Technical Data 10446
Effective September 2015
FP0505R
High frequency, high current power inductors
Applications
•
Servers
•
Multi-phase and Vcore regulators
•
Voltage Regulator Modules (VRMs)
•
Desktop VRMs and EVRDs
•
Data networking and storage systems
•
Graphics cards and battery power systems
•
Point-of-Load modules
Environmental Data
Description
•
High current carrying capacity
•
Low core loss
•
5.0 x 5.0mm footprint surface mount package in
an 4.8mm height
•
Ferrite core material
•
Halogen free, lead free, RoHS compliant
•
Storage temperature range (Component):
-40°C to +125°C
•
Operating temperature range: -40°C to +125°C
(ambient + self-temperature rise)
•
Solder reflow temperature: J-STD-020D
compliant
HALOGEN
Pb HF
FREE
FP0505R
High frequency, high current power inductors
Technical Data 10446
Effective September 2015
Product Specifications
Part Number8
OCL1
(nH) ±10%
FLL2 (nH)
minimum
Irms3
(amps)
Isat14
(amps)
Isat25
(amps)
Isat36
(amps)
DCR (mΩ)
±25% @ 20°C
K-factor7
100
68
30
34
26
24
0.38
1279
R1 Version
FP0505R1-R100-R
1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc, @ +25°C
2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, @ Isat, @ +25ºC
3. Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents.
PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the
temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating
conditions verified in the end application.
4. Isat1: Peak current for approximately 20% rolloff @ +25°C
5. Isat2: Peak current for approximately 20% rolloff @ +100°C
6. Isat3: Peak current for approximately 20% rolloff @ +125°C
7. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3 Bp-p: (Gauss),
K: (K-factor from table), L: (Inductance in nH), ΔI (Peak to peak ripple current in Amps).
8. Part Number Definition: FP0505Rx-Rxxx-R
FP0505R = Product code and size
x= Version indicator
Rxxx= inductance value in μH, R= decimal point ,
-R suffix = RoHS compliant
b
Dimensions (mm)
a
0.20
min
5.0
max
1.2
±0.2
4.8
max
2.0
typ
Recommended Pad Layout
2
0505Rx
Rxxx
wwly R
5.0
max
1
1.7
1.8
Part marking: 0505Rx (x = Version Indicator), Rxxx = Inductance value in uH (R= decimal point)
wwly = date code, R = revision level
Tolerances are ±0.15 millimeters unless stated otherwise
All soldering surfaces to be coplanar within 0.1 millimeters
PCB tolerances are ±0.1 millimeters unless stated otherwise
DCR measured from point “a” to point “b”
Do not route traces or vias underneath the inductor
www.eaton.com/elx
1
1.4
±0.2
2.0
2
Schematic
2
FP0505R
High frequency, high current power inductors
Technical Data 10446
Effective September 2015
Packaging information (mm)
Supplied in tape and reel packaging, 1,000 parts per 13” diameter reel
4.0
1.75
16.0
±0.3
1.5
2.0
dia
5
1.
a
di
12.0
7.5
5.2
5.2
5.0
User Direction of feed
Temperature rise vs. total loss
FP0505R1
60
Temperature Rise (°C)
50
40
30
20
10
0
0.00
0.10
0.20
0.30
0.40
0.50
0.60
0.70
Total Loss (W)
www.eaton.com/elx
3
FP0505R
High frequency, high current power inductors
Technical Data 10446
Effective September 2015
Core loss vs. Bp-p
FP0505R1
1
300KHz
500KHz
Core Loss (mw)
100KHz
1MHz
0.1
200KHz
0.01
0.001
0.0001
100
1000
10000
B p-p (Gauss)
Inductance characteristics
FP0505R1-R100-R
120%
100%
% of OCL
80%
60%
-40°C
40%
+25°C
+100°C
20%
0%
+125°C
0
5
10
15
20
I DC (Amps)
4
www.eaton.com/elx
25
30
35
40
FP0505R
High frequency, high current power inductors
Technical Data 10446
Effective September 2015
Solder reflow profile
TP
TC -5°C
tP
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Temperature
TL
Preheat
A
T smax
t
Table 1 - Standard SnPb Solder (Tc)
Package
Thickness
Volume
mm3
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