P1
TAI-TECH
Power Inductor
HPC3015F-SERIES
ECN HISTORY LIST
REV
DATE
DESCRIPTION
APPROVED
CHECKED
DRAWN
1.0
13/04/22
新 發 行
楊祥忠
詹偉特
林宜蕰
備
註
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P2
TAI-TECH
Power Inductor
HPC3015F-SERIES
1. Features
1. This specification applies Low Profile Power Inductors.
2. 100% Lead(Pb) & Halogen-Free and RoHS compliant.
2. Dimension
Halogen
Pb
Halogen-free
Pb-free
H
I
G
I
Series
A(mm)
B(mm)
C(mm)
D(mm)
E(mm)
G(mm)
H(mm)
HPC3015F
3.0±0.1
3.0±0.1
1.5 max.
0.9±0.2
1.9±0.2
2.2 ref.
2.7 ref.
I(mm)
0.8 ref.
Units: mm
3. Part Numbering
HPC
3015
F
A
B
C
-
2R2
D
M
E
A: Series
B: Dimension
C: Control S/N
D: Inductance
E: Inductance Tolerance
2R2=2.2uH
M=±20%;Y=±30%
4. Specification
TAI-TECH
Part Number
Inductance
(uH)
SRF
(MHz) min.
DCR
(Ω) ±20%
I sat
(A)
I rms
(A)
HPC3015F-1R0Y
1.0
±30%
1V100K
100
0.030
2.10
2.10
HPC3015F-1R5Y
1.5
±30%
1V100K
87
0.040
1.80
1.82
HPC3015F-2R2M
2.2
±20%
1V100K
64
0.060
1.48
1.50
HPC3015F-3R3M
3.3
±20%
1V100K
49
0.080
1.21
1.23
HPC3015F-4R7M
4.7
±20%
1V100K
40
0.120
1.02
1.04
HPC3015F-6R8M
6.8
±20%
1V100K
36
0.160
0.87
0.88
HPC3015F-100M
10
±20%
1V100K
28
0.230
0.70
0.71
HPC3015F-150M
15
±20%
1V100K
23
0.360
0.56
0.56
22
±20%
1V100K
20
0.520
0.47
0.47
HPC3015F-220M
Tolerance Test Frequency
(%)
(Hz)
Note:
Isat:Based on inductance change (△L/L0:≦-30%)@ ambient temp. 25℃
Irms:Based on temperature rise (△T:40℃ typ.)
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P3
TAI-TECH
Core chipping
The appearance standard of the chipping size on top side, and bottom side ferrite core is listed below.
Type
HPC3015F
L
W
0.6mm Max. 0.6mm Max.
Void appearance tolerance Limit
Size of voids occurring to coating resin is specified below.
Exposed wire tolerance limit of coating resin part on product side.
Size of exposed wire occurring to coating resin is specified below.
1. Width direction(dimension a):Acceptable when a≦w/2
Nonconforming when a>w/2
2. Length direction(dimension b):Dimension b is not specified.
3. The total area of exposed wire occurring to each sides is
not greater than 50% of coating resin area, and is acceptable.
External appearance criterion for exposed wire
Exposed end of the winding wire at the secondary side should be 2mm and below.
5 Exectrde appearance criterion for exposed wire
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P4
TAI-TECH
6. Material List
No.
Item
Material
1
Core
Ni-Zn ferrite
2
Wire
Copper Wire
3
Coating
Epoxy with magnetic
4
Solder
Lead free
7. Reliability and Test Condition
Item
Performance
Operating Temperature
- 25 ~ +120℃.
Storage Temperature
-40 ~ +85℃.
- 5 to 40℃ for the product with taping.
Test Method and Remarks
Including self-generated heat
Rated current
Inductance (L)
Within the specified tolerance
DC Resistance
LCR Meter: HP 4285A or equivalent, 100kHz, 1V
DC Ohmmeter: HIOKI3227 or equivalent
Temperature characteristics
Inductance change:Within±20%
Resistance to flexure substrate
No damage.
Measurement of inductance shall be taken at temperature
rang within–25℃ to +85℃.
With reference to inductance value at+20 ℃,change rate
shall be calculated.
Measurement of inductance shall be taken at temperature
rang within–40℃ to +125℃.
With reference to inductance value at+20 ℃,change rate
shall be calculated.
The test samples shall be soldered to the testing board by
the reflow.
