P2
TAI-TECH
SMD Power Inductor
TMPF(V)-Series(N)-ABD
1. Features
1. Low loss realized with low DCR.
2. High performance realized by metal dust core.
Halogen
3. Ultra low buzz noise, due to composite construction.
4. 100% Lead(Pb)-Free and RoHS compliant.
Halogen-free
5. High reliability -Reliability test complied to AEC-Q200.
2. Applications
Automotive applications.
3. Dimension
E
E
1R2
1R2
2037
2303
Series
H
L
F
E
B
D
C
G
A
Recommend PC Board Pattern
A(mm)
B(mm)
C(mm)
D(mm)
E(mm)
F(mm)
L(mm)
G(mm)
H(mm)
TMPF0402AV**-ABD
4.4±0.2
4.4±0.2
1.9±0.2
3.4±0.3
0.88±0.2
1.6±0.25
3.4 ref
1.4 ref
3.8 ref
TMPF0402LRV**-ABD
4.4±0.2
4.4±0.2
1.9±0.2
3.4±0.3
0.88±0.2
1.6±0.25
3.4 ref
1.4 ref
3.8 ref
1.4 ref
3.8 ref
TMPF0403AV**-ABD
4.4±0.2
4.4±0.2
2.8±0.2
3.4±0.3
0.88±0.2
1.6±0.25
3.4 ref
TMPF0403LRV**-ABD
4.4±0.2
4.4±0.2
2.8±0.2
3.4±0.3
0.88±0.2
1.6±0.25
3.4 ref
1.4 ref
3.8 ref
TMPF0502AV**-ABD
6.0±0.2
5.7±0.2
1.9±0.2
4.3±0.3
1.1±0.2
2.3±0.25
4.5 ref
2.0 ref
4.7 ref
TMPF0503AV**-ABD
6.0±0.2
5.7±0.2
2.9±0.2
4.3±0.3
1.1±0.2
2.3±0.25
4.5 ref
2.0 ref
4.7 ref
TMPF0505LRV**-ABD
6.0±0.2
5.7±0.2
4.8±0.2
4.3±0.3
1.1±0.2
2.3±0.25
4.5 ref
2.0 ref
4.7 ref
TMPF0603AV**-ABD
7.2±0.2
6.9±0.2
See Spec
See Spec
1.4±0.2
2.6±0.25
5.6 ref
2.5 ref
5.6 ref
TMPF0604AV**-ABD
7.2±0.2
6.9±0.2
3.8±0.2
See Spec
1.4±0.2
2.6±0.25
5.6 ref
2.5 ref
5.6 ref
2.5 ref
5.6 ref
TMPF0605AV**-ABD
7.2±0.2
6.9±0.2
4.8±0.2
See Spec
1.4±0.2
2.6±0.25
5.6 ref
TMPF0606AV**-ABD
7.2±0.2
6.9±0.2
5.8±0.2
5.3±0.3
1.4±0.2
2.6±0.25
5.6 ref
2.5 ref
5.6 ref
2.5 ref
5.6 ref
TMPF0606LRV**-ABD
7.2±0.2
6.9±0.2
5.8±0.2
5.3±0.3
1.4±0.2
2.6±0.25
5.6 ref
TMPF0702AV**-ABD
8.4±0.3
8.0±0.3
1.85±0.2
See Spec
1.75±0.2
3.15±0.25
7.4 ref
2.8 ref
7.2 ref
2.8 ref
7.2 ref
TMPF0703AV**-ABD
8.4±0.3
8.0±0.3
2.9±0.2
See Spec
1.75±0.2
3.15±0.25
7.4 ref
TMPF0705AV**-ABD
8.4±0.3
8.0±0.3
4.8±0.2
See Spec
1.75±0.2
3.15±0.25
7.4 ref
2.8 ref
7.2 ref
7.8 ref
2.8 ref
6.7 ref
TMPF0707AV**-ABD
8.4±0.3
8.0±0.3
6.7±0.3
See Spec
1.75±0.2
3.15±0.25
TMPF0808AV**-ABD
8.9±0.3
8.5±0.3
7.7±0.3
See Spec
1.8±0.2
3.5±0.3
8.0 ref
2.7 ref
7.8 ref
3.7ref
11.0 ref
TMPF1006AV**-ABD
11.9±0.3
11.0±0.3
5.7±0.3
See Spec
2.4±0.2
4.5±0.3
10.5 ref
TMPF1010AV**-ABD
11.9±0.3
11.0±0.3
9.7±0.3
See Spec
2.4±0.2
4.4±0.3
10.5 ref
3.7ref
11.0 ref
TMPF1031LRV**-ABD
11.9±0.3
11.0±0.30
2.9±0.2
9.0±0.5
2.4±0.2
4.4±0.3
10.5 ref
3.7ref
11.0 ref
TMPF1508AV**-ABD
17.5±0.3
16.5±0.3
7.7±0.3
13.2±0.5
3.2±0.2
7.0±0.3
15.0ref
6.0ref
15.0ref
TMPF1510AV**-ABD
17.5±0.3
16.5±0.3
9.7±0.3
13.2±0.5
3.2±0.2
7.0±0.3
15.0ref
6.0ref
15.0ref
7.0±0.3
15.0ref
6.0ref
15.0ref
TMPF1513AV**-ABD
17.5±0.3
16.5±0.3
12.7±0.3
13.2±0.5
3.2±0.2
P3
TAI-TECH
4. Part Numbering
TMPF
0402
AV
A
B
C
A: Series
B: Dimension
C: Type
D: Inductance
E: Inductance Tolerance
F: Code
5. Specification
-
1R2
MN
D
E
-
ABD
F
BxC
Material.
1R2=1.20uH
M=±20%
Marking: Black.1R2 and 2303(23YY,03 WW,follow production date).
