DATA SHEET
POSITIVE TEMPERATURE COEFFICIENT
AC/DC POWER SUPPLY
SMD1206 series
Product specification– July 10, 2023 V.4
RoHS compliant & Halogen free
Circuit Protection
POSITIVE TEMPERATURE COEFFICIENT
Product Specification
2
11
SMD1206
Positive Temperature Coefficient (PTC) Data Sheet
Description
The 1206 series provides miniature surface mount resettable overcurrent protection
with holding current from 0.05A to 2.0A. This series is suitable for wide range of
applications in modern electronics where space is limited.
Features
■ RoHS compliant and lead-free
■ Fast response to fault current
■ UL/CUL/ TUV/ RoHS/Halogen Free
■ Low profile
■ Compatible with high temperature solders
■ Compact design saves board space
Applications
■ USB hubs, ports and peripherals
■ Set-top-box and HDMI
■ Game console port protection
■ Motherboard USB & IEEE 1394 protection
■ Optical disk drives
■ General electronics
Part Number Code and Marking
SMD 1206 B
TF T /
Special Voltage Rating (Optional)
Thickness Version (Optional)
Lead-Free
Holding Current Rating
Delimiter
Device Dimensions: Length/Width (Unit: 1/100 inch)
Surface Mount Device
Part Number
Marking
Part Number
Marking
Part Number
Marking
SMD1206B005TF
-
SMD1206B025TF/24
02
SMD1206B075TF/16
71
SMD1206B010TF
0
SMD1206B035TF/16
03
SMD1206B110TFT
C
SMD1206B012TF
1
SMD1206B035TF/30
33
SMD1206B110TF/16
1C
SMD1206B012TF/48
12
SMD1206B050TF
05
SMD1206B150TFT
15
SMD1206B016TF
01
SMD1206B050TF/15
5
SMD1206B175TF
17
SMD1206B020TF/24
2
SMD1206B050TF/24
52
SMD1206B200TF
20
SMD1206B020TF/30
23
SMD1206B075TFT
07
SMD1206B025TF
02
SMD1206B075TF/13.2
07
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Jul. 10, 2023 V.4
Circuit Protection
POSITIVE TEMPERATURE COEFFICIENT
Product Specification
3
11
SMD1206
Dimensions and PAD-SIZE
C
A
BK Logo
B
Part identification
D
A
E
B
C
D
E
Part
Number
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
SMD1206B005TF
3.00
3.40
1.50
1.80
0.70
1.20
0.25
0.75
0.05
0.45
SMD1206B010TF
3.00
3.40
1.50
1.80
0.65
1.15
0.25
0.75
0.05
0.45
SMD1206B012TF
3.00
3.40
1.50
1.80
0.65
1.15
0.25
0.75
0.05
0.45
SMD1206B012TF/48
3.00
3.40
1.50
1.80
0.45
0.95
0.25
0.75
0.05
0.45
SMD1206B016TF
3.00
3.40
1.50
1.80
0.65
1.15
0.25
0.75
0.05
0.45
SMD1206B020TF/24
3.00
3.40
1.50
1.80
0.50
1.00
0.25
0.75
0.05
0.45
SMD1206B020TF/30
3.00
3.40
1.50
1.80
0.35
0.85
0.25
0.75
0.05
0.45
SMD1206B025TF
3.00
3.40
1.50
1.80
0.50
1.00
0.25
0.75
0.05
0.45
SMD1206B025TF/24
3.00
3.40
1.50
1.80
0.50
1.00
0.25
0.75
0.05
0.45
SMD1206B035TF/16
3.00
3.40
1.50
1.80
0.45
0.95
0.25
0.75
0.05
0.45
SMD1206B035TF/30
3.00
3.40
1.50
1.80
0.70
1.20
0.25
0.75
0.05
0.45
SMD1206B050TF
3.00
3.40
1.50
1.80
0.45
0.95
0.25
0.75
0.05
0.45
SMD1206B050TF/15
3.00
3.40
1.50
1.80
0.65
1.15
0.25
0.75
0.05
0.45
SMD1206B050TF/24
3.00
3.40
1.50
1.80
0.70
1.20
0.25
0.75
0.05
0.45
SMD1206B075TFT
3.00
3.40
1.50
1.80
0.55
1.05
0.25
0.75
0.05
0.45
SMD1206B075TF/13.2
3.00
3.40
1.50
1.80
0.90
1.70
0.25
0.75
0.05
0.45
SMD1206B075TF/16
3.00
3.40
1.50
1.80
0.90
1.70
0.25
0.75
0.05
0.45
SMD1206B110TFT
3.00
3.40
1.50
1.80
0.55
1.05
0.25
0.75
0.05
0.45
SMD1206B110TFT/16
3.00
3.40
1.50
1.80
0.60
1.40
0.25
0.75
0.05
0.45
SMD1206B150TFT
3.00
3.40
1.50
1.80
0.85
1.65
0.25
0.75
0.05
0.45
SMD1206B175TF
3.00
3.40
1.50
1.80
0.85
1.65
0.25
0.75
0.05
0.45
SMD1206B200TF
3.00
3.40
1.50
1.80
0.85
1.65
0.25
0.75
0.05
0.45
Recommended Pad Layout (mm)
1.80typ.
