SD8350-101-R

Technical Data 4146 Effective August 2017 Supersedes September 2011 SD8350 Low profile shielded drum core power inductors Applications • • • • • • • • Server power Notebook and laptop power High power LED driver, portable devices Base station, telecom, and networking Battery chargers, RAM power supply Industrial and automotive power systems Noise filtering output filter chokes Buck/boost converters, output converters Environmental data Product features • • • • • • Low-profile surface mount inductor 9.5 mm x 8.3 mm x 4.5 mm shielded drum core Ferrite core material Inductance range from 1.5 µH to 100 µH Current range from 0.8 A to 9.1 A Frequency range up to 1 MHz • • • Storage temperature range (component): -40 °C to +125 °C Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise) Solder reflow temperature: J-STD-020 (latest revision) compliant Pb HF FREE HALOGEN  Technical Data 4146 Effective August 2017 Product specifications Part Number SD8350-1R8-R SD8350-3R9-R SD8350-4R7-R SD8350-6R8-R SD8350-100-R SD8350-150-R SD8350-220-R SD8350-330-R SD8350-470-R SD8350-680-R SD8350-101-R Rated Inductance (µH) 1.8 3.9 4.7 6.8 10 15 22 33 47 68 100 OCL1 µH±30% 1.5 3.2 4.2 6.8 9.9 13.6 20.4 31.4 44.9 65.1 99.7 Irms2 (A) 5.50 4.50 4.10 3.90 3.20 2.30 1.80 1.40 1.30 1.00 0.80 1. Open Circuit Inductance Test Parameters: 100 kHz, 0.1 Vrms, 0.0 Adc. 2. Irms: DC current for an approximate ΔT of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst case operating conditions verified in the end application. 3. Isat Amps peak for approximately 35% rolloff (@ +25 °C) Isat3 (A) 9.1 6.3 5.5 4.4 4.0 2.9 2.6 2.2 1.8 1.5 1.3 DCR mΩ @ +20 °C Typ 11.8 16.2 18.5 20.8 31.4 45.0 63.5 111.4 130.0 200.8 308.0 DCR mΩ @ +20 °C Max 14.0 19.0 22.0 25.0 36.0 53.0 75.0 125.0 150.0 240.0 360.0 K-factor4 16.0 9.6 8.5 7.6 6.3 5.3 4.4 3.5 2.9 2.4 2.0 4. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K*L*ΔI, Bp-p (mT), K: (K factor from table), L: (Inductance in µH), ΔI (Peak to peak ripple current in Amps). 5. Part Number Definition: SD8350-xxx-R SD8350 = Product code and size; -xxx = Inductance value in µH; R = decimal point; If no R is present, third character equals number of zeros. -R suffix = RoHS compliant Dimensions-mm RECOMM ENDED PCB LAYOUT TOP VIEW BOTTOM VIEW 2.5 8.3 max. 1 SCHEM A TIC FRONT VI EW 2.9 4.5 max. 1.2 1 1.8 XX X wwlly R 9.5 max. 6.3 LEFT VIEW 5.7 2 Part Marking: xxx = Inductance value in μH. (R = Decimal point). If no R is present, third character = number of zeros wwlly - or - wwllyy = Date code R= Revision level Do not route traces or vias underneath the inductor Packaging information-mm Supplied in tape-and-reel packaging, 750 parts per reel, 13” diameter reel. 2 www.eaton.com/electronics 2 SD8350 Low profile shielded drum core power inductors Technical Data 4146 Effective August 2017 Temperature rise vs total loss 140 Temp eratu re Rise (°C) 120 100 80 60 40 20 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1MHz 500kHz 1 Total Loss (W) Core loss vs Bp-p 10 300kHz 100kHz 1 Core Loss (W) 200kHz 0. 1 0. 01 0. 001 0. 000 1 1 10 100 100 0 Bp-p (mT) Inductance characteristics OCL Vs. Isat 120% 100% % OCL 80% 60% +85 Deg. C +25 Deg. C -40 Deg. C 40% 20% 0% 0% 20% 40% 60% 80% 100% 120% 140% % Isat www.eaton.com/electronics 3 SD8350 Low profile shielded drum core power inductors Technical Data 4146 Effective August 2017 Solder Reflow Profile TP tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Temperature TL 25°C Preheat A T smax t TC -5°C Table 1 - Standard SnPb Solder (Tc) Volume mm3 220°C 220°C Table 2 - Lead (Pb) Free Solder (T c) Tsmin ts Package Thickness 2.5mm Time 25°C to Peak Volume mm3 2000 260°C 245°C 245°C Time Reference JDEC J-STD-020 Profile Feature Preheat and Soak • Temperature min. (Tsmin) • Temperature max. (Tsmax) • Time (Tsmin to Tsmax) (ts) Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Standard SnPb Solder 100°C Lead (Pb) Free Solder 150°C 150°C 200°C 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 60-150 Seconds 217°C 60-150 Seconds Table 1 Table 2 20 Seconds** 30 Seconds** 6°C/ Second Max. 6°C/ Second Max. 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 4146 BU-SB111111 August 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners.