HPC3015F-100M

P1 TAI-TECH Power Inductor HPC3015F-SERIES ECN HISTORY LIST REV DATE DESCRIPTION APPROVED CHECKED DRAWN 1.0 13/04/22 新 發 行 楊祥忠 詹偉特 林宜蕰 備 註 www.tai-tech.com.tw P2 TAI-TECH Power Inductor HPC3015F-SERIES 1. Features 1. This specification applies Low Profile Power Inductors. 2. 100% Lead(Pb) & Halogen-Free and RoHS compliant. 2. Dimension Halogen Pb Halogen-free Pb-free H I G I Series A(mm) B(mm) C(mm) D(mm) E(mm) G(mm) H(mm) HPC3015F 3.0±0.1 3.0±0.1 1.5 max. 0.9±0.2 1.9±0.2 2.2 ref. 2.7 ref. I(mm) 0.8 ref. Units: mm 3. Part Numbering HPC 3015 F A B C - 2R2 D M E A: Series B: Dimension C: Control S/N D: Inductance E: Inductance Tolerance 2R2=2.2uH M=±20%；Y=±30% 4. Specification TAI-TECH Part Number Inductance (uH) SRF (MHz) min. DCR (Ω) ±20% I sat (A) I rms (A) HPC3015F-1R0Y 1.0 ±30% 1V100K 100 0.030 2.10 2.10 HPC3015F-1R5Y 1.5 ±30% 1V100K 87 0.040 1.80 1.82 HPC3015F-2R2M 2.2 ±20% 1V100K 64 0.060 1.48 1.50 HPC3015F-3R3M 3.3 ±20% 1V100K 49 0.080 1.21 1.23 HPC3015F-4R7M 4.7 ±20% 1V100K 40 0.120 1.02 1.04 HPC3015F-6R8M 6.8 ±20% 1V100K 36 0.160 0.87 0.88 HPC3015F-100M 10 ±20% 1V100K 28 0.230 0.70 0.71 HPC3015F-150M 15 ±20% 1V100K 23 0.360 0.56 0.56 22 ±20% 1V100K 20 0.520 0.47 0.47 HPC3015F-220M Tolerance Test Frequency (%) (Hz) Note: Isat：Based on inductance change （△L/L0：≦-30%）@ ambient temp. 25℃ Irms：Based on temperature rise （△T：40℃ typ.） www.tai-tech.com.tw P3 TAI-TECH Core chipping The appearance standard of the chipping size on top side, and bottom side ferrite core is listed below. Type HPC3015F L W 0.6mm Max. 0.6mm Max. Void appearance tolerance Limit Size of voids occurring to coating resin is specified below. Exposed wire tolerance limit of coating resin part on product side. Size of exposed wire occurring to coating resin is specified below. 1. Width direction（dimension a）：Acceptable when a≦w/2 Nonconforming when a＞w/2 2. Length direction（dimension b）：Dimension b is not specified. 3. The total area of exposed wire occurring to each sides is not greater than 50% of coating resin area, and is acceptable. External appearance criterion for exposed wire Exposed end of the winding wire at the secondary side should be 2mm and below. 5 Exectrde appearance criterion for exposed wire www.tai-tech.com.tw P4 TAI-TECH 6. Material List No. Item Material 1 Core Ni-Zn ferrite 2 Wire Copper Wire 3 Coating Epoxy with magnetic 4 Solder Lead free 7. Reliability and Test Condition Item Performance Operating Temperature - 25 ~ +120℃. Storage Temperature -40 ~ +85℃. - 5 to 40℃ for the product with taping. Test Method and Remarks Including self-generated heat Rated current Inductance (L) Within the specified tolerance DC Resistance LCR Meter: HP 4285A or equivalent, 100kHz, 1V DC Ohmmeter: HIOKI3227 or equivalent Temperature characteristics Inductance change：Within±20% Resistance to flexure substrate No damage. Measurement of inductance shall be taken at temperature rang within–25℃ to +85℃. With reference to inductance value at+20 ℃,change rate shall be calculated. Measurement of inductance shall be taken at temperature rang within–40℃ to +125℃. With reference to inductance value at+20 ℃,change rate shall be calculated. The test samples shall be soldered to the testing board by the reflow. As illustrated below, apply force in the direction of the arrow indicating until deflection of the test board reaches to 2mm. Substrate size：100x40x1.0 Substrate material：glass epoxy-resin Solder cream thickness：0.10 The test samples shall be soldered to the testing board and by the reflow. Adhesion of