1.80typ.
1.00typ.
1.00typ.
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Jul. 10, 2023 V.4
Circuit Protection
POSITIVE TEMPERATURE COEFFICIENT
Product Specification
4
11
SMD1206
Electrical Characteristics
Part
Number
Ihold
(A)
Itrip
(A)
Vmax
(Vdc)
Imax
(A)
Pd typ.
(W)
SMD1206B005TF
0.05
0.15
30.0
100
SMD1206B010TF
0.10
0.27
30.0
SMD1206B012TF
0.12
0.29
SMD1206B012TF/48
0.125
SMD1206B016TF
Maximum
Time To Trip
Resistance
Time
(Sec.)
Current
(A)
Rmin
(Ω)
R1max
(Ω)
0.6
0.25
1.5
3.60
50.0
100
0.6
0.20
1.5
1.50
15.0
30.0
100
0.6
0.20
1.0
1.50
6.0
0.29
48.0
10
0.6
0.20
1.0
1.50
6.0
0.16
0.37
30.0
100
0.6
0.30
1.0
1.20
4.50
SMD1206B020TF/24
0.20
0.42
24.0
100
0.6
0.10
8.0
0.65
2.60
SMD1206B020TF/30
0.20
0.42
30.0
100
0.6
0.10
8.0
0.65
2.60
SMD1206B025TF
0.25
0.50
16.0
100
0.6
0.08
8.0
0.55
2.30
SMD1206B025TF/24
0.25
0.55
24.0
100
0.6
0.08
8.0
0.55
2.30
SMD1206B035TF/16
0.35
0.75
16.0
100
0.6
0.10
8.0
0.30
1.20
SMD1206B035TF/30
0.35
0.75
30.0
100
0.6
0.10
8.0
0.30
1.20
SMD1206B050TF
0.50
1.0
6.0
100
0.6
0.10
8.0
0.15
0.70
SMD1206B050TF/15
0.50
1.0
15.0
100
0.6
0.10
8.0
0.15
0.75
SMD1206B050TF/24
0.50
1.0
24.0
100
0.6
0.10
8.0
0.15
0.75
SMD1206B075TFT
0.75
1.50
8.0
100
0.6
0.20
8.0
0.09
0.35
SMD1206B075TF/13.2
0.75
1.50
13.2
100
0.6
0.20
8.0
0.09
0.35
SMD1206B075TF/16
0.75
1.50
16.0
100
0.6
0.20
8.0
0.09
0.35
SMD1206B110TFT
1.10
2.20
8.0
100
0.8
0.10
8.0
0.04
0.21
SMD1206B110TF/16
1.10
2.20
16.0
100
0.8
0.10
8.0
0.06
0.21
SMD1206B150TFT
1.50
3.00
8.0
100
0.8
0.30
8.0
0.03
0.12
SMD1206B175TF
1.75
3.50
6.0
100
0.8
0.50
8.0
0.02
0.09
SMD1206B200TF
2.00
3.50
6.0
100
0.8
1.50
8.0
0.018
0.08
Note on Electrical Characteristics
■ Vocabulary
·Ihold = Hold current: maximum current device will pass without tripping in 23℃ still air.
·Itrip = Trip current: minimum current at which the device will trip in 23℃ still air.
·Vmax = Maximum voltage device can withstand without damage at rated current (Imax)
·Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax)
·Pd typ. = Typical power dissipated from device when in the tripped state at 23℃ still air.
