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TLK2201I
ETHERNET TRANSCEIVERS
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• 1 to 1.6 Gigabits Per Second (Gbps)
Serializer/Deserializer (TLK2201)
• 1.2 to 1.6 Gigabits Per Second (Gbps)
Serializer/Deserializer (TLK2201I)
• Low Power Consumption 150 mV, LOS = 1, valid input signalIf magnitude of RXP-RXN < 150 mV
and > 50 mV, LOS is undefinedIf magnitude of RXP-RXN < 50 mV, LOS = 0, loss of signal
MODESEL
15
I
P/D (3)
Mode select. This terminal selects between the 10-bit interface and a reduced 5-bit DDR interface.
When low the 10-bit interface (TBI) is selected. When pulled high, the 5-bit DDR mode is selected.
The default mode is the TBI.
LOOPEN
19
I
P/D (3)
Loop enable. When LOOPEN is high (active), the internal loop-back path is activated. The
transmitted serial data is directly routed to the inputs of the receiver. This provides a self-test
capability in conjunction with the protocol device. The TXP and TXN outputs are held in a
high-impedance state during the loop-back test. LOOPEN is held low during standard operational
state with external serial outputs and inputs active.
TCK
49
I
Test clock. IEEE1149.1 (JTAG)
JTDI
48
I
P/U (4)
Test data input. IEEE1149.1 (JTAG)
JTDO
27
O
Test data output. IEEE1149.1 (JTAG)
JTRSTN
56
I
P/U (4)
Reset signal. IEEE1149.1 (JTAG)
JTMS
55
I
P/U (4)
Test mode select. IEEE1149.1 (JTAG)
ENABLE
28
I
P/U (4)
When this terminal is low, the device is disabled for Iddq testing. RD0 - RD9, RBCn, TXP, and TXN
are high impedance. The pullup and pulldown resistors on any input are disabled. When ENABLE is
high, the device operates normally.
PRBSEN
16
I
P/D (3)
PRBS enable. When PRBSEN is high, the PRBS generation circuitry is enabled. The PRBS
verification circuit in the receive side is also enabled. A PRBS signal can be fed to the receive inputs
and checked for errors, that are reported by the SYNC/PASS terminal indicating low.
TESTEN
17
I
P/D (3)
Manufacturing test terminal
VDD
5, 10, 20,
23, 29, 37,
42, 50, 63
Supply
Digital logic power. Provides power for all digital circuitry and digital I/O buffers.
VDDA
53, 57, 59,
60
Supply
Analog power. VDDA provides power for the high-speed analog circuits, receiver, and transmitter
NAME
NO.
RBC0 RBC1
TEST
POWER
(1)
(2)
(3)
(4)
4
P/D
P/U
P/D
P/U
=
=
=
=
Internal
Internal
Internal
Internal
pulldown
pullup
pulldown
pullup
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Terminal Functions (continued)
TERMINAL
I/O
DESCRIPTION
18
Supply
PLL power. Provides power for the PLL circuitry. This terminal requires additional filtering.
GNDA
51,58
Ground
Analog ground. GNDA provides a ground for the high-speed analog circuits, RX and TX.
GND
1, 14,
21,25, 33,
46
Ground
Digital logic ground. Provides a ground for the logic circuits and digital I/O buffers.
GNDPLL
64
Ground
PLL ground. Provides a ground for the PLL circuitry.
NAME
NO.
VDDPLL
GROUND
DETAILED DESCRIPTION
Data Transmission
These devices support both the defined 10-bit interface (TBI) and a reduced 5-bit interface utilizing DDR
clocking. When MODESEL is low, the TBI mode is selected. When MODESEL is high, the DDR mode is
selected.
In the TBI mode, the transmitter portion registers incoming 10-bit wide data words (8b/10b encoded data,
TD0-TD9) on the rising edge of REFCLK. The REFCLK is also used by the serializer, which multiplies the clock
by a factor of 10, providing a signal that is fed to the shift register. The 8b/10b encoded data is transmitted
sequentially bit 0 through 9 over the differential high-speed I/O channel.