AB:oversize
I rms ( A ) Typ
I sat ( A )
Inductance
(uH) ±20%
@0A
20℃
rise
40℃
rise
Typ
TMPF0402AV-R10MN-ABD
0.10
13.5
18.0
TMPF0402AV-R22MN-ABD
0.22
13.0
TMPF0402AV-R33MN-ABD
0.33
12.0
TMPF0402AV-R36MN-ABD
0.36
TMPF0402AV-R40MN-ABD
0.40
TMPF0402AV-R47MN-ABD
0.47
TMPF0402AV-R56MN-ABD
0.56
TMPF0402AV-R60MN-ABD
0.60
TMPF0402AV-R72MN-ABD
0.72
TMPF0402AV-1R0MN-ABD
TMPF0402AV-1R2MN-ABD
DCR Test
Max
DCR
(mΩ)
Typ
DCR
(mΩ)
Max
38.0
33.0
2.2
2.42
16.8
19.5
18.8
4.1
4.6
15.5
18.0
16.5
5.0
5.5
11.0
14.5
17.0
15.0
5.6
6.3
10.0
14.0
15.5
13.5
6.9
7.73
9.0
12.5
14.5
13.0
7.8
8.58
8.5
12.0
14.0
12.6
8.4
9.3
8.0
11.7
13.7
12.3
8.6
9.52
7.6
10.5
12.0
10.6
10.4
11.6
1.00
6.8
9.6
9.6
8.8
13.3
14.6
1.20
6.6
9.0
9.0
7.8
16.2
17.9
TMPF0402AV-1R5MN-ABD
1.50
5.8
7.6
8.0
7.4
21.0
23.5
TMPF0402AV-1R8MN-ABD
1.80
5.2
7.0
7.5
7.0
25.0
28.0
Part Number
Note:
1. Test frequency : L : 100KHz /0.1V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU.
4. Current that causes the specified temperature rise from 25°C ambient.
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be
verified in application conditions.
9. Rated operating voltage(across inductor) 15V ref（1.5uH and above）.
Rated operating voltage(across inductor) 40V ref ( 1.2uH and below).
P4
TAI-TECH
I rms ( A ) Typ
I sat ( A )
Inductance
(uH) ±20%
@0A
20℃
rise
40℃
rise
1
2
3
3
TMPF0402LRV-R47MN-ABD
0.47
9.8
13.2
7.0
10.0
14.0
TMPF0402LRV-R56MN-ABD
0..56
9.5
12.6
6.0
9.0
TMPF0402LRV-R60MN-ABD
0.60
9.4
12.4
5.8
8.8
TMPF0402LRV-R68MN-ABD
0.68
9.2
12.0
5.2
TMPF0402LRV-R82MN-ABD
0.82
8.5
11.5
4.8
TMPF0402LRV-1R0MN-ABD
1.00
8.0
11.0
TMPF0402LRV-1R2MN-ABD
1.20
7.2
9.5
TMPF0402LRV-1R5MN-ABD
1.50
6.7
TMPF0402LRV-2R0MN-ABD
2.00
6.2
TMPF0402LRV-2R2MN-ABD
2.20
6.0
Part Number
Note:
DCR
(mΩ)
Typ.
DCR
(mΩ)
Max.
12.5
6.0
6.8
13.0
11.3
6.9
7.8
12.8
11.1
6.9
7.8
8.0
11.6
10.0
7.3
8.2
6.5
10.2
9.0
8.6
9.5
4.5
5.4
9.2
8.0
10.6
11.7
4.3
5.0
8.6
7.5
12.2
13.4
9.1
4.1
4.5
7.5
6.7
14.4
15.8
8.2
3.2
4.0
6.2
5.0
21.15
23.3
8.0
3.1
3.8
6.0
4.8
21.35
23.5
Typ
Max
1.
2.
3.
4.
5.
Test frequency : L : 100KHz /0.1V.
All test data referenced to 25℃ ambient.
Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU.
Current that causes the specified temperature rise from 25°C ambient.
Saturation Current (Isat 1) will cause L0 to drop approximately 10%.
Saturation Current (Isat 2) will cause L0 to drop approximately 20%.
Saturation Current (Isat 3) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise
should be verified in application conditions.
9. Rated operating voltage(across inductor)15V Ref.
Part Number
Inductance
(uH) ±20%
@0A
TMPF0403AV-R47MN-ABD
I rms ( A ) Typ
I sat ( A )
Max
DCR
(mΩ)
Typ.
DCR
(mΩ)
Max.
17.0
15.0
6.6
7.26
10.0
10.0
9.0
11.6
12.76
7.2
7.0
6.2
18.9
20.8
20℃
rise
40℃
rise
Typ
0.47
10.0
14.0
TMPF0403AV-1R0MN-ABD
1.00
7.0
TMPF0403AV-2R2MN-ABD
2.20
5.5
Note:
1. Test frequency : L : 100KHz /0.1V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU.
4. Current that causes the specified temperature rise from 25°C ambient.
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
8. Rated operating voltage(across inductor) 40V ref.
I rms ( A ) Typ
I sat ( A )
Inductance
(uH) ±20%
@0A
20℃
rise
40℃
rise
1
2
3
3
TMPF0403LRV-R90MN-ABD
0.90
8.2
11.2
5.2
7.0
10.0
TMPF0403LRV-1R0MN-ABD
1.00
8.0
11.0
5.0
6.8
9.8
TMPF0403LRV-1R2MN-ABD
1.20
7.8
9.8
4.6
6.4
TMPF0403LRV-1R5MN-ABD
1.50
7.0
9.0
4.1
5.6
TMPF0403LRV-1R8MN-ABD
1.80
6.5
8.2
3.8
TMPF0403LRV-2R2MN-ABD
2.20
6.0
7.8
3.6
TMPF0403LRV-3R3MN-ABD
3.30
5.0
6.6
3.3
Part Number
Note:
1.
2.
3.
4.
5.
DCR
(mΩ)
Typ.
DCR
(mΩ)
Max.
9.2
9.1
10.1
9.0
9.1
10.1
9.2
8.7
10.4
11.5
8.0
7.0
12.0
13.2
5.3
7.5
6.6
17.4
19.2
5.1
7.0
6.1
20.5
22.6
4.8
6.2
5.3
26.0
28.6
Typ
Max
Test frequency : L : 100KHz /0.1V.
All test data referenced to 25℃ ambient.
Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU.
Current that causes the specified temperature rise from 25°C ambient.
Saturation Current (Isat 1) will cause L0 to drop approximately 10%.
Saturation Current (Isat 2) will cause L0 to drop approximately 20%.
Saturation Current (Isat 3) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature
rise should be verified in application conditions.
9. Rated operating voltage(across inductor) 15Vref.
P5
TAI-TECH
I rms ( A ) Typ
I sat ( A )
Inductance
(uH) ±20%
@0A
20℃
rise
40℃
rise
Max
DCR
(mΩ)
Typ.
