LS M670-J1K2-1-0-10-R18-Z-KS 数据手册
www.osram-os.com
Produktdatenblatt | Version 1.1
LS M670
LS M670
Mini TOPLED ®
Applications
——Cluster, Button Backlighting
——Interior Illumination (e.g. Ambient Map)
——Electronic Equipment
——White Goods
Features:
——Package: white SMT package, colorless clear resin
——Chip technology: GaAsP
——Typ. Radiation: 120° (Lambertian emitter)
——Color: λdom = 628 nm (● super red)
——Corrosion Robustness Class: 3B
——ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM)
Discontinued
1 Version 1.3 | 2019-07-15
LS M670
Ordering Information
Type
Luminous Intensity 1)
IF = 10 mA
Iv
LS M670-H2L1-1
3.55 ... 14.00 mcd
Discontinued
2 Version 1.3 | 2019-07-15
Ordering Code
Q65110A2383
LS M670
Maximum Ratings
Parameter
Symbol
Operating Temperature
Top
min.
max.
-40 °C
100 °C
Storage Temperature
Tstg
min.
max.
-40 °C
100 °C
Junction Temperature
Tj
max.
100 °C
Forward current
TS = 25 °C
IF
max.
30 mA
Surge Current
t ≤ 10 µs; D = 0.005 ; TS = 25 °C
IFS
max.
500 mA
Reverse voltage 2)
TS = 25 °C
VR
max.
12 V
ESD withstand voltage
acc. to ANSI/ESDA/JEDEC JS-001 (HBM)
VESD
Discontinued
3 Version 1.3 | 2019-07-15
Values
2 kV
LS M670
Characteristics
IF = 10 mA; TS = 25 °C
Parameter
Symbol
Peak Wavelength
λpeak
typ.
635 nm
Dominant Wavelength 3)
IF = 10 mA
λdom
min.
typ.
max.
622 nm
628 nm
634 nm
Spectral Bandwidth at 50% Irel,max
∆λ
typ.
45 nm
Viewing angle at 50% IV
2φ
typ.
120 °
Forward Voltage 4)
IF = 10 mA
VF
min.
typ.
max.
1.70 V
2.00 V
2.50 V
Reverse current 2)
VR = 12 V
IR
typ.
max.
0.01 µA
10 µA
Temperature Coefficient of Peak Wavelength
-10°C ≤ T ≤ 100°C
TCλpeak
typ.
0.11 nm / K
Temperature Coefficient of Dominant Wavelength
-10°C ≤ T ≤ 100°C
TCλdom
typ.
0.07 nm / K
Temperature Coefficient of Forward Voltage
-10°C ≤ T ≤ 100°C
TCVF
typ.
-1.9 mV / K
Real thermal resistance junction/ambient 5)6)
RthJA real
max.
480 K / W
Real thermal resistance junction/solderpoint 5)
RthJS real
max.
230 K / W
Discontinued
4 Version 1.3 | 2019-07-15
Values
LS M670
Brightness Groups
Group
Luminous Intensity 1)
IF = 10 mA
min.
Iv
Luminous Intensity. 1)
IF = 10 mA
max.
Iv
H2
3.55 mcd
4.50 mcd
12.10 mlm
J1
4.50 mcd
5.60 mcd
15.10 mlm
J2
5.60 mcd
7.10 mcd
19.00 mlm
K1
7.10 mcd
9.00 mcd
24.20 mlm
K2
9.00 mcd
11.20 mcd
30.30 mlm
L1
11.20 mcd
14.00 mcd
37.80 mlm
Group Name on Label
Example: H2-1
Brightness
Wavelength
H2
1
Discontinued
5 Version 1.3 | 2019-07-15
Luminous Flux 7)
IF = 10 mA
typ.