In the DDR mode, the transmitter accepts 5-bit wide 8b/10b encoded data on pins TD0-TD4. In this mode data is
aligned to both the rising and falling edges of REFCLK. The data is then formed into a 10-bit wide word and sent
to the serializer. The rising edge REFCLK clocks in bit 0-4, and the falling edge of REFCLK clocks in bits 5-9. (
Bit 0 is the first bit transmitted).
Transmission Latency
Data transmission latency is defined as the delay from the initial 10-bit word load to the serial transmission of bit
9. The minimum latency in TBI mode is 19 bit times. The maximum latency in TBI mode is 20 bit times. The
minimum latency in DDR mode is 29 bit times, and maximum latency in DDR mode is 30 bit times.
10 Bit Code
TXP, TXN
b9
td(Tx latency)
10 Bit Code
TD(0-9)
REFCLK
Figure 1. Transmitter Latency Full Rate Mode
Data Reception
The receiver portion deserializes the differential serial data. The serial data is retimed based on an interpolated
clock generated from the reference clock. The serial data is then aligned to the 10-bit word boundaries and
presented to the protocol controller along with receive byte clocks (RBC0, RBC1).
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Receiver Clock Select Mode
There are two modes of operation for the parallel busses. 1)The 10-bit (TBI) mode and 2) 5-bit (DDR) mode.
When in TBI mode, there are two user-selectable clock modes that are controlled by the RBCMODE terminal. 1)
Full-rate clock on RBC0 and 2) Half-rate clocks on RBC0 and RBC1. When in the DDR mode, only a full-rate
clock is available on RBC0; refer to Table 1.
Mode Selection
MODESEL
RBCMODE
MODE
FREQUENCY (TLK2201)
FREQUENCY (TLK2201I)
0
0
TBI half-rate
100-125 MHz
120-125 MHz
0
1
TBI full-rate
100-160 MHz
120-160 MHz
1
0
DDR
100-125 MHz
120-125 MHz
1
1
DDR
100-125 MHz
120-125 MHz
In the half-rate mode, two receive byte clocks (RBC0 and RBC1) are 180 degrees out of phase and operate at
one-half the data rate. The clocks are generated by dividing down the recovered clock. The received data is
output with respect to the two receive byte clocks (RBC0, RBC1) allowing a protocol device to clock the parallel
bytes using the RBC0 and RBC1 rising edges. The outputs to the protocol device, byte 0 of the received data
valid on the rising edge of RBC1. See the timing diagram shown in Figure 2.
td(S)
RBC0
td(S)
RBC1
td(H)
SYNC
td(H)
RD(0-9)
K28.5
DXX.X
DXX.X
DXX.X
K28.5
DXX.X
Figure 2. Synchronous Timing Characteristics Waveforms (TBI half-rate mode)
In the normal-rate mode, only RBC0 is used and operates at full data rate (i.e., 1.25 Gbps data rate produces a
125 MHz clock). The received data is output with respect to the rising edge of RBC0. RBC1 is low in this mode.
See the timing diagram shown in Figure 3.
RBC0
td(S)
td(H)
SYNC
RD(0-9)
K28.5
DXX.X
DXX.X
DXX.X
K28.5
DXX.X
Figure 3. Synchronous Timing Characteristics Waveforms (TBI full-rate mode)
In the double data rate mode, the receiver presents the data on both the rising and falling edges of RBC0. RBC1
is low impedance. The data is clocked bit-0 first, and aligned to the rising edge of RBC0. See the timing diagram
shown in Figure 4.
6
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td(S)
RBC0
td(S)
td(H)
td(H)
SYNC
RD(0-4)
K28.5
K28.5
DXX.X
DXX.X
DXX.X
DXX.X
DXX.X
DXX.X
K28.5
K28.5
DXX.X
Bits 0-4 Bits 5-9
Figure 4. Synchronous Timing Characteristics Waveforms (DDR mode)
The receiver clock interpolator can lock to the incoming data without the need for a lock-to-reference preset. The
received serial data rate (RXP and RXN) is at the same baud rate as the transmitted data stream, ±0.02% (200
PPM) for proper operation.
Receiver Word Alignment
These devices use the IEEE 802.3 Gigabit Ethernet defined 10-bit K28.5 character (comma character) word
alignment scheme. The following sections explain how this scheme works and how it realigns itself.