DCR
(mΩ)
Max.
Typ
TMPF0502AV-R15MN-ABD
0.15
13.9
18.8
TMPF0502AV-R16MN-ABD
0.16
13.9
18.8
30.0
27.0
4.00
4.60
30.0
27.0
4.00
4.60
TMPF0502AV-R33MN-ABD
0.33
10.5
TMPF0502AV-R47MN-ABD
0.47
10.1
14.4
26.0
24.0
6.10
7.00
14.1
22.0
20.0
7.00
8.05
TMPF0502AV-R56MN-ABD
0.56
TMPF0502AV-R68MN-ABD
0.68
9.9
13.9
19.0
16.0
8.70
9.54
9.6
13.4
16.0
14.0
8.90
10.2
TMPF0502AV-R80MN-ABD
TMPF0502AV-R82MN-ABD
0.80
9.4
13.0
15.5
13.5
10.3
11.8
0.82
8.5
12.0
15.0
13.0
11.0
12.7
TMPF0502AV-1R0MN-ABD
1.00
7.5
10.5
14.5
12.8
12.0
13.8
TMPF0502AV-1R2MN-ABD
1.20
6.8
9.40
14.0
12.2
14.2
16.3
TMPF0502AV-1R5MN-ABD
1.50
6.4
8.80
13.3
11.7
16.2
18.7
Part Number
Note:
1. Test frequency : L : 100KHz /0.1V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU.
4. Current that causes the specified temperature rise from 25°C ambient.
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be
verified in application conditions.
9. Rated operating voltage(across inductor) 40Vref.
I rms ( A ) Typ
I sat ( A )
Inductance
(uH) ±20%
@0A
20℃
rise
40℃
rise
Max
DCR
(mΩ)
Typ.
DCR
(mΩ)
Max.
Typ
TMPF0503AV-R15MN-ABD
0.15
14.3
22.2
36.0
32.5
2.10
2.31
TMPF0503AV-R16MN-ABD
0.16
14.2
TMPF0503AV-R28MN-ABD
0.28
14.0
22.2
35.0
32.0
2.12
2.33
19.0
32.0
28.0
3.00
3.30
TMPF0503AV-R33MN-ABD
0.33
13.8
19.2
28.0
26.0
3.20
3.52
TMPF0503AV-R47MN-ABD
TMPF0503AV-R56MN-ABD
0.47
13.7
18.4
26.0
24.0
3.75
4.13
0.56
13.6
17.7
22.2
20.2
4.05
4.52
TMPF0503AV-R60MN-ABD
0.60
13.6
17.7
22.0
20.0
4.11
4.52
TMPF0503AV-R80MN-ABD
0.80
10.1
13.1
20.0
18.0
5.14
5.65
TMPF0503AV-R82MN-ABD
0.82
9.90
12.9
19.7
17.6
5.25
5.78
TMPF0503AV-1R0MN-ABD
1.00
9.00
12.2
16.5
14.3
6.90
7.60
TMPF0503AV-1R2MN-ABD
1.20
8.50
11.0
15.0
13.5
8.80
9.70
TMPF0503AV-1R5MN-ABD
1.50
8.00
10.5
14.0
12.5
10.1
11.2
TMPF0503AV-1R8MN-ABD
1.80
7.60
10.1
12.3
11.3
11.5
12.7
TMPF0503AV-2R2MN-ABD
2.20
7.20
9.70
10.0
9.0
13.2
14.5
TMPF0503AV-3R3MN-ABD
3.30
5.90
8.10
9.5
8.7
21.0
23.1
TMPF0503AV-3R6MN-ABD
3.60
4.60
6.50
9.0
7.9
25.0
27.5
TMPF0503AV-4R7MN-ABD
4.70
4.30
5.90
8.2
7.0
33.0
36.3
Part Number
Note:
1. Test frequency : L : 100KHz /0.1V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument : L/Q: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU.
4. Current that causes the specified temperature rise from 25°C ambient.
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise
should be verified in application conditions.
9. Rated operating voltage(across inductor) 40V ref.
P6
TAI-TECH
I rms ( A ) Typ
I sat ( A )
Part Number
Inductance
(uH) ±20%
@0A
20℃
rise
40℃
rise
Typ
Max
DCR(mΩ)
Typ.
DCR(mΩ)
Max.
TMPF0505LRV-4R7MN-ABD
4.70
5.90
8.10
8.80
7.40
19.0
21.0
TMPF0505LRV-5R6MN-ABD
5.60
5.30
7.20
8.60
7.20
22.0
24.2
TMPF0505LRV-6R8MN-ABD
6.80
4.80
6.40
7.80
6.60
26.0
28.6
TMPF0505LRV-8R2MN-ABD
8.20
4.60
6.10
7.20
6.10
29.5
32.5
Note:
1.
2.
3.
4.
5.
6.
Test frequency : L : 100KHz /0.1V.
All test data referenced to 25℃ ambient.
Testing Instrument : L/Q: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU.
Current that causes the specified temperature rise from 25°C ambient.
Saturation Current (Isat) will cause L0 to drop approximately 30%.
The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components.
Therefore temperature rise should be verified in application conditions.
9. Rated operating voltage(across inductor) 15V ref.
Part Number
Inductance
(uH) ±20%
@0A
I rms ( A ) Typ
I sat ( A )
20℃
rise
40℃
rise
Typ
Max
DCR
(mΩ)
Typ.
DCR
(mΩ)
Max.
C(mm)
±0.2
D(mm)
±0.3
TMPF0603AV-R18MN-ABD
0.18
24.0
32.0
40.0
36.0
1.60
1.75
2.8
5.30
TMPF0603AV-R33MN-ABD
0.33
20.0
25.0
32.0
28.0
2.25
2.50
2.8
5.55
TMPF0603AV-R56MN-ABD
0.56
17.0
22.0
29.0
25.0
3.00
3.31
2.8
5.30
TMPF0603AV-R68MN-ABD
0.68
15.0
20.0
25.0
21.0
4.7
5.17
2.8
5.30
TMPF0603AV-1R0MN-ABD
1.00
13.0
18.0
23.0
18.0
5.50
6.05
2.8
5.20
TMPF0603AV-1R2MN-ABD
1.20
12.0
16.0
22.0
16.0
6.70
7.40
2.8
5.15
TMPF0603AV-1R5MN-ABD
1.50
11.0
15.0
20.0
15.5
8.30
9.13
2.9
5.15
TMPF0603AV-1R8MN-ABD
1.80
10.0
14.0
18.2
13.0
9.20
10.2
2.9
5.10
TMPF0603AV-2R2MN-ABD
2.20
7.00
10.0
15.9
11.0
11.0
12.2
2.9
5.05
TMPF0603AV-3R3MN-ABD
3.30
6.00
8.00
12.2
9.00
18.8
20.8
2.9
5.00
TMPF0603AV-4R5MN-ABD
4.50
5.00
7.00
10.0
8.00
23.0
25.3
2.9
5.00
TMPF0603AV-4R7MN-ABD
4.70
4.0
6.0
9.0
7.0
26.5
29.2
2.9
5.00
Note:
1.