As illustrated below, apply force in the direction of the arrow
indicating until deflection of the test board reaches to 2mm.
Substrate size:100x40x1.0
Substrate material:glass epoxy-resin
Solder cream thickness:0.10
The test samples shall be soldered to the testing board and
by the reflow.
Adhesion of Terminal electrode
Shall not come off PC board.
Applied force:10 N to X and Y directions.
Duration:5s
Solder cream thickness:0.15
The test samples shall be soldered to the test board by the
reflow.
Then it shall be submitted to below test conditions.
Frequency: 10-55Hz
Total Amplitude: 1.5mm (May not exceed acceleration
196m/S2 )
Sweeping Method:10Hz to 55Hz to 10Hz for 1min.
Time:2 hours each in X,Y, and Z Direction.
Recovery: At least 2hrs of recovery under the standard
condition after the test, followed by the measurement within
48hrs.
Resistance to Vibration
Inductance change:Within±10%
No abnormality observed in appearance.
Solderability
The test samples shall be dipped in flux, and then immersed
in molten solder as shown in below.
Flux:methanol solution containing rosin 25%
At least 90% of surface of terminal electrode is covered by new solder. Solder temperature: 245±5℃
Time: 5±1.0 sec.
Immersion depth: All sides of mounting terminal shall be
immersed.
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P5
TAI-TECH
Item
Performance
Test Method and Remarks
Test board thickness:1.0mm
Test board material:glass epoxy resin
THE Chip shall be stabilized normal condition for1~2hours
befor measuring
R e f lo w S o ld e r in g
Resistance to soldering
Inductance change:Within±10%
No abnormality observed in appearance.
P R E - H E A T IN G
S O L D E R IN G
20~40s
NATURAL
C O O L IN G
T P (2 6 0 ° C / 4 0 s m a x .)
217
60~150s
200
150
60~180s
480s m ax.
25
T IM E ( s e c .)
The test samples shall be soldered to the test board by the
reflow.
The test samples shall be placed at specified temperature
for specified time by step 1 to step 4 as shown below in
sequence.
The temperature cycles shall be repeated 100 cycles .
Thermal shock
Test Method and Remarks The test samples shall be
soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at
specified temperature and humidity as shown in below.
Temperature: 40±2℃
Humidity: 90~95%RH
Time: 504±8 hrs.
Damp heat life test
Inductance change:Within±10%
No abnormality observed in appearance.
Loading under damp heat life test
The test samples shall be soldered to the test board by the
reflow.
The test samples shall be placed in thermostatic oven set at
specified temperature and humidity and applied the rated
current continuously as shown in below.
Temperature: 60±2℃
Humidity: 90~95%RH
Applied current: Rated current
Time: 500+24/-0 hrs
Low temperature life test
The test samples shall be soldered to the test board by the
reflow.
After that, the test samples shall be placed at test conditions
as shown in below.
Temperature:-40±2℃
Time: 500±8 hrs.
Loading at high temperature life test
The test samples shall be soldered to the test board by the
reflow.
Temperature: 40±2℃.
Applied current: Rated current
Time: 500±8 hrs.
.
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P6
TAI-TECH
8. Soldering
9. Packaging Information
(1) Reel Dimension
(2) Tape Dimension
K0
COVER TAPE
t
2.0±0.5
w
B
D
B
C
A
A
P
EMBOSSED CARRIER
Type
A(mm)
B(mm)
C(mm)
D(mm)
Type
A(mm)
HPC3015F
10±1.5
60±1.0
13±0.5
180±0.5
HPC3015F
3.2±0.1
B(mm) Ko(mm) P(mm) W(mm)
3.2±0.1
1.9±0.1
(3) Packaging Quantity
Type
Chip / Reel
HPC3015F
2000
Application Notice
‧Storage Conditions
To maintain the solderability of terminal electrodes:
1. TAI-TECH products meet IPC/JEDEC J-STD-020D standard-MSL, level 1.
2. Temperature and humidity conditions: Less than 40℃ and 60% RH.
3. Recommended products should be used within 12 months form the time of delivery.
4. The packaging material should be kept where no chlorine or sulfur exists in the air.
‧Transportation
1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
2. The use of tweezers or vacuum pick up is strongly recommended for individual components.
3. Bulk handling should ensure that abrasion and mechanical shock are minimized.
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4.0±0.1
8.0±0.2
t(mm)
0.30±0.05
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