·Rmin = Minimum resistance of device in initial (un-soldered) state.
·R1max = Maximum resistance of device at 23℃ measured one hour after tripping or reflow soldering of 260℃ for 20 sec.
■ Value specified is determined by using the PWB with 0.090”*1.5oz copper traces.
■ Caution: Operation beyond the specified rating may result in damage and possible arcing and flame.
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Jul. 10, 2023 V.4
Circuit Protection
POSITIVE TEMPERATURE COEFFICIENT
Product Specification
SMD1206
5
11
Polymeric PTC Selecting Guide
■ Determine the following operating parameters for the circuits:
·Normal operating current (Ihold)
·Maximum interrupt current (Imax)
·Maximum circuit voltage (Vmax)
·Normal operating temperature surrounding device (min℃/max℃)
■ Select the device from factor and dimension suitable for the application
■ Compare the maximum rating for Vmax and Imax of the PPTC device with the circuit in application and make sure
the circuit’s requirement does not exceed the device rating.
■ Check that PPTC device’s trip time (time-to-trip) will protect the circuit.
■ Verify that the circuit operating temperature is within the PPTC device’s normal operating temperature range.
■ Verify that performance and suitability of the chosen PPTC device in the application.
! WARNING
■ Mechanical Stress
·PPTC devices will undergo a thermal expansion during fault condition. If PPTC devices are installed or placed in an application
where the space between PPTC devices and the surrounding materials (e.g., covering materials, packaging materials, encapsulate
materials and the like) is insufficient, it will cause an inhibiting effect upon the thermal expansion. Pressing, twisting, bending and
other kinds of mechanical stress will also adversely affect the performance of the PPTC devices, and shall not be used or applied.
■ Chemical Pollutants
·Silicone-based oils, oils, solvents, gels, electrolytes, fuels, acids, and the like will adversely affect the properties of PPTC devices,
and shall not be used or applied.
■ Electronic and Thermal Effect
·PPTC devices are secondary protection devices and are used solely for sporadic, accidental over-current or over-temperature
error condition, and shall NOT be used if or when constant or repeated fault conditions (such fault conditions may be caused by,
among others, incorrect pin-connection of a connector) or over-extensive trip events may occur.
·PPTC devices are different from fuses and, when a fault condition occurs, will go into high-resistance state and do not open
circuit, in which case the voltage at such PPTC devices may reach a hazardous level.
·Operation over the maximum rating or other forms of improper use may cause failure, arcing, flame and/or other damage to
the PPTC devices.
·Conductive material contamination, such as metal particle, may induce shortage, flame or arcing.
·Due to the inductance, the operation circuits may generate a circuit voltage (Ldi/dt) above the rated voltage of PPTC devices,
which shall not be used under such circumstances.
■ General
·Customers shall evaluate and test the properties of PPTC devices independently to verify and ensure that their individual
applications will be met.
·The performance of PPTC devices will be adversely affected if they are improperly used under electronic, thermal and/or
mechanical procedures and/or conditions non-conformant to those recommended by manufacturer.
·Customers shall be responsible for determining whether it is necessary to have back-up, failsafe and/or fool-proof protection
To avoid or minimize damage that may result from extra-ordinary, irregular function or failure of PPTC devices.
·Any and all responsibilities and liabilities are disclaimed if any item under this notice of warning is not complied with.