Comma Character on Expected Boundary
These devices provide 10-bit K28.5 character recognition and word alignment. The 10-bit word alignment is
enabled by forcing the SYNCEN terminal high. This enables the function that examines and compares serial
input data to the seven bit synchronization pattern. The K28.5 character is defined by the 8-bit/10-bit coding
scheme as a pattern consisting of 0011111010 (a negative number beginning with disparity) with the 7 MSBs
(0011111), referred to as the comma character. The K28.5 character was implemented specifically for aligning
data words. As long as the K28.5 character falls within the expected 10-bit boundary, the received 10-bit data is
properly aligned and data realignment is not required. Figure 2 shows the timing characteristics of RBC0, RBC1,
SYNC and RD0-RD9 while synchronized. (Note: the K28.5 character is valid on the rising edge of RBC1).
Comma Character Not on Expected Boundary
If synchronization is enabled and a K28.5 character straddles the expected 10-bit word boundary, then word
realignment is necessary. Realignment or shifting the 10-bit word boundary truncates the character following the
misaligned K28.5, but the following K28.5 and all subsequent data is aligned properly as shown in Figure 5. The
RBC0 and RBC1 pulse widths are stretched or stalled in their current state during realignment. With this design
the maximum stretch that occurs is 20 bit times. This occurs during a worst case scenario when the K28.5 is
aligned to the falling edge of RBC1 instead of the rising edge. Figure 5 shows the timing characteristics of the
data realignment.
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31 Bit
Times
Max Receive
Path Latency
INPUT DATA
K28.5
DXX.X
30 Bit
Times (Max)
K28.5
DXX.X
DXX.X
DXX.X
DXX.X
K28.5
RBC0
RBC1
Worst Case
Misaligned K28.5
RD(0-9)
DXX.X
DXX.X
Corrupt Data
K28.5
DXX.X
DXX.X
Misalignment Corrected
K28.5
DXX.X
DXX.X
DXX.X
K28.5
SYNC
Figure 5. Word Realignment Timing Characteristics Waveforms
Systems that do not require framed data may disable byte alignment by tying SYNCEN low.
When a SYNC character is detected, the SYNC signal is brought high and is aligned with the K28.5 character.
The duration of the SYNC pulse is equal to the duration of the data when in TBI mode. When in DDR mode the
SYNC pulse is present for the entire RBC0 period.
Data Reception Latency
The serial to parallel data latency is the time from when the first bit arrives at the receiver until it is output in the
aligned parallel word with RD0 received as first bit. The minimum latency in TBI mode is 21 bit times and the
maximum latency is 31 bit times. The minimum latency in DDR mode is 27 bit times and maximum latency is 34
bit times.
10 Bit Code
RXP, RXN
td(Rx latency)
RD(0-9)
10 Bit Code
RBC0
Figure 6. Receiver Latency - TBI Normal Mode Shown
Loss of Signal Detection
These devices have a loss of signal (LOS) detection circuit for conditions where the incoming signal no longer
has sufficient voltage level to keep the clock recovery circuit in lock. The LOS is intended to be an indication of
gross signal error conditions, such as a detached cable or no signal being transmitted, and not an indication of
signal coding health. Under a PRBS serial input pattern, LOS is high for signal amplitudes greater than 150 mV.
The LOS is low for all amplitudes below 50 mV. Between 50 mV and 150 mV, LOS is undetermined.
8
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Testability
The loopback function provides for at-speed testing of the transmit/receive portions of the circuitry. The enable
function allows for all circuitry to be disabled so that an Iddq test can be performed. The PRBS function also
allows for a BIST( built-in self test). The terminal setting, TESTEN high, enables the test mode. The terminal
TESTEN has an internal pulldown resistor, so it defaults to normal operation. The TESTEN is only used for
factory testing, and is not intended for the end-user.
Loopback Testing
The transceiver can provide a self-test function by enabling (LOOPEN to high level) the internal loopback path.
Enabling this function causes serial transmitted data to be routed internally to the receiver. The parallel data
output can be compared to the parallel input data for functional verification. (The external differential output is
held in a high-impedance state during the loopback testing.)
Enable Function
When held low, ENABLE disables all quiescent power in both the analog and digital circuitry. This allows an
ultralow-power idle state when the link is not active.
