TSM9435CS RLG

TSM9435CS Taiwan Semiconductor P-Channel Power MOSFET -30V, -5.3A, 60mΩ KEY PERFORMANCE PARAMETERS FEATURES ● Advance Trench Process Technology ● High Density Cell Design for Ultra Low On- resistance Compliant to RoHS Directive 2011/65/EU and WEEE 2002/96/EC ● Halogen-free according to IEC 61249-2-21 PARAMETER VALUE UNIT VDS -30 V RDS(on) (max) ● VGS = -10V 60 VGS = -4.5V 90 Qg 9.52 mΩ nC APPLICATION ● Load Switch ● PA Switch SOP-8 Notes: MSL 3 (Moisture Sensitivity Level) per J-STD-020 ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage VDS -30 V Gate-Source Voltage VGS ±20 V (Note 1) Continuous Drain Current, VGS @4.5V Pulsed Drain Current, VGS @4.5V -5.3 TC = 25°C ID TC = 100°C (Note 2) -3.2 A IDM -20 A PDTOT 2.5 W TJ, TSTG - 55 to +150 °C SYMBOL LIMIT UNIT Junction to Case Thermal Resistance RӨJC 30 °C/W Junction to Ambient Thermal Resistance RӨJA 50 °C/W Total Power Dissipation @ TC = 25°C Operating Junction and Storage Temperature Range THERMAL PERFORMANCE PARAMETER Notes: RӨJA is the sum of the junction-to-case and case-to-ambient thermal resistances. The case thermal reference is defined at the solder mounting surface of the drain pins. RӨJA is guaranteed by design while RӨCA is determined by the user’s board design. RӨJA shown below for single device operation on FR-4 PCB in still air. 1 Version: D1602 TSM9435CS Taiwan Semiconductor ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted) PARAMETER Static CONDITIONS SYMBOL MIN TYP MAX UNIT (Note 3) Drain-Source Breakdown Voltage VGS = 0V, ID = -250µA BVDSS -30 -- -- V Gate Threshold Voltage VDS = VGS, ID = -250µA VGS(TH) -1.0 -1.5 -3.0 V Gate Body Leakage VGS = ±20V, VDS = 0V IGSS -- -- ±100 nA Zero Gate Voltage Drain Current VDS = -24V, VGS = 0V IDSS -- -- -1 µA -- 50 60 -- 75 90 Qg -- 9.52 -- Qgs -- 3.43 -- Qgd -- 1.71 -- Ciss -- 551.57 -- Coss -- 90.96 -- Crss -- 60.79 -- td(on) -- 10.8 -- tr -- 2.33 -- td(off) -- 22.53 -- tf -- 3.87 -- VSD -- -- -1.3 VGS = -10V, ID = -5.3A Drain-Source On-State Resistance Dynamic RDS(ON) VGS = -4.5V, ID = -4.2A mΩ (Note 4) Total Gate Charge VDS = -15V, ID = -5.3A, Gate-Source Charge VGS = -10V Gate-Drain Charge Input Capacitance VDS = -15V, VGS = 0V, Output Capacitance f = 1.0MHz Reverse Transfer Capacitance Switching nC pF (Note 5) Turn-On Delay Time Turn-On Rise Time VDD = -15V, RGEN = 6Ω, Turn-Off Delay Time ID = -1A, VGS = -10V, Turn-Off Fall Time Source-Drain Diode ns (Note 3) Forward On Voltage IS = -1.9A, VGS = 0V V Notes: 1. Current limited by package 2. Pulse width limited by the maximum junction temperature 3. Pulse test: PW ≤ 300µs, duty cycle ≤ 2% 4. For DESIGN AID ONLY, not subject to production testing. 5. Switching time is essentially independent of operating temperature. ORDERING INFORMATION PART NO. TSM9435CS RLG PACKAGE PACKING SOP-8 2,500pcs / 13” Reel 2 Version: D1602 TSM9435CS Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Output Characteristics Transfer Characteristics On-Resistance vs. Drain Current Gate Charge On-Resistance vs. Junction Temperature Source-Drain Diode Forward Voltage 3 Version: D1602 TSM9435CS Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) On-Resistance vs. Gate-Source Voltage Threshold Voltage Single Pulse Power Normalized Thermal Transient Impedance, Junction-to-Ambient 4 Version: D1602 TSM9435CS Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS (Unit: Millimeters) SOP-8 SUGGESTED PAD LAYOUT (Unit: Millimeters) MARKING DIAGRAM Y = Year Code M = Month Code for Halogen Free Product O =Jan P =Feb Q =Mar R =Apr S =May T =Jun U =Jul V =Aug W =Sep X =Oct Y =Nov Z =Dec L = Lot Code (1~9, A~Z) 5 Version: D1602 TSM9435CS Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 6 Version: D1602