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Jul. 10, 2023 V.4
Circuit Protection
POSITIVE TEMPERATURE COEFFICIENT
Product Specification
6
11
SMD1206
Thermal Derating Curve
Percentage of Rated Current
200.00
150.00
100.00
50.00
0.00
-40.00
0.00
40.00
80.00
120.00
Device Ambient Temperature (℃)
Thermal Derating Chart
Recommended Hold Current (A) at Ambient Temperature (℃)
Ambient Operation Temperature
Part
Number
-40℃
-20℃
0℃
23℃
40℃
50℃
60℃
70℃
85℃
SMD1206B005TF
0.074
0.066
0.058
0.050
0.043
0.038
0.035
0.030
0.028
SMD1206B010TF
0.180
0.160
0.140
0.100
0.100
0.090
0.080
0.070
0.050
SMD1206B012TF
0.180
0.160
0.140
0.125
0.100
0.090
0.080
0.070
0.050
SMD1206B012TF/48
0.180
0.160
0.140
0.125
0.100
0.090
0.080
0.070
0.050
SMD1206B016TF
0.220
0.200
0.180
0.160
0.140
0.120
0.100
0.090
0.080
SMD1206B020TF/24
0.280
0.250
0.230
0.200
0.170
0.150
0.140
0.120
0.090
SMD1206B020TF/30
0.280
0.250
0.230
0.200
0.170
0.150
0.140
0.120
0.090
SMD1206B025TF
0.370
0.330
0.290
0.250
0.220
0.200
0.170
0.150
0.120
SMD1206B025TF/24
0.370
0.330
0.290
0.250
0.220
0.200
0.170
0.150
0.120
SMD1206B035TF/16
0.500
0.450
0.400
0.350
0.300
0.270
0.240
0.210
0.150
SMD1206B035TF/30
0.50
0.45
0.40
0.35
0.30
0.27
0.24
0.21
0.15
SMD1206B050TF
0.710
0.640
0.570
0.500
0.420
0.390
0.350
0.310
0.250
SMD1206B050TF/15
0.710
0.640
0.570
0.500
0.420
0.390
0.350
0.310
0.250
SMD1206B050TF/24
0.710
0.640
0.570
0.500
0.420
0.390
0.350
0.310
0.250
SMD1206B075TFT
1.140
1.010
0.880
0.750
0.650
0.590
0.540
0.490
0.410
SMD1206B075TF/13.2
1.140
1.010
0.880
0.750
0.650
0.590
0.540
0.490
0.410
SMD1206B075TF/16
1.140
1.010
0.880
0.750
0.650
0.590
0.540
0.490
0.410
SMD1206B110TFT
1.640
1.460
1.300
1.100
0.920
0.830
0.800
0.650
0.520
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Jul. 10, 2023 V.4
Circuit Protection
POSITIVE TEMPERATURE COEFFICIENT
Product Specification
7
11
SMD1206
Ambient Operation Temperature
Part
Number
-40℃
-20℃
0℃
23℃
40℃
50℃
60℃
70℃
85℃
SMD1206B110TF/16
1.640
1.460
1.300
1.100
0.920
0.830
0.800
0.650
0.520
SMD1206B150TFT
2.200
1.990
1.770
1.500
1.340
1.230
1.100
1.010
0.840
SMD1206B175TF
2.500
2.250
2.000
1.750
1.550
1.450
1.350
1.250
1.100
SMD1206B200TF
2.600
2.440
2.350
2.000
1.780
1.670
1.500
1.450
1.200
Average Time-Current Curve
100
C
A
Time to Trip (s)
10
B
D E
A-SMD1206B005TF
SMD1206B005TF/30
F
B-SMD1206B010TF
SMD1206B010TF/30
C-SMD1206B012TF
SMD1206B012TF/48
1
D-SMD1206B016TF
E-SMD1206B020TF/24
SMD1206B020TF/30
0.1
F-SMD1206B025TF
SMD1206B025TF/24
0.01
1
0.1
10
Fault Current (A)
100
A
A-SMD1206B035TF/16
B
Time to Trip (s)
SMD1206B035TF/30
H
10
B-SMD1206B050TF
FG
CD
SMD1206B050TF/15
E
SMD1206B050TF/24
1
C-SMD1206B075TFT
D-SMD1206B075TF/13.2
SMD1206B075TF/16
E-SMD1206B110TFT
0.1
SMD1206B110TF/16
F-SMD1206B150TFT
G-SMD1206B175TF
0.01
H-SMD1206B200TF
0.1
1
10
Fault Current (A)
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Jul. 10, 2023 V.4
Circuit Protection
POSITIVE TEMPERATURE COEFFICIENT
Product Specification
8
11
SMD1206
Soldering Parameters
Critical Zone
TL to TP
tP
TP
Ramp-up
TL
tL
Temperature
TS max
TS min
Ramp-down
tS
Preheat
25
t 25℃ to Peak
Time
Profile Feature
Pb-Free Assembly
Average ramp-up rate (TS max to TP)
3℃/second max.
Preheat
-Temperature Min (TS min)
-Temperature Max (TS max)
-Time (min to max) (TS min to TS max)
150℃
200℃
60-180 seconds
Time maintained above:
-Temperature (TL)
-Time (tL)
217℃
60-150 seconds
Peak Temperature (TP)
260℃
Time within 5℃ of actual Peak Temperature (tP)
Ramp-down Rate
Time 25℃ to Peak Temperature
Storage Condition
20-40 seconds
6℃/second max.