ΦV
LS M670
Relative Spectral Emission
7)
Irel = f (λ); IF = 10 mA; TS = 25 °C
OHL01697
100
%
I rel
80
Vλ
super-red
green
40
yellow
pure-green
orange
60
20
0
400
450
500
550
600
650
nm
700
λ
Radiation Characteristics
7)
Irel = f (ϕ); TS = 25 °C
40˚
30˚
20˚
10˚
0˚
ϕ
50˚
OHL01660
1.0
0.8
0.6
60˚
0.4
70˚
0.2
80˚
0
Discontinued
90˚
100˚
1.0
0.8
6 Version 1.3 | 2019-07-15
0.6
0.4
0˚
20˚
40˚
60˚
80˚
100˚
120˚
LS M670
Forward current
Relative Luminous Intensity
7), 8)
IF = f(VF); TS = 25 °C
Iv/Iv(10 mA) = f(IF); TS = 25 °C
OHL02145
10 2
IV
I F mA
OHL00993
101
I V (10 mA)
10 1
100
5
5
pure-green
10 0
10-1
5
10 -1
1.0
7), 8)
5
super-red
orange/yellow
green
1.4
1.8
2.2
2.6
3.0 V 3.4
VF
Discontinued
7 Version 1.3 | 2019-07-15
10-2 0
10
green
yellow
pure-green
super-red
orange
5
101
mA 102
IF
LS M670
Relative Luminous Intensity
7)
Iv,rel = f (TA); IF = 10
OHL02150
2.0
IV
I V (25 ˚C)
1.6
1.2
yellow
green
0.8
orange
super-red
pure-green
0.4
0.0
0
20
40
60
80 ˚C 100
Tj
Discontinued
8 Version 1.3 | 2019-07-15
LS M670
Max. Permissible Forward Current
IF = f(T)
OHL00231
40
IF
TS temp. solder point
TA temp. ambient
mA
30
TS
20
TA
10
0
0
20
40
60
80 C 100
T
Permissible Pulse Handling Capability
IF = f(tp); D: Duty cycle; TS = 25 °C
OHL01686
10 3
IF
D=
mA
tP
tP
T
T
D = 0.005
0.01
0.02
0.05
0.1
IF
10 2 0.2
5
0.5
Discontinued
DC
10 1 -5
10
10 -4
10 -3
10 -2
10 -1
10 0 s 10 1
tp
9 Version 1.3 | 2019-07-15
LS M670
Dimensional Drawing
9)
Further Information
Approximate Weight:
7.0 mg
Package marking:
Cathode
Corrosion test:
Class: 3B
Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter than IEC
60068-2-43)
Discontinued
10 Version 1.3 | 2019-07-15
LS M670
Recommended Solder Pad
9)
0.8 (0.031)
1 (0.039)
2.8 (0.110)
2.8 (0.110)
1 (0.039)
0.8 (0.031)
Padgeometrie
für verbesserte
Wärmeableitung
Paddesign
for improved
heat dissipation
Cu-Fläche > 16 mm 2
Cu-area > 16 mm 2
Lötstopplack
Solder resist
OHLPY978
For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not
suitable for ultra sonic cleaning.
Discontinued
11 Version 1.3 | 2019-07-15
LS M670
Reflow Soldering Profile
Product complies to MSL Level 2 acc. to JEDEC J-STD-020E
OHA04525
300
˚C
T 250
Tp 245 ˚C
240 ˚C
tP
217 ˚C
200
tL
150
tS
100
50
25 ˚C
0
0
50
100
150
200
250
s 300
t
Profile Feature
Symbol
Pb-Free (SnAgCu) Assembly
Minimum
Recommendation Maximum
Ramp-up rate to preheat*)
25 °C to 150 °C
tS
Time tS
TSmin to TSmax
Ramp-up rate to peak*)
TSmax to TP
Liquidus temperature
60
2
3
100
120
2
3
K/s
s
K/s
TL
217
Time above liquidus temperature
tL
80
100
s
Peak temperature
TP
245
260
°C
Time within 5 °C of the specified peak
temperature TP - 5 K
tP
20
30
3
6
Ramp-down rate*
TP to 100 °C
10
Time
25 °C to TP
Discontinued
Unit
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
12 Version 1.3 | 2019-07-15
°C
480
s
K/s
s
LS M670
Taping
9)
4 (0.157)
Cathode/Collector Side
2 (0.079)
1.55 (0.061)
4 (0.157)
Discontinued
13 Version 1.3 | 2019-07-15
2.35 (0.093)
8 (0.315)
1.75 (0.069)
3.5 (0.138)
1.5 (0.059)
OHAY0225
LS M670
Tape and Reel
10)
Reel Dimensions
A
180 mm
W
Nmin
8 + 0.3 / - 0.1 mm
Discontinued
14 Version 1.3 | 2019-07-15
W1
60 mm
W2 max
8.4 + 2 mm
14.4 mm
Pieces per PU
3000
LS M670
Barcode-Product-Label (BPL)
Dry Packing Process and Materials
9)
Moisture-sensitive label or print
L
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Barcode label
<
M
RA
OS
Humidity indicator
Barcode label
Please check the HIC immidiately after
bag opening.
Discard if circles overrun.
Avoid metal contact.
Do not eat.
