SFH 4141-TU

www.osram-os.com Produktdatenblatt | Version 1.1 SFH 4141   SFH 4141 Radial Mini Sidelooker Infrared Emitter (940 nm) in Mini Sidelooker Package Applications ——Electronic Equipment ——Industrial Automation (Machine Controls, Light Barriers, Vision Controls) Features: ——Package: clear epoxy ——ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) ——Wavelength 950nm ——Narrow half angle (± 9°) ——Short switching times ——Small outline dimensions ——Same package as phototransistor SFH 3100 F ——High coupling factor in light barriers with SFH 3100 F  Ordering Information  Type Radiant intensity  1) IF = 20 mA; tp = 20 ms Ie 16 ... 80 mW/sr Discontinued SFH 4141 1 Version 1.3 | 2019-07-16 Radiant intensity 1) typ. IF = 20 mA; tp = 20 ms Ie 35 mW/sr Ordering Code Q65111A6138 SFH 4141   Maximum Ratings TA = 25 °C Parameter Symbol Operating temperature Top min. max. -40 °C 85 °C Storage temperature Tstg min. max. -40 °C 85 °C Forward current IF max. 60 mA Surge current tp ≤ 100 µs; D = 0  IFSM max. 1A Reverse voltage 2) VR max. 5V Power consumption Ptot max. 100 mW ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) VESD max. 2 kV Discontinued  2 Version 1.3 | 2019-07-16 Values SFH 4141   Characteristics IF = 20 mA; tp = 20 ms; TA = 25 °C Parameter Symbol Peak wavelength λpeak typ. 950 nm Centroid wavelength λcentroid typ. 940 nm Spectral bandwidth at 50% Irel,max (FWHM) ∆λ typ. 42 nm Half angle φ typ. 9° Dimensions of active chip area LxW typ. 0.3 x 0.3 mm x mm Rise time (10% / 90%) IF = 20 mA; RL = 50 Ω tr typ. 12 ns Fall time (10% / 90%) IF = 20 mA; RL = 50 Ω tf typ. 12 ns Forward voltage VF typ. max. 1.3 V 1.6 V Forward voltage IF = 1 A; tp = 100 µs VF typ. max. 3.6 V 4.6 V Reverse current 2) VR = 5 V IR max. 10 µA Radiant intensity 1) IF = 1 A; tp = 100 µs Ie typ. 770 mW/sr Total radiant flux 3) Φe typ. 12 mW Temperature coefficient of voltage TCV typ. -0.8 mV / K Temperature coefficient of brightness TCI typ. -0.3 % / K Temperature coefficient of wavelength TCλ typ. 0.3 nm / K Thermal resistance junction solder point real 4) RthJS max. 200 K / W Thermal resistance junction ambient real 5) RthJA max. 350 K / W Discontinued  3 Version 1.3 | 2019-07-16 Values SFH 4141   Brightness Groups  TA = 25 °C Group Radiant intensity IF = 20 mA; tp = 20 ms min. Ie Radiant intensity IF = 20 mA; tp = 20 ms max. Ie S 16 mW/sr 32 mW/sr T 25 mW/sr 50 mW/sr U 40 mW/sr 80 mW/sr Only one group in one packing unit (variation lower 2:1). Relative Spectral Emission 6), 7) Ie,rel = f (λ); IF = 20 mA; tp = 20 ms OHF04134 100 I rel %  80 60 40 20 Discontinued 0 800 850 900 950 nm 1025 λ 4 Version 1.3 | 2019-07-16 SFH 4141   Radiation Characteristics 6), 7) Ie,rel = f (φ) 40˚ 30˚ 20˚ 10˚ ϕ 0˚ OHF05672 1.0 50˚ 0.8 60˚ 0.6 70˚ 0.4 80˚ 0.2 0 90˚ 100˚ 1.0 0.8 Forward current 0.6 0˚ 20˚ 40˚ 60˚ 80˚ 100˚ Relative Radiant Intensity 6), 7) IF = f (VF); single pulse; tp = 100 µs IF 0.4 6), 7) Ie/Ie(20mA) = f (IF); single pulse; tp = 100 µs OHF05642 103 mA 120˚ OHF05669 102 Ιe Ι e (20 mA)  102 101 100 101 10-1 Discontinued 100 0 1 2 3 V 4 VF 5 Version 1.3 | 2019-07-16 10-2 0 10 101 102 mA 103 IF SFH 4141   Max. Permissible Forward Current Permissible Pulse Handling Capability IF,max = f (TA); Rthja = 350K / W; single pulse IF = f (tp); duty cycle D = parameter; TA = 25°C IF OHF05670 70 mA IF 60 1.1 A 0.9 0.8 50 0.7 40 0.6 0.5 30 0.4 20 OHF05671 t D = TP tP IF T D= 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1 0.3 0.2 10 0.1 0 0 20 40 60 80 ˚C 100 TA Discontinued  6 Version 1.3 | 2019-07-16 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 tp SFH 4141   Approximate Weight: 0.2 g Package marking: Cathode Discontinued 7 Version 1.3 | 2019-07-16 2.2 (0.087) 2.0 (0.079) 3.9 (0.154) 0.84 (0.033) 0.64 (0.025) 4.1 (0.161) 0.84 (0.033) 3.0 (0.118) 2.8 (0.110) 1.04 (0.041) 0.84 (0.033) 17.77 (0.700) 17.27 (0.680) Further Information  0.5 (0.020) x 45˚ 1.04 (0.041) 0.9 (0.035) 0.7 (0.028) 0.3 (0.012) 16.5 (0.650) 16.0 (0.630) 60˚ 0.5 (0.020) 1.42 (0.056) 1.22 (0.048) 0.6 (0.024) 0.4 (0.016) 2.54 (0.100) Emitter/ Cathode 3.1 (0.122) 2.9 (0.114) 8) R 0.9 (0.035) R 0.7 (0.028) Dimensional Drawing 1.6 (0.063) 1.4 (0.055) 1.3 (0.051) 1.1 (0.043) GEOY6976 SFH 4141   Recommended Solder Pad Pad 1: cathode Discontinued  8 Version 1.3 | 2019-07-16 8) SFH 4141   TTW Soldering IEC-61760-1 TTW OHA04645 300 10 s max., max. contact time 5 s per wave ˚C T 250 235 ˚C - 260 ˚C First wave Second wave Continuous line: typical process Dotted line: process limits ∆T < 150 K 200 Cooling Preheating ca. 3.5 K/s typical 150 ca. 2 K/s 130 ˚C 120 ˚C 100 ˚C 100 ca. 5 K/s Typical 50 0 0 20 40 60 80 100 120 140 160 180 200 220 s 240 t Discontinued  9 Version 1.3 | 2019-07-16 SFH 4141   Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoyance, visual impairment, and even accidents, depending on the situation. Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. Therefore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810. For further application related information please visit www.osram-os.com/appnotes Discontinued  10 Version 1.3 | 2019-07-16 SFH 4141   Disclaimer Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on the OSRAM OS website. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product and functional safety devices/applications or medical devices/applications OSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. OSRAM OS products are not qualified at module and system level for such application. In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordinate the customer-specific request between OSRAM OS and buyer and/or customer. Discontinued  11 Version 1.3 | 2019-07-16 SFH 4141   Glossary 1) Radiant intensity: Measured at a solid angle of Ω = 0.01 sr 2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse operation is not allowed. 3) Total radiant flux: Measured with integrating sphere. 4) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g. metal block) 5) Thermal resistance: junction ‐ ambient, mounted on PC‐board (FR4), padsize 16 mm² each 6) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devices, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 7) Testing temperature: TA = 25°C (unless otherwise specified) 8) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm. Discontinued  12 Version 1.3 | 2019-07-16 SFH 4141   Revision History Version Date Change 1.3 2019-07-15 Discontinued 1.3 2019-07-16 Discontinued Discontinued  13 Version 1.3 | 2019-07-16 SFH 4141   Discontinued  Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved. 14 Version 1.3 | 2019-07-16