2.
3.
4.
5.
6.
Test frequency : L : 100KHz /0.1V.
All test data referenced to 25℃ ambient.
Testing Instrument : L/Q: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU.
Current that causes the specified temperature rise from 25°C ambient.
Saturation Current (Isat) will cause L0 to drop approximately 30%.
The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components.
Therefore temperature rise should be verified in application conditions.
9. Rated operating voltage(across inductor) 40V ref.
P7
TAI-TECH
Part Number
Inductance
(uH) ±20%
@0A
I rms ( A ) Typ
I sat ( A )
20℃
rise
40℃
rise
Typ
Max
DCR
(mΩ)
Typ.
DCR
(mΩ)
Max.
D
(mm)
±0.3
TMPF0604AV-R47MN-ABD
0.47
19
24
31
27
2.6
2.86
5.5
TMPF0604AV-R68MN-ABD
0.68
16
20.5
26
22
3.6
3.96
5.5
TMPF0604AV-1R0MN-ABD
1.0
14
19
23
18
4.9
5.39
5.2
TMPF0604AV-1R5MN-ABD
1.5
12
16
17
13
6.4
7.04
5.2
TMPF0604AV-2R2MN-ABD
2.2
8.0
11
15.9
11.5
10.6
11.7
5.0
TMPF0604AV-3R3MN-ABD
3.3
7.0
9.2
12.3
9.6
14.1
15.5
5.0
TMPF0604AV-4R7MN-ABD
4.7
6.0
7.8
10.2
8.0
21
23.1
5.0
TMPF0604AV-5R6MN-ABD
5.6
5.0
6.7
9.8
7.8
25.5
28.1
5.0
Note:
1.
2.
3.
4.
5.
6.
Test frequency : L : 100KHz /0.1V.
All test data referenced to 25℃ ambient.
Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU.
Current that causes the specified temperature rise from 25°C ambient.
Saturation Current (Isat) will cause L0 to drop approximately 30%.
The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components.
Therefore temperature rise should be verified in application conditions.
9. Rated operating voltage(across inductor) 40V ref.
Part Number
Inductance
(uH) ±20%
@0A
I rms ( A ) Typ
I sat ( A )
20℃
rise
40℃
rise
Typ
Max
DCR
(mΩ)
Typ.
DCR
(mΩ)
Max.
D
(mm)
±0.3
TMPF0605AV-R82MN-ABD
0.82
16.0
21.0
24.0
20.0
3.8
4.18
5.3
TMPF0605AV-1R0MN-ABD
1.00
15.0
20.0
23.0
18.0
4.1
4.52
5.3
TMPF0605AV-1R2MN-ABD
1.20
14.0
18.0
22.0
16.0
5.3
5.83
5.3
TMPF0605AV-1R5MN-ABD
1.50
13.0
17.0
19.5
14.5
5.7
6.3
5.3
TMPF0605AV-1R8MN-ABD
1.80
12.0
16.0
18.5
13.5
6.4
7.1
5.3
TMPF0605AV-2R2MN-ABD
2.20
10.0
13.0
16.0
12.0
7.7
8.5
5.2
TMPF0605AV-3R3MN-ABD
3.30
8.5
11.0
12.5
10.0
11.2
12.5
5.2
TMPF0605AV-4R3MN-ABD
4.30
7.0
9.0
11.0
8.5
15.1
16.2
5.2
TMPF0605AV-4R7MN-ABD
4.70
6.5
8.5
10.5
8.4
16.7
18.4
5.2
TMPF0605AV-5R6MN-ABD
5.60
5.7
7.0
10.0
8.3
20.0
22.0
5.2
TMPF0605AV-6R8MN-ABD
6.80
5.2
6.6
9.0
7.0
23.1
25.4
5.2
TMPF0605AV-8R2MN-ABD
8.20
4.5
6.2
8.0
6.8
28.6
31.5
5.2
Note:
1.
2.
3.
4.
5.
6.
Test frequency : L : 100KHz /0.1V.
All test data referenced to 25℃ ambient.
Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU.
Current that causes the specified temperature rise from 25°C ambient.
Saturation Current (Isat) will cause L0 to drop approximately 30%.
The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components.
Therefore temperature rise should be verified in application conditions.
9. Rated operating voltage(across inductor) 40V ref.
P8
TAI-TECH
I rms ( A ) Typ
I sat ( A )
Inductance
(uH) ±20%
@0A
20℃
rise
40℃
rise
Typ
TMPF0606AV-1R0MN-ABD
1.00
16.0
21.0
TMPF0606AV-1R5MN-ABD
1.50
13.5
17.5
TMPF0606AV-2R2MN-ABD
2.20
11.0
TMPF0606AV-3R3MN-ABD
3.30
TMPF0606AV-4R7MN-ABD
4.70
TMPF0606AV-5R6MN-ABD
5.60
Part Number
Note:
Max
DCR
(mΩ)
Typ.
DCR
(mΩ)
Max.
24.0
19.0
4.0
4.4
20.0
15.0
5.5
6.1
14.0
16.5
12.5
7.3
8.1
9.0
12.0
13.0
11.0
11.1
12.3
8.5
11.0
11.5
9.5
15.1
16.2
7.6
10.0
10.6
9.1
18.2
20.0
1.
2.
3.
4.
5.
6.
Test frequency : L : 100KHz /0.1V.
All test data referenced to 25℃ ambient.
Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU.
Current that causes the specified temperature rise from 25°C ambient.
Saturation Current (Isat) will cause L0 to drop approximately 30%.
