ES1LD – ES1LJ
Taiwan Semiconductor
1A, 200V - 600V Super Fast Surface Mount Rectifier
FEATURES
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KEY PARAMETERS
Glass passivated chip junction
Ideal for automated placement
Super fast recovery time for high efficiency
Moisture sensitivity level: level 1, per J-STD-020
RoHS Compliant
Halogen-free according to IEC 61249-2-21
APPLICATIONS
● High frequency rectification
● Freewheeling application
● Switching mode converters and inverters in computer,
and telecommunication.
PARAMETER
VALUE
UNIT
IF
1
A
VRRM
200 - 600
V
IFSM
30
A
TJ MAX
150
°C
Package
DO-214AC (SMA)
Configuration
Single die
MECHANICAL DATA
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Case: DO-214AC (SMA)
Molding compound meets UL 94V-0 flammability rating
Terminal: Matte tin plated leads, solderable per J-STD-002
Meet JESD 201 class 2 whisker test
Polarity: Indicated by cathode band
Weight: 0.060g (approximately)
DO-214AC (SMA)
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
PARAMETER
SYMBOL
Marking code on the device
ES1LD
ES1LG
ES1LJ
ES1LD
ES1LG
ES1LJ
UNIT
Repetitive peak reverse voltage
VRRM
200
400
600
V
Reverse voltage, total rms value
VR(RMS)
140
280
420
V
Forward current
Peak forward surge current, 8.3ms single
half sine-wave superimposed on rated load
Junction temperature
IF
1
A
IFSM
30
A
TJ
- 55 to +150
°C
Storage temperature
TSTG
- 55 to +150
°C
1
Version: B2102
ES1LD – ES1LJ
Taiwan Semiconductor
THERMAL PERFORMANCE
PARAMETER
SYMBOL
TYP
UNIT
Junction-to-lead thermal resistance
RӨJL
35
°C/W
Junction-to-ambient thermal resistance
RӨJA
80
°C/W
Junction-to-case thermal resistance
RӨJC
25
°C/W
Thermal Performance Note: Units mounted on PCB (16mm x 16mm Cu test board)
ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted)
PARAMETER
CONDITIONS
SYMBOL
ES1LD
Forward voltage
(1)
ES1LG
IF = 1A, TJ = 25°C
VF
ES1LJ
Reverse current @ rated VR
TJ = 25°C
(2)
IR
TJ = 125°C
ES1LD
Junction capacitance
ES1LG
1MHz, VR = 4.0V
CJ
IF = 0.5A, IR = 1.0A,
Irr = 0.25A
trr
ES1LJ
Reverse recovery time
TYP
MAX
UNIT
-
0.95
V
-
1.30
V
-
1.70
V
-
5
µA
-
100
µA
16
-
pF
18
-
pF
-
35
ns
Notes:
1. Pulse test with PW = 0.3ms
2. Pulse test with PW = 30ms
ORDERING INFORMATION
ORDERING CODE(1)
PACKAGE
PACKING
ES1Lx
DO-214AC (SMA)
7,500 / Tape & Reel
Notes:
1. “x” defines voltage from 200V(ES1LD) to 600V(ES1LJ)
2
Version: B2102
ES1LD – ES1LJ
Taiwan Semiconductor
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig.1 Forward Current Derating Curve
Fig.2 Typical Junction Capacitance
100
CAPACITANCE (pF)
AVERAGE FORWARD CURRENT (A)
1.5
1
0.5
ES1LG - ES1LJ
10
0
ES1LD
f=1.0MHz
Vsig=50mVp-p
1
30
60
90
120
150
0.1
1
10
REVERSE VOLTAGE (V)
LEAD TEMPERATURE (°C)
Fig.3 Typical Reverse Characteristics
Fig.4 Typical Forward Characteristics
ES1LD
TJ=125°C
0.1
TJ=25°C
0.01
20
30
40
50
60
70
80
90
100
10 10
ES1LD
TJ=125°C
TJ=125°C
1
TJ=25°C
0.1
TJ=25°C
0.01
0.6
Pulse width
Pulse width 300μs
1% duty cycle
0.7
0.8
0.9
1
1.1
0.7
0.8
0.001
0.3
0.1
0.3
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
UF1DLW
1
(A)
INSTANTANEOUS FORWARD CURRENT (A)
INSTANTANEOUS REVERSE CURRENT (μA)
1
10
100
0.4
0.4
0.5
0.5
0.6
0.9
1.0
1.1
1.2
FORWARD VOLTAGE (V)
3
Version: B2102
1.2
ES1LD – ES1LJ
Taiwan Semiconductor
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig.6 Typical Forward Characteristics
ES1LG
1
TJ=125°C
0.1
TJ=25°C
0.01
10
20
30
40
50
60
70
80
90
100
10
10
1
ES1LG
UF1DLW
TJ=125°C
TJ=125°C
TJ=25°C
0.01
0.10.001
0.4 0.3
0.5 0.4
0.6
ES1LJ
1
TJ=125°C
TJ=25°C
0.01
30
40
50
60
70
80
90
0.6
0.8
0.7
0.9
0.8
1
0.9
1.1
1
1.2
1.1
1.3
1.2
Pulse width
Pulse width 300μs
1% duty cycle
0.7
0.8
0.9
1
1.1
1.2
100
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
10 10
ES1LJ
UF1DLW
1
TJ=125°C
TJ=125°C
1
TJ=25°C
0.1
(A)
10
20
0.5
0.7
Fig.8 Typical Forward Characteristics
INSTANTANEOUS FORWARD CURRENT (A)
INSTANTANEOUS REVERSE CURRENT (μA)
Fig.7 Typical Reverse Characteristics
10
Pulse width 300μs
Pulse width
1% duty cycle
FORWARD VOLTAGE (V)
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
0.1
TJ=25°C
1 0.1
(A)
10
INSTANTANEOUS FORWARD CURRENT (A)
INSTANTANEOUS REVERSE CURRENT (μA)
Fig.5 Typical Reverse Characteristics
TJ=25°C
0.01
0.001
0.3
0.1
0.4
0.4
0.6
0.5
0.8
0.6
1
1.2
1.4
1.6
1.8
FORWARD VOLTAGE (V)
4
Version: B2102
ES1LD – ES1LJ
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
DO-214AC (SMA)
SUGGESTED PAD LAYOUT
MARKING DIAGRAM
5
P/N
= Marking Code
G
= Green Compound
YW
= Date Code
F
= Factory Code
Version: B2102
ES1LD – ES1LJ
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability
for application assistance or the design of Purchasers’ products.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
6
Version: B2102
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