PRBS Function
These devices have a built-in 27-1 PRBS function. When the PRBSEN control bit is set high, the PRBS test is
enabled. A PRBS is generated and fed into the 10-bit parallel transmitter input bus. Data from the normal parallel
input source is ignored during PRBS test mode. The PRBS pattern is then fed through the transmit circuitry as if
it were normal data and sent out to the transmitter. The output can be sent to a (BERT) bit error rate tester or to
the receiver of another TLK2201 or TLK2201I. Since the PRBS is not really random and is really a
predetermined sequence of ones and zeros, the data can be captured and checked for errors by a BERT. These
devices also have a built-in BERT function on the receiver side that is enabled by PRBSEN. It can receive a
PRBS pattern and check for errors, and then reports the errors by forcing the SYNC/PASS terminal low. When
PRBS is enabled, RBCMODE is ignored. MODESEL must be low for the PRBS verifier to function correctly. The
device operates in TBI mode with a full-rate clock on RBC0. The PRBS testing supports two modes (normal and
latched), which are controlled by the SYNCEN input. When SYNCEN is low, the result of the PRBS bit error rate
test is passed to the SYNC/PASS terminal. When SYNCEN is high the result of the PRBS verification is latched
on the SYNC/PASS output (i.e., a single failure forces SYNC/PASS to remain low).
JTAG
The TLK2201 supports an IEEE1149.1 JTAG function while maintaining compatibility with the industry standard
64 pin QFP package footprint. In this way, the TLK2201 installed on a board layout that was designed for the
industry standard footprint such as for the TNETE2201B. (Provided the supply voltage can be programmed from
the older 3.3 V to 2.5 V.) The JTAG pins on the TLK2201 are chosen to either be on the ‘vender-unique’ pins of
the industry standard footprint, or are on pins that were previously power or ground. The TRSTN pin has been
placed on pin 56, which is a ground on the industry standard footprint. In this way, a TLK2201 installed onto the
older footprint has the JTAG tap controller held in reset, and thus disabled. If the JTAG function is desired, then
the 5 JTAG pins TRSTN, TMS, TCK, TDI, and TDO can be used in the usual manner for a JTAG function. If the
JTAG function is not desired, then connecting TRSTN to ground is recommended. TMS and TDI have internal
pullup resistors, and can thus be left unconnected if not used. TDO is an output and should be left unconnected
if JTAG is not used. TCK does not have an internal pullup, and can be tied to GND or PWR if not used, but with
TRSTN low, this input is not used, and thus can be left unconnected.
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ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature (unless otherwise noted)
UNIT
Supply voltage, VDD (2)
-0.3 V to 3 V
Input voltage range at TTL terminals, VI
-0.5 V to 4 V
Input voltage range at any other terminal
-0.3 V to VDD +0.3 V
Storage temperature, Tstg
-65°C to 150°C
Electrostatic discharge
CDM: 1 kV, HBM:2 kV
Characterized free-air operating temperature range:
(1)
(2)
TLK2201
0°C to 70°C
TLK2201I
-40°C to 85°C
Stresses beyond those listed under„ absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under„ recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
DISSIPATION RATING TABLE (1)
PACKAGE
TA≤ 25°C
POWER RATING
OPERATING FACTOR (2)
ABOVE TA = 25°C
TA = 70°C
POWER RATING
RCP64 (3)
5.25 W
46.58 mW/°C
2.89 W
RCP64 (4)
3.17 W
23.70 mW/°C
1.74 W
(5)
2.01 W
13.19 mW/°C
1.11 W
RCP64
(1)
(2)
(3)
(4)
(5)
For more information, refer to TI application note PowerPAD Thermally Enhanced Package, TI literature number SLMA002.
This is the inverse of the traditional junction-to-ambient thermal resistance (RΘJA).
2 oz. Trace and copper pad with solder.
2 oz. Trace and copper pad without solder.