The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components.
Therefore temperature rise should be verified in application conditions.
9. Rated operating voltage(across inductor) 40V ref
I rms ( A ) Typ
I sat ( A )
Part Number
Inductance
(uH) ±20%
@0A
20℃
rise
40℃
rise
Max
DCR
(mΩ)
Typ.
DCR
(mΩ)
Max.
Typ
TMPF0606LRV-R22MN-ABD
0.22
18.0
25.0
36.0
32.0
1.5
1.65
TMPF0606LRV-1R0MN-ABD
1.0
15.0
19.0
18.0
16.0
3.9
4.29
TMPF0606LRV-1R2MN-ABD
1.2
TMPF0606LRV-1R5MN-ABD
1.50
14.0
17.0
17.0
15.0
4.6
5.06
13.0
16.0
16.0
14.0
5.1
5.61
TMPF0606LRV-2R2MN-ABD
TMPF0606LRV-3R3MN-ABD
2.20
11.0
14.0
14.0
12.0
7.0
7.80
3.30
9.0
12.0
11.5
10.5
11.0
12.1
TMPF0606LRV-4R7MN-ABD
4.70
8.0
11.0
10.5
9.5
13.1
14.4
TMPF0606LRV-5R6MN-ABD
5.60
7.5
10.0
10.0
9.0
14.3
15.8
TMPF0606LRV-6R8MN-ABD
6.80
7.0
9.0
9.2
8.7
18.9
20.8
TMPF0606LRV-8R2MN-ABD
8.20
6.0
8.0
8.5
8.0
22.5
24.8
Note:
1. Test frequency : L : 100KHz /0.1V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU.
4. Current that causes the specified temperature rise from 25°C ambient.
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components.
Therefore temperature rise should be verified in application conditions.
9. Ratedoperatingvoltage(acrossinductor)15V ref.
P9
TAI-TECH
I rms ( A ) Typ
I sat ( A )
Part Number
Inductance
(uH) ±20%
@0A
Max
DCR
(mΩ)
Typ.
DCR
(mΩ)
Max.
D
(mm)
±0.3
20℃
rise
40℃
rise
Typ
TMPF0702AV-R15MN-ABD
0.15
18
24
TMPF0702AV-R27MN-ABD
0.27
16
21
51
46
1.9
2.5
6.6
35
32
2.9
3.5
6.6
TMPF0702AV-R31MN-ABD
0.31
14
TMPF0702AV-R33MN-ABD
0.33
13
20
34
31
4.0
4.8
6.2
19
34
31
4.0
4.8
6.2
TMPF0702AV-R47MN-ABD
0.47
TMPF0702AV-R68MN-ABD
0.68
12
17
28
25
5.1
6.2
6.2
10
13
25
23
7.9
9.2
6.2
TMPF0702AV-1R0MN-ABD
1.00
TMPF0702AV-1R2MN-ABD
1.20
8
11
23
20
9.8
10.8
6.2
7
10
21
18
11.5
12.8
6.2
TMPF0702AV-1R5MN-ABD
TMPF0702AV-1R8MN-ABD
1.50
6
9
17
15
16
17.6
6.2
1.80
5.5
8
15
13
18
19.8
6.2
Note:
1. Test frequency : L : 100KHz /0.1V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU.
4. Current that causes the specified temperature rise from 25°C ambient.
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components.
Therefore temperature rise should be verified in application conditions.
9. Rated operating voltage(across inductor) 40V ref.
I rms ( A ) Typ
I sat ( A )
Inductance
(uH) ±20%
@0A
20℃
rise
40℃
rise
Typ
TMPF0703AV-R60MN-ABD
0.60
18.0
23.0
TMPF0703AV-1R0MN-ABD
1.00
16.1
TMPF0703AV-1R5MN-ABD
1.50
12.0
TMPF0703AV-2R2MN-ABD
2.20
10.0
TMPF0703AV-2R7MN-ABD
2.70
TMPF0703AV-3R3MN-ABD
3.30
TMPF0703AV-4R7MN-ABD
TMPF0703AV-5R6MN-ABD
Part Number
Max
DCR
(mΩ)
Typ.
DCR
(mΩ)
Max.
D
(mm)
±0.3
36.0
32.0
2.90
3.20
6.6
21.8
30.0
28.0
4.55
5.00
6.6
15.3
25.0
23.5
7.50
8.25
6.6
13.0
19.0
17.0
12.4
13.7
6.2
9.20
11.4
16.0
13.5
14.0
15.4
6.2
8.00
10.0
15.0
13.0
16.3
18.0
6.2
4.70
6.90
9.00
13.5
12.2
24.2
26.7
6.2
5.60
5.30
7.30
12.5
11.5
30.1
33.2
6.2
Note:
1. Test frequency : L : 100KHz /0.1V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU.
4. Current that causes the specified temperature rise from 25°C ambient.
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components.
Therefore temperature rise should be verified in application conditions.
9. Rated operating voltage(across inductor) 40V ref.
P10
TAI-TECH
I rms ( A ) Typ
Inductance
(uH) ±20%
@0A
20℃
rise
40℃
rise
TMPF0705AV-1R8MN-ABD
1.80
13.0
16.0
TMPF0705AV-2R2MN-ABD
2.20
11.0
14.0
TMPF0705AV-3R3MN-ABD
3.30
10.0
13.0
TMPF0705AV-4R7MN-ABD
4.70
8.5
11.0
TMPF0705AV-5R6MN-ABD
5.60
7.0
10.0
Part Number
I sat ( A )
Max
DCR
(mΩ)
Typ.
DCR
(mΩ)
Max.
D
(mm)
±0.3
25
21
4.20
4.62
6.5
21.0
17.0
5.8
6.4
6.2
17.0
14.0
10.4
11.44
6.2
15.0
13.0
14.0
15.4
6.2
13.0
11.0
15.6
17.2
6.2
Typ
Note:
1. Test frequency : L : 100KHz /0.1V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU.
4. Current that causes the specified temperature rise from 25°C ambient.
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components.
Therefore temperature rise should be verified in application conditions.