8 minutes max.
0℃~35℃, ≤70%RH
·Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free
·Recommended maximum paste thickness is 0.25mm (0.010 inch)
·Device can be cleaned using standard industry methods and solvents.
Note 1: All temperature refer to topside of the package, measured on the package body surface.
Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance
requirements.
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Jul. 10, 2023 V.4
Circuit Protection
POSITIVE TEMPERATURE COEFFICIENT
Product Specification
9
11
SMD1206
Environmental Specifications
Operating / Storage temperature
-40℃ to +85℃
Maximum Device Surface Temperature in Tripped State
125℃
Passive Aging
+85℃, 1000 hours
±50% typical resistance change
Humidity Aging
+85℃, 85%RH, 1000 hours
±50% typical resistance change
Thermal Shock
MIL-STD-202, Method 107G
+85℃/-40℃ 20 times
-50% typical resistance change
Solvent Resistance
MIL-STD-202, Method 215
No change
Vibration
MIL-STD-883C, Method 2007.1, Condition A
No change
Moisture Level Sensitivity
Level 1, J-STD-020C
Physical Specifications
Terminal Material
Solder-Plated Copper (Solder Material: Matte Tin (Sn))
Terminal Solderability
Meets EIA Specification RS186-9E, ANSI/J-STD-002 Category 3.
Packaging
Part Number
Quantity
Part Number
Quantity
Part Number
Quantity
SMD1206B005TF
3000
SMD1206B025TF/24
4000
SMD1206B075TF/16
2000
SMD1206B010TF
4000
SMD1206B035TF/16
4000
SMD1206B110TFT
4000
SMD1206B012TF
4000
SMD1206B035TF/30
3000
SMD1206B110TF/16
3000
SMD1206B012TF/48
4000
SMD1206B050TF
4000
SMD1206B150TFT
2000
SMD1206B016TF
4000
SMD1206B050TF/15
3000
SMD1206B175TF
2000
SMD1206B020TF/24
4000
SMD1206B050TF/24
3000
SMD1206B200TF
2000
SMD1206B020TF/30
4000
SMD1206B075TFT
4000
SMD1206B025TF
4000
SMD1206B075TF/13.2
2000
◎ 8mm tape on 7 inch reel per EIA-481 (equivalent to IEC286, part 3)
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Jul. 10, 2023 V.4
Circuit Protection
POSITIVE TEMPERATURE COEFFICIENT
Product Specification
10
11
SMD1206
Tape
Dimensions (mm)
Symbol
B010TF, B012TF
B005TF
B075TF/13.2
B012TF/48,B016TF
B035TF/30
B075TF/16
B020TF/24, B020TF/30
B050TF/15
B150TFT
B025TF, B025TF/24
B050TF/24
B175TF
B035TF/16,B050TF
B110TF/16
B200TF
B075TFT
B110TFT
P2
P1
D0
T
W
8.00±0.30
8.00±0.30
8.00±0.30
F
3.50±0.05
3.50±0.05
3.50±0.05
E
1.75±0.10
1.75±0.10
1.75±0.10
D0
1.55±0.05
1.55±0.05
1.55±0.05
D1
1.00±0.10
1.00±0.10
1.00±0.10
P0
4.00±0.10
4.00±0.10
4.00±0.10
P1
4.00±0.10
4.00±0.10
4.00±0.10
P2
2.00±0.05
2.00±0.05
2.00±0.05
A0
1.95±0.10
1.92±0.10
1.95±0.10
B0
3.65±0.10
3.65±0.10
3.65±0.10
T
0.20±0.10
0.25±0.10
0.25±0.10
K0
0.87±0.10
1.30±0.10
1.70±0.10
Leader min.
390
390
390
Trailer min.
160
160
160
B0
D1
W
F
E
P0
K0
A0
Reel
C
Φ178.0±1.0
D
Φ60.2±0.5
H
11.0±0.5
W
9.0±1.5
www.yageo.com
Jul. 10, 2023 V.4
Product specification
Circuit Protection Components
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Please contact YAGEO for the applications listed below which require especially high reliability for the
prevention of defects which might directly cause damage to the third party's life, body or property: Aerospace
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