Standard JEDEC high-K board
THERMAL CHARACTERISTICS
PARAMETER
RΘJA
RΘJC
Junction-to-free-air thermal resistance
Junction-to-case-thermal resistance
TEST CONDITION
MIN
Board-mounted, no air flow, high conductivity TI
recommended test board, chip soldered or greased
to thermal land
21.47
Board-mounted, no air flow, high conductivity TI
recommended test board with thermal land but no
solder or grease thermal connection to thermal land
42.20
Board-mounted, no air flow, JEDEC test board
75.83
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MAX
UNIT
°C/W
Board-mounted, no air flow, high conductivity TI
recommended test board, chip soldered or greased
to thermal land
0.38
Board-mounted, no air flow, high conductivity TI
recommended test board with thermal land but no
solder or grease thermal connection to thermal land
0.38
Board-mounted, no air flow, JEDEC test board
10
TYP
°C/W
7.8
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RECOMMENDED OPERATING CONDITIONS
Supply voltage, VDD,VDD(A)
Total supply current IDD,IDD(A)
Total power dissipation PD
MAX
2.3
2.5
2.7
80
Frequency = 1.6 Gbps, Worst case pattern (1)
111
Frequency = 1.25 Gbps PRBS pattern
200
Frequency = 1.6 Gbps Worst case pattern (1)
Enable = 0, Vdda , Vdd = 2.7 V
Startup lock time, PLL
VDD, VDD(A) = 2.5 V, EN↑ to PLL acquire
(1)
NOM
Frequency = 1.25 Gbps, PRBS pattern
Total shutdown current IDD,IDD(A)
Operating free-air temperature, TA
MIN
310
UNIT
V
mA
mW
50
μA
500
μs
TLK2201
0
70
TLK2201I
40
85
°C
Worst case pattern is a pattern that creates a maximum transition density on the serial transceiver.
TLK2201 REFERENCE CLOCK (REFCLK) TIMING REQUIREMENTS
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Frequency
Frequency
Minimum data rate
TYP-0.01%
100
TYP-0.01%
MHz
Maximum data rate
TYP-0.01%
160
TYP-0.01%
MHz
100
ppm
Accuracy
100
Duty cycle
40%
Jitter
50%
Random plus deterministic
60%
40
ps
TLK2201I REFERENCE CLOCK (REFCLK) TIMING REQUIREMENTS
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Frequency
Minimum data rate
TYP-0.01%
120
TYP-0.01%
MHz
Frequency
Maximum data rate
TYP-0.01%
160
TYP-0.01%
MHz
100
ppm
50%
60%
Accuracy
100
Duty cycle
40%
Jitter
Random plus deterministic
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TTL ELECTRICAL CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VOH
High-level output voltage
IOH = -400 μA
VOL
Low-level output voltage
IOL = 1 mA
VIH
High-level input voltage
VIL
Low-level input voltage
IIH
Input high current
VDD = 2.3 V, VIN = 2.0 V
IIL
Input low current
VDD = 2.3 V, VIN = 0.4 V
MIN
TYP
VDD -0.2
2.3
GND
0.25
1.7
MAX
UNIT
V
0.5
V
3.6
V
0.8
V
40
μA
μA
-40
CIN
4
pf
TRANSMITTER/RECEIVER CHARACTERISTICS
PARAMETER
Vod = |TxD-TxN|
V(cm)
Transmit common mode voltage range
TEST CONDITIONS
MIN
TYP
MAX
Rt = 50 Ω
Rt = 75 Ω
600
850
1100
800
1050
1200
Rt = 50 Ω
1000
1250
1400
Rt = 75 Ω
1000
1250
1400
Receiver Input voltage requirement, Vid = |RxP RxN|
200
Receiver common mode voltage range, (RxP +
RxN)/2
1000
1250
350
UNIT
mV
mV
1600
mV
2250
mV
350
μA
2
pF
Ilkg(R)
Receiver input leakage current
CI
Receiver input capacitance
t(TJ)
Serial data total jitter (peak-to-peak)
Differential output jitter,
Random + deterministic,
PRBS pattern, Rω = 125 MHz
0.24
UI
t(DJ)
Serial data deterministic jitter (peak-to-peak)
Differential output jitter, PRBS
pattern, Rω = 125 MHz
0.12
UI
tr, tf
Differential signal rise, fall time (20% to 80%)
RL = 50 Ω, CL = 5 pF, See
Figure 9 and Figure 10
100
250
ps
Serial data jitter tolerance minimum required eye
opening, (per IEEE-802.3 specification)
Differential input jitter,