9. Rated operating voltage(across inductor) 40V ref.
I rms( A ) Typ
I sat ( A )
Inductance
(uH) ±20%
@0A
20℃
rise
40℃
rise
Typ
TMPF0707AV-2R2MN-ABD
2.20
13.2
17.8
TMPF0707AV-3R3MN-ABD
3.30
11.5
TMPF0707AV-4R7MN-ABD
4.70
TMPF0707AV-5R6MN-ABD
5.60
TMPF0707AV-6R8MN-ABD
TMPF0707AV-100MN-ABD
Part Number
Max
DCR
(mΩ)
Typ.
DCR
(mΩ)
Max.
D
(mm)
±0.3
19.6
17.6
5.73
6.33
6.70
15.1
19.4
15.1
8.56
9.42
6.70
10.5
13.6
15.5
14.0
12.2
13.5
6.70
8.5
11.4
14.1
12.0
13.67
15.03
6.50
6.80
7.0
9.5
12.8
11.0
17.8
19.6
6.50
10.0
5.0
7.0
10.0
9.0
24.0
26.4
6.50
Note:
1.
2.
3.
4.
5.
6.
Test frequency : L : 100KHz /0.1V.
All test data referenced to 25℃ ambient.
Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU.
Current that causes the specified temperature rise from 25°C ambient.
Saturation Current (Isat) will cause L0 to drop approximately 30%.
The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components.
Therefore temperature rise should be verified in application conditions.
9. Rated operating voltage(across inductor) 40V ref.
I rms( A ) Typ
I sat ( A )
Part Number
Inductance
(uH) ±20%
@0A
Max
DCR
(mΩ)
Typ.
DCR
(mΩ)
Max.
D
(mm)
±0.4
20℃
rise
40℃
rise
Typ
TMPF0808AV-3R3MN-ABD
3.30
13.5
18.0
23.0
20.0
6.6
7.3
6.9
TMPF0808AV-4R7MN-ABD
4.70
10.5
TMPF0808AV-6R8MN-ABD
6.80
8.0
14.6
19.0
17.0
8.9
9.8
6.9
11.3
14.5
12.5
13.0
14.3
6.9
TMPF0808AV-100MN-ABD
10.0
6.6
8.7
11.0
10.0
20.8
22.9
6.9
Note:
1. Test frequency : L : 100KHz /0.1V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU.
4. Current that causes the specified temperature rise from 25°C ambient.
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components.
Therefore temperature rise should be verified in application conditions.
9. Rated operating voltage(across inductor) 40V ref
P11
TAI-TECH
I rms ( A ) Typ
I sat ( A )
Inductance
(uH) ±20%
@0A
20℃
rise
40℃
Rise
Max
DCR
(mΩ)
Typ.
DCR
(mΩ)
Max.
Typ
D(mm)
±0.5
TMPF1006AV-2R2MN-ABD
2.20
14.0
20.0
35.0
30.0
4.40
4.84
9.0
TMPF1006AV-3R3MN-ABD
3.30
11.4
16.8
28.0
25.0
7.00
7.70
9.0
TMPF1006AV-4R7MN-ABD
4.70
8.7
14.0
25.0
22.0
9.70
10.72
9.0
TMPF1006AV-5R6MN-ABD
5.60
7.0
12.0
20.0
17.0
10.8
11.9
8.8
TMPF1006AV-6R8MN-ABD
6.80
6.0
10.5
18.0
15.5
11.8
13.0
8.8
TMPF1006AV-8R2MN-ABD
8.20
5.0
9.5
16.5
14.0
15.0
16.5
8.8
TMPF1006AV-100MN-ABD
10.0
4.5
9.0
15.0
13.0
16.5
18.2
8.8
Part Number
Note:
1. Test frequency : L : 100KHz /0.1V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU.
4. Current that causes the specified temperature rise from 25°C ambient.
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components.
Therefore temperature rise should be verified in application conditions.
9. Rated operating voltage(across inductor) 40V ref.
Part Number
Inductance
(uH) ±20%
@0A
I rms ( A ) Typ
I sat ( A )
20℃
rise
40℃
Rise
Typ
Max
DCR
(mΩ)
Typ.
DCR
(mΩ)
Max.
D
(mm)
±0.5
TMPF1010AV-3R3MN-ABD
3.30
18.2
25.0
27.4
23.4
3.7
4.1
9.3
TMPF1010AV-4R7MN-ABD
4.70
17.5
24.0
25.4
21.4
5.2
5.7
9.3
TMPF1010AV-5R6MN-ABD
5.60
15.7
21.2
23.6
19.6
6.5
7.2
9.3
TMPF1010AV-6R8MN-ABD
6.80
14.0
18.5
21.8
18.5
8.1
8.9
9.0
TMPF1010AV-8R2MN-ABD
8.20
12.9
17.1
18.3
16.3
10.8
12.4
9.0
TMPF1010AV-100MN-ABD
10.0
11.5
15.5
17.5
14.6
12.5
13.75
9.0
TMPF1010AV-150MN-ABD
15.0
9.9
13.8
15.5
12.5
17.5
19.30
9.0
Note:
1. Test frequency : L : 100KHz /0.1V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU.
4. Current that causes the specified temperature rise from 25°C ambient.
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components.
Therefore temperature rise should be verified in application conditions.
9. Rated operating voltage(across inductor) 40V ref.
P12
TAI-TECH
I rms ( A ) Typ
I sat ( A )
Part Number
Inductance
(uH) ±20%
@0A
20℃
rise
40℃
rise
Max
DCR
(mΩ)
Typ.
DCR
(mΩ)
Max.
Typ
TMPF1031LRV-R28MN-ABD
0.28
25.5
35.0
65.0
58.0
1.45
1.60
TMPF1031LRV-R56MN-ABD
0.56
23.0
TMPF1031LRV-R82MN-ABD
0.82
18.0
32.0
44.0
39.0
2.50
2.75
25.0
38.0
32.0
3.70
4.10
TMPF1031LRV-R90MN-ABD
0.90
TMPF1031LRV-1R0MN-ABD
1.00
17.0
24.0
36.0
31.0
3.80
4.20
16.0
23.0
35.0
30.0
4.50
4.95
TMPF1031LRV-1R5MN-ABD
1.50
12.0
18.0
30.0
25.0
6.00
6.60
Note:
1. Test frequency : L : 100KHz /0.1V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU.
4. Current that causes the specified temperature rise from 25°C ambient.
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components.
Therefore temperature rise should be verified in application conditions.