Terminal electrode Shall not come off PC board. Applied force：10 N to X and Y directions. Duration：5s Solder cream thickness：0.15 The test samples shall be soldered to the test board by the reflow. Then it shall be submitted to below test conditions. Frequency: 10-55Hz Total Amplitude: 1.5mm (May not exceed acceleration 196m/S2 ) Sweeping Method:10Hz to 55Hz to 10Hz for 1min. Time：2 hours each in X,Y, and Z Direction. Recovery: At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. Resistance to Vibration Inductance change：Within±10% No abnormality observed in appearance. Solderability The test samples shall be dipped in flux, and then immersed in molten solder as shown in below. Flux：methanol solution containing rosin 25% At least 90% of surface of terminal electrode is covered by new solder. Solder temperature: 245±5℃ Time: 5±1.0 sec. Immersion depth: All sides of mounting terminal shall be immersed. www.tai-tech.com.tw P5 TAI-TECH Item Performance Test Method and Remarks Test board thickness:1.0mm Test board material:glass epoxy resin THE Chip shall be stabilized normal condition for1~2hours befor measuring R e f lo w S o ld e r in g Resistance to soldering Inductance change：Within±10% No abnormality observed in appearance. P R E - H E A T IN G S O L D E R IN G 20~40s NATURAL C O O L IN G T P (2 6 0 ° C / 4 0 s m a x .) 217 60~150s 200 150 60~180s 480s m ax. 25 T IM E ( s e c .) The test samples shall be soldered to the test board by the reflow. The test samples shall be placed at specified temperature for specified time by step 1 to step 4 as shown below in sequence. The temperature cycles shall be repeated 100 cycles . Thermal shock Test Method and Remarks The test samples shall be soldered to the test board by the reflow. The test samples shall be placed in thermostatic oven set at specified temperature and humidity as shown in below. Temperature: 40±2℃ Humidity: 90~95%RH Time: 504±8 hrs. Damp heat life test Inductance change：Within±10% No abnormality observed in appearance. Loading under damp heat life test The test samples shall be soldered to the test board by the reflow. The test samples shall be placed in thermostatic oven set at specified temperature and humidity and applied the rated current continuously as shown in below. Temperature: 60±2℃ Humidity: 90~95%RH Applied current: Rated current Time: 500+24/-0 hrs Low temperature life test The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown in below. Temperature:-40±2℃ Time: 500±8 hrs. Loading at high temperature life test The test samples shall be soldered to the test board by the reflow. Temperature: 40±2℃. Applied current: Rated current Time: 500±8 hrs. . www.tai-tech.com.tw P6 TAI-TECH 8. Soldering 9. Packaging Information (1) Reel Dimension (2) Tape Dimension K0 COVER TAPE t 2.0±0.5 w B D B C A A P EMBOSSED CARRIER Type A(mm) B(mm) C(mm) D(mm) Type A(mm) HPC3015F 10±1.5 60±1.0 13±0.5 180±0.5 HPC3015F 3.2±0.1 B(mm) Ko(mm) P(mm) W(mm) 3.2±0.1 1.9±0.1 (3) Packaging Quantity Type Chip / Reel HPC3015F 2000 Application Notice ‧Storage Conditions To maintain the solderability of terminal electrodes: 1. TAI-TECH products meet IPC/JEDEC J-STD-020D standard-MSL, level 1. 2. Temperature and humidity conditions: Less than 40℃ and 60% RH. 3. Recommended products should be used within 12 months form the time of delivery. 4. The packaging material should be kept where no chlorine or sulfur exists in the air. ‧Transportation 1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized. www.tai-tech.com.tw 4.0±0.1 8.0±0.2 t(mm) 0.30±0.05