBOL LIMIT UNIT Power Supply Pin VCC 40 V RT Voltage to GND VRT -0.3 to 5.5 V OUT Voltage to GND VOUT -0.3 to 40 V CS Voltage to GND VCS -0.3 to 5.5 V VCOM -0.3 to 5.5 V PD 0.3 W HBM 2 kV MM 200 V TLEAD 260 °C Junction Temperature Range TJ -40 to +150 °C Storage Temperature Range TSTG -65 to +150 °C COM Voltage to GND Power Dissipation @ TA=25 °C ESD Rating (Human Body Mode) (Note 2) ESD Rating (Machine Mode) Lead Temperature (Soldering 10 sec) 1 Version: B15 TS19720 Taiwan Semiconductor THERMAL PERFORMANCE PARAMETER SYMBOL LIMIT UNIT Thermal Resistance - Junction to Case RӨJC 106.6 °C/W Thermal Resistance - Junction to Ambient RӨJA 220 °C/W Note: RӨJA is the sum of the junction-to-case and case-to-ambient thermal resistances. The case thermal reference is defined at the solder mounting surface of the drain pins. RӨJA is guaranteed by design while RӨCA is determined by the user’s board design. RӨJA shown below for single device operation on FR-4 PCB in still air. Thermal Resistance is specified with the component mounted on a low effective thermal conductivity test board in free air at TA=25°C. RECOMMENDED OPERATING CONDITIONS PARAMETER (Note 3) SYMBOL CONDITIONS UNIT Power Supply Pin VCC 33 V RT Voltage to GND VRT -0.3 to 5 V OUT Voltage to GND VOUT -0.3 to 19 V CS Voltage to GND VCS -0.3 to 5 V VCOM -0.3 to 5 V Operating Junction Temperature Range TJ -40 to +125 °C Operating Ambient Temperature Range TOPA -40 to +85 °C COM Voltage to GND ELECTRICAL SPECIFICATIONS (VCC = 18V, TA = 25°C unless otherwise noted) PARAMETER CONDITIONS SYMBOL MIN TYP MAX UNIT VCC(ST) -- 45 -- µA IOPA -- 2.1 2.6 mA UVLO(off) VUVLO(off) 7 8 9 V UVLO(on) VUVLO(on) 16 17.5 19 V VOVP 29 31 33 V Feedback Reference Voltage VFB 0.196 0.2 0.204 V Transconductance GM -- 58 -- μS IO-SINK -- 5.8 -- μA IO-SOURCE -- 5.8 -- μA VOCP -- 1.4 -- V VOLP -- 5 -- V LEBt -- 400 -- ns -- 100 -- ns 3 4.5 6 kHz Supply Voltage Start-up Current VCC= VUVLO(on) -1V Operating Current With 1nF load on out pin OVP Level on VCC Pin Voltage Feedback Output Sink Current Output Source Current Current Sensing CS Limit Voltage Open Loop Voltage CS Pin Open Leading-Edge Blanking Time Delay to Output Switching Frequency Start Frequency fSTR 2 Version: B15 TS19720 Taiwan Semiconductor ELECTRICAL SPECIFICATIONS (VCC = 18V, TA = 25°C unless otherwise noted) PARAMETER CONDITIONS SYMBOL MIN TYP MAX UNIT Rising Time Load Capacitance =1nF tRISE -- 90 -- ns Falling Time Load Capacitance =1nF tFALL -- 40 -- ns VGATE -- 12.5 15 V -- 150 -- °C -- 120 -- °C Gate Driver Output VGATE-Clamp Thermal Section Thermal Shutdown (Note 4) Thermal Shutdown Release (Note 5) Notes: 1. Stresses listed as the above “Absolute Maximum Ratings” may cause permanent damage to the device. These are for stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may remain possibility to affect device reliability. 2. Devices are ESD sensitive. Handing precaution recommended.. 3. The device is not guaranteed to function outside its operating conditions. 4. Guaranteed by design. 5. Auto Recovery Type. 3 Version: B15 TS19720 Taiwan Semiconductor ORDERING INFORMATION PART NO. TS19720CX6 RFG PACKAGE PACKING SOT-26 3,000pcs / 7” Reel BLOCK DIAGRAM PIN DESCRIPTION PIN NO. NAME 1 VCC FUNCTION 2 GND Ground return for all internal circuitry 3 OUT Gate driver output 4 RT Efficiency / THD option pin 5 COM Output pin of error amplifier 6 CS Power supply pin for all internal circuitry Input current sense pin 4 Version: B15 TS19720 Taiwan Semiconductor APPLICATION INFORMATION Start-up Current The typical start-up current is around 45μA. Very low start-up current allows the PWM controller to increase the value of start-up resistor and then reduce the power dissipation. Under Voltage Lockout (UVLO) A hysteresis UVLO comparator is implemented in TS19720. The turn-on and turn-off thresholds level are fixed at 17.5V and 8V respectively. This hysteresis shown in Fig.3 ensures that the start-up capacitor will be adequate to supply the chip during start-up. For quick start-up of the LED driver, the start-up resistor should be matched with the start-up capacitor. Fig.3 Leading-Edge Blanking (LEB) Each time the power MOSFET is switched on, a turn-on spike will inevitably occur at the sense resistor. To avoid fault trigger, a 400ns leading-edge blanking time is built in. Conventional RC filtering can therefore be omitted. During this blanking period, the current-limit comparator is disabled and cannot switch off the gate driver. Gate Clamp Driver is clamped to 12.5V by an internal clamping circuit to avoid the Gate of MOSFET to get damaged. Over Current Protection (OCP) The TS19720 has built-in cycle by cycle over current protection function on CS pin. As the CS pin voltage is larger than VOCP (1.4V), the gate output will be turned off immediately to avoid the driver board to be burned out. Over Voltage Protection (OVP) on VCC To prevent the LED driver from being damaged, the TS19720 has an implemented OVP function on VCC. When the VCC voltage is higher than the VOVP (31V), the output gate driver circuit will be shut down immediately to stop the switching of power MOSFET. The VCC pin OVP function is an auto recovery type protection. If the OVP condition happens, the pulses will be stopped until the VCC pin voltage is down to the UVLO off level. The TS19720 is working in an auto-recovery mode as shown in Fig. 4. Fig. 4 5 Version: B15 TS19720 Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS (Unit: Millimeters) SOT-26 SUGGESTED PAD LAYOUT (Unit: Millimeters) MARKING DIAGRAM SC = Device Code Y W L = Year Code D =2014 E =2015 F =2016 G =2017 H =2018 J =2019 K =2020 = Week Code A~Z =wk1~wk26 A~Z = wk27~wk52 = Lot Code A~Z 6 Version: B15 TS19720 Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 7 Version: B15