9. Rated operating voltage(across inductor) 15V ref.
Part Number
Inductance
(uH) ±20%
@0A
I rms ( A ) Typ
I sat ( A )
20℃
rise
40℃
Rise
Typ
Max
DCR
(mΩ)
Typ.
DCR
(mΩ)
Max.
TMPF1508AV-2R0MN-ABD
2.00
29.5
40.0
57.0
52.0
1.92
2.21
TMPF1508AV-2R2MN-ABD
2.20
28.0
37.0
55.0
49.0
2.15
2.48
TMPF1508AV-3R0MN-ABD
3.00
26.0
34.5
46.0
41.0
2.50
3.00
TMPF1508AV-4R2MN-ABD
4.20
20.5
27.0
38.0
33.0
3.90
4.68
TMPF1508AV-4R7MN-ABD
4.70
20.0
26.5
37.0
32.0
4.30
5.16
TMPF1508AV-5R3MN-ABD
5.30
19.5
26.0
35.0
31.0
4.45
5.34
TMPF1508AV-6R2MN-ABD
6.20
17.0
23.0
34.0
31.0
5.40
6.50
TMPF1508AV-7R2MN-ABD
7.20
15.0
21.0
32.0
29.0
6.00
7.20
TMPF1508AV-8R2MN-ABD
8.20
13.0
19.0
28.0
25.0
6.60
7.92
TMPF1508AV-100MN-ABD
10.0
11.0
16.0
24.0
21.0
8.00
9.60
TMPF1508AV-150MN-ABD
15.0
10.0
13.0
21.0
18.0
12.50
15.00
TMPF1508AV-220MN-ABD
22.0
9.0
12.0
19.0
16.0
19.30
23.20
Note:
1. Test frequency : L : 100KHz /0.1V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU.
4. Current that causes the specified temperature rise from 25°C ambient.
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components.
Therefore temperature rise should be verified in application conditions.
9. Rated operating voltage(across inductor) 40V ref.
P13
TAI-TECH
I rms ( A )
I sat ( A )
Part Number
Inductance
(uH) ±20%
@0A
20℃
rise
40℃
Rise
Max
DCR
(mΩ)
Typ.
DCR
(mΩ)
Max.
Typ
TMPF1510AV-4R7MN-ABD
4.7
22.0
30.0
43.0
39.0
3.40
3.80
TMPF1510AV-5R6MN-ABD
5.6
21.0
TMPF1510AV-6R8MN-ABD
6.8
20.0
28.0
38.0
34.0
3.82
4.20
26.0
36.0
31.0
4.18
4.60
TMPF1510AV-8R2MN-ABD
8.2
TMPF1510AV-100MN-ABD
10.0
19.0
25.0
32.0
28.0
6.00
7.20
18.0
24.0
29.0
26.0
7.10
8.60
TMPF1510AV-150MN-ABD
TMPF1510AV-220MN-ABD
15.0
14.0
18.0
23.0
20.0
9.20
11.50
22.0
11.0
16.0
20.0
18.0
13.2
15.8
TMPF1510AV-330MN-ABD
33.0
9.0
13.0
18.7
16.7
18.7
20.0
Note:
1. Test frequency : L : 100KHz /0.1V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU.
4. Current that causes the specified temperature rise from 25°C ambient.
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components.
Therefore temperature rise should be verified in application conditions.
9. Rated operating voltage(across inductor) 40V ref.
I rms ( A )
I sat ( A )
Inductance
(uH) ±20%
@0A
20℃
rise
40℃
Rise
Max
DCR
(mΩ)
Typ.
DCR
(mΩ)
Max.
Typ
TMPF1513AV-4R7MN-ABD
4.70
23.0
31.0
44.0
40.0
3.0
3.3
TMPF1513AV-5R6MN-ABD
5.60
22.0
29.0
40.0
35.0
3.5
3.9
TMPF1513AV-6R8MN-ABD
6.80
21.0
27.0
37.0
32.0
3.8
4.2
TMPF1513AV-8R2MN-ABD
8.20
20.0
26.0
33.0
29.0
5.1
5.74
TMPF1513AV-100MN-ABD
10.0
19.0
25.0
30.0
27.0
6.3
7.0
TMPF1513AV-150MN-ABD
15.0
16.0
22.0
25.5
21.0
6.8
7.5
TMPF1513AV-220MN-ABD
22.0
12.0
17.0
22.0
19.0
12.6
13.86
TMPF1513AV-330MN-ABD
33.0
9.0
14.0
19.0
16.0
18.5
22.2
Part Number
Note:
1. Test frequency : L : 100KHz /0.1V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU.
4. Current that causes the specified temperature rise from 25°C ambient.
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
8. Irms Testing：Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components.
Therefore temperature rise should be verified in application conditions.
9. Rated operating voltage(across inductor) 40V ref.
6. Material List
2 4
1
2
3
NO
Items
Materials
1
Core
Alloy powder.
2
Wire
Polyester Wire or equivalent.
3
Solder
100% Pb free solder
4
Ink
Halogen-free ketone
P14
TAI-TECH
7. Reliability and Test Condition
Item
Performance
Operating temperature
-55~+155℃(Including self - temperature rise)
Storage temperature and
1. -10~+40℃,50~60%RH (Product with taping)
Humidity range
2. -55~+155℃(on board)
Test Condition
Electrical Performance Test
Inductance
Refer to standard electrical characteristics list.
DCR
HP4284A,CH11025,CH3302,CH1320,CH1320S
LCR Meter.
CH16502,Agilent33420A Micro-Ohm Meter.
Saturation Current (Isat)
Approximately △L30%
Saturation DC Current (Isat) will cause L0
to drop △L(%)
Heat Rated Current (Irms) will cause the coil temperature rise △
Heat Rated Current (Irms)
Approximately △T40℃
T(℃).
1.Applied the allowed DC current
2.Temperature measured by digital surface thermometer
Reliability Test
Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC
J-STD-020E Classification Reflow Profiles
Temperature：155±2℃(Inductor)
Duration ：1000hrs Min.
Measured at room temperature after placing for 24±2 hrs
Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC
J-STD-020E Classification Reflow Profiles
Condition for 1 cycle
Step1：-55±2℃ 30min Min.(Inductor)
Step2：155±2℃ transition time 1min MAX.
Step3：155±2℃ 30min Min.
Step4：Low temp. transition time 1min MAX.