Comparator
check dot
WET
If wet,
examine units, if necessary
bake units
15%
If wet,
examine units, if necessary
bake units
10%
5%
If wet,
parts still adequately dry.
change desiccant
Humidity Indicator
MIL-I-8835
Discontinued
Desiccant
AM
OSR
OHA00539
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
15 Version 1.3 | 2019-07-15
LS M670
Schematic Transportation Box
9)
Barcode label
N
O
:
(Q
)Q
TY
:2
00
0
(9
D
)
D
/C
:0
(X
)
Packing
Sealing label
Length
200 ± 5 mm
195 ± 5 mm
Discontinued
16 Version 1.3 | 2019-07-15
M
Y
DE
-1
+Q
-1
R
18
P
OHA02044
Dimensions of Transportation Box
Width
RO
UP
:
M
RA
OS
PR
O
D
5
14 2
110 0
G
4
01
4
C:
D/
(9
D)
20
00
(Q
)Q
TY
:
O
TC
P)
(6
T
LO
(1
T)
O
D
PR
D
EM
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18
R
-1
:
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+
P
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lt S
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P 7
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Bi n2 : Pn3 : Q 1: -1 20
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R:
Barcode label
Height
30 ± 5 mm
LS M670
Type Designation System
Wavelength
(λdom typ.)
B:
470 nm
S:
633 nm
T:
528 nm
Y:
587 nm
O:
606 nm
G:
570 nm
P:
560 nm
A:
617 nm
D:
460 nm
L:
Emission Color
blue
super red
true green
yellow
orange
green
pure green
amber
deep blue
Color coordinates according
CIE 1931/Emission color:
W:
white
CW: warm white
CB:
color on demand blue
CG:
color on demand green
CL:
color on demand lagune
Package Type
M:
MiniTOPLED
Light
emitting
diode
A
L
M
6
Lead / Package Properties
4: through hole
6: folded leads
T: folded leads, improved corrosion stability
(Au-LF), w/o TiO2 jetting
V: folded leads and UX:3 w/ improved corrosion
stability (Au-LF), TiO2 jetting
Encapsulant Type / Lens Properties
7:
S:
Colorless clear or white volume conversion
(resin encapsulation)
Silicone (with or without diffuser)
Discontinued
Chip Technology:
3:
standard InGaN
5:
HOP 2000
6:
Standard InGalP
B:
HOP 2000
C:
ATON
F:
Thinfilm InGaAlP
ThinGaN (Thinfilm InGaN)
G:
(Subcon: Sapphire)
K:
InGaAlP low current
S:
standard InGaN low current
1:
individual definition
0:
TSN
17 Version 1.3 | 2019-07-15
7
6
LS M670
Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this
data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the
eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light
sources have a high secondary exposure potential due to their blinding effect. When looking at bright light
sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this device contain, in addition to other substances, metal filled materials including silver.
Metal filled materials can be affected by environments that contain traces of aggressive substances. Therefore, we recommend that customers minimize device exposure to aggressive substances during storage,
production, and use. Devices that showed visible discoloration when tested using the described tests above
did show no performance deviations within failure limits during the stated test duration. Respective failure
limits are described in the IEC60810.
For further application related information please visit www.osram-os.com/appnotes
Discontinued
18 Version 1.3 | 2019-07-15
LS M670
Disclaimer
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version on the OSRAM OS website.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of
transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we
shall have to invoice you for any costs incurred.
Product and functional safety devices/applications or medical devices/applications
OSRAM OS components are not developed, constructed or tested for the application as safety relevant
component or for the application in medical devices.
OSRAM OS products are not qualified at module and system level for such application.
In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety
devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales
partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordinate the customer-specific request between OSRAM OS and buyer and/or customer.
Discontinued
19 Version 1.3 | 2019-07-15
LS M670
Glossary
1)
Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal
reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of
k = 3).
2)
Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse operation is not allowed.
3)
Wavelength: The wavelength is measured at a current pulse of typically 25 ms, with an internal reproducibility of ±0.5 nm and an expanded uncertainty of ±1 nm (acc. to GUM with a coverage factor of k =
3).
4)
Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an
internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage
factor of k = 3).
5)
Thermal Resistance: Rth max is based on statistic values (6σ).
6)
Thermal Resistance: RthJA results from mounting on PC board FR 4 (pad size 16 mm² per pad)
7)
Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devices, the typical data or calculated correlations of technical parameters can only reflect statistical figures.
These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g.
because of technical improvements, these typ. data will be changed without any further notice.
8)
Characteristic curve: In the range where the line of the graph is broken, you must expect higher differences between single devices within one packing unit.
9)
Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and
dimensions are specified in mm.
10)
Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.
Discontinued
20 Version 1.3 | 2019-07-15
LS M670
Revision History
Version
Date
Change
1.3
2019-07-15
Discontinued
Discontinued
21 Version 1.3 | 2019-07-15
LS M670
Discontinued
Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.
22 Version 1.3 | 2019-07-15