Number of cycles： 1000
Measured at room temperature after placing for 24±2 hrs
High Temperature
Exposure(Storage)
AEC-Q200
Temperature Cycling
AEC-Q200
t=24 hours/cycle. Note:Steps 7a & 7b Unpowered.
Moisture Resistance
(AEC-Q200)
Appearance：No damage.
Inductance：within±10% of initial value
RDC：within ±15% of initial value and shall not exceed
the specification value
Preconditioning: Run through IR reflow for 3 times.
( IPC/JEDEC J-STD-020E Classification Reflow Profiles)
Humidity ：85±3﹪R.H,
Temperature：85℃±2℃
Duration : 1000hrs Min
Measured at room temperature after placing for24±2hrs
Biased Humidity
(AEC-Q200)
Preconditioning: Run through IR reflow for 3 times.
( IPC/JEDECJ-STD-020E Classification Reflow Profiles
Temperature：155±2℃(Inductor)
Duration ：1000hrs Min. With 100% rated current.
Measured at room temperature after placing for24±2hrs
High Temperature
Operational Life
(AEC-Q200)
External Visual
Physical Dimension
Resistance to Solvents
Appearance：No damage.
Inspect device construction, marking and workmanship. Electrical
Test not required.
According to the product specification size measurement
According to the product specification size measurement
Appearance：No damage.
Add aqueous wash chemical - OKEM clean or equivalent.
Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC
J-STD-020E Classification Reflow Profiles)
Appearance：No damage.
Mechanical Shock
Test condition
Peak value
Normal
(g’s)
duration (D) (ms)
Inductance：within±10% of initial value
Type
RDC：within ±15% of initial value and shall not exceed
SMD
100
Lead
100
the specification value
Wave
form
Velocity
change (Vi)ft/sec
6
Half-sine
12.3
6
Half-sine
12.3
3 shocks in each direction along 3 perpendicular axes(18
shocks).
P15
TAI-TECH
Item
Performance
Vibration
Appearance：No damage.
Resistance to Soldering Heat
Inductance：within±10% of initial value
RDC：within ±15% of initial value and shall not exceed
the specification value
Temperature(℃)
Time(s)
Temperature
ramp/immersion
and emersion rate
260±5
(solder temp)
10±1
25mm/s±6mm/s
Depth: completely cover the termination
Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC
J-STD-020E Classification Reflow Profiles
Condition for 1 cycle
Step1：-55±2℃ 15±1min(Inductor)
Step2：155±2℃ within 20Sec.
Step3：155±2℃ 15±1min
Number of cycles： 300
Measured at room fempraturc after placing fo24±2hrs
Thermal shock
(AEC-Q200)
ESD
Test Condition
Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC
J-STD-020E Classification Reflow Profiles)
Oscillation Frequency: 10Hz～2KHz～10Hz for 20 minute
Equipment： Vibration checker
Total Amplitude: 5g
Testing Time : 12 hours(20 minutes, 12 cycles each of 3
orientations)。
Test condition:(MIL-STD-202 Condition B)
Number of heat cycles:1
Appearance：No damage.
Direct Contact and Air Discharge PASSIVE COMPONENT HBM ESD
Discharge Waveform to a Coaxial Target
Test method: AEC-Q200-002
Test mode：Contact Discharge
Discharge level：4 KV (Level: 2 )
More than 95% of the terminal electrode should be covered
Solderability
Electrical Characterization
Flammability
with solder。
a. Method B1, 4 hrs @155°C dry heat @255°C±5°C
Test time:5 +0/-0.5 seconds.
b. Method D category 3. (steam aging 8hours ± 15 min)@
260°C±5°C
Test time: 30 +0/-0.5 seconds.
Refer Specification for Approval
Summary to show Min, Max, Mean and Standard deviation .
Electrical Test not required.
V-0 or V-1 are acceptable.
Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC
J-STD-020E Classification Reflow Profiles
Place the 100mm X 40mm board into a fixture similar to the one
shown in below Figure with the component facing down. The
apparatus shall consist of mechanical means to apply a force which
will bend the board (D) x = 2 mm minimum. The duration of the
applied forces shall be 60 (+ 5) sec. The force is to be applied only
once to the board.
Board Flex
Appearance：No damage
Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC
J-STD-020E Classification Reflow Profiles
With the component mounted on a PCB with the device to be tested,
apply a 17.7 N (1.8 Kg) force to the side of a device being tested. This
force shall be applied for 60 +1 seconds. Also the force shall be
applied gradually as not to apply a shock to the component being
tested.
Terminal Strength(SMD)
Appearance：No damage
Note : When there are questions concerning measurement result : measurement shall be made after 48 ± 2 hours of recovery under the standard
condition.
P16
TAI-TECH
8.Soldering Specifications
(1) Soldering
Mildly activated rosin fluxes are preferred. TAI-TECH terminations are suitable for re-flow soldering systems. If hand
soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
(2) Soldering Reflow:
Recommended temperature profiles for lead free re-flow soldering in Figure 1. Table 1.1&1.2 (J-STD-020E)
(3) Iron Reflow:
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.(Fig. 2)
‧Preheat circuit and products to 150℃
‧355℃ tip temperature (max)
‧Never contact the ceramic with the iron tip
‧1.0mm tip diameter (max)
‧Use a 20 watt soldering iron with tip diameter of 1.0mm
‧Limit soldering time to 4~5sec.
Fig.1 Soldering Reflow
Fig.2 Iron soldering temperature profiles
Soldering iron Method : 350± 5℃ max
Reflow times: 3 times max
Table (1.1):
Reflow Profiles
Profile Type:
Pb-Free Assembly
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(ts)from(Tsmin to Tsmax)
150℃
200℃
60-120seconds
Ramp-up rate(TLto Tp)
3℃/second max.
Liquidus temperature(TL)
Time(tL)maintained above TL
217℃
60-150 seconds
Classification temperature(Tc)
See Table (1.2)
Time(tp) at Tc- 5℃ (Tp should be equal to or less than Tc.)
< 30 seconds
Ramp-down rate(Tp to TL)
6℃ /second max.
Time 25℃ to peak temperature
8 minutes max.
Tp: maximum peak package body temperature, Tc: the classification temperature.
For user (customer) Tp should be equal to or less than Tc.
Table (1.2) Package Thickness/Volume and Classification Temperature (Tc)
PB-Free Assembly
Package
Volume mm3
Volume mm3
Thickness
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