Random + deterministic, Rω =
125 MHz
0.25
Receiver data acquisition lock time from powerup
Data relock time from loss of synchronization
td(Tx latency)
Tx latency
td(Rx latency)
Rx latency
TBI modes
See Figure 1
DDR mode
TBI modes
See Figure 6
DDR mode
80%
50%
20%
TX+
UI
500
μs
1024
Bit times
19
20
29
30
21
31
27
34
UI
UI
∼V
∼V
tf
tr
80%
50%
20%
TXtf
∼V
∼V
tr
∼ 1V
80%
0V
VOD
20%
∼ -1V
Figure 7. Differential and Common-Mode Output Voltage Definitions
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CL
5 pF
50 Ω
50 Ω
CL
5 pF
Figure 8. Transmitter Test Setup
LVTTL OUTPUT SWITCHING CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
tr(RBC)
Clock rise time
0.3
1.5
tf(RBC)
Clock fall time
0.3
1.5
tr
Data rise time
0.3
1.5
tf
Data fall time
0.3
1.5
tsu(D1)
Data setup time (RD0..RD9),
Data valid prior to RBC0 rising
TBI normal mode (see Figure 3)
2.5
ns
th(D1)
Data hold time (RD0..RD9),
Data valid after RBC0 rising
TBI normal mode (see Figure 3)
2
ns
tsu(D2)
Data setup time (RD0..RD4)
DDR mode, Rω = 125 MHz (see Figure 4)
2
ns
th(D2)
Data hold time (RD0..RD4)
DDR mode, Rω = 125 MHz (see Figure 4)
0.8
ns
tsu(D3)
Data setup time (RD0..RD9)
TBI half-rate mode, Rω = 125 MHz (see Figure 2)
2.5
ns
th(D3)
Data hold time (RD0..RD9)
TBI half-rate mode, Rω = 125 MHz (see Figure 2)
1.5
ns
80% to 20% output voltage, C = 5 pF (see Figure 9)
ns
ns
1.4 V
CLOCK
tf
tr
80%
50%
20%
DATA
2V
0.8 V
tf
tr
Figure 9. TTL Data I/O Valid Levels for AC Measurement
TRANSMITTER TIMING REQUIREMENTS
over recommended operating conditions (unless otherwise noted)
PARAMETER
tsu(D4)
Data setup time (TD0..TD9)
th(D4)
Data hold time (TD0..TD9)
tsu(D5)
Data setup time (TD0..TD9)
th(D5)
Data hold time (TD0..TD9)
tr, tf
TD[0,9] Data rise and fall time
TEST CONDITIONS
TBI modes
DDR modes
See Figure 11
Copyright © 2000–2007, Texas Instruments Incorporated
Product Folder Link(s): TLK2201 TLK2201I
MIN
TYP
MAX
1.6
UNIT
ns
0.8
0.7
ns
0.5
2
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ns
13
TLK2201
TLK2201I
ETHERNET TRANSCEIVERS
www.ti.com
SLLS420F – JUNE 2000 – REVISED SEPTEMBER 2007
APPLICATION INFORMATION
8B/10B Transmission Code
The PCS maps GMII signals into ten-bit code groups and vice versa, using an 8b/10b block coding scheme. The
PCS uses the transmission code to improve the transmission characteristics of information to be transferred
across the link. The encoding defined by the transmission code ensures that sufficient transitions are present in
the PHY bit stream to make clock recovery possible in the receiver. Such encoding also greatly increases the
likelihood of detecting any single or multiple bit errors that may occur during transmission and reception of
information. The 8b/10b transmission code specified for use has a high transition density, is run length limited,
and is dc-balanced. The transition density of the 8b/10b symbols ranges from 3 to 8 transitions per symbol. The
definition of the 8b/10b transmission code is specified in IEEE 802.3 Gigabit Ethernet and ANSI X3.230-1994
(FC-PH), clause 11.
8b/10b transmission code uses letter notation describing the bits of an unencoded information octet. The bit
notation of A,B,C,D,E,F,G,H for an unencoded information octet is used in the description of the 8b/10b
transmission code-groups, where A is the LSB. Each valid code group has been given a name using the
following convention: /Dx.y/ for the 256 valid data code-groups and /Kx.y/ for the special control code-groups,
where y is the decimal value of bits EDCBA and x is the decimal value of bits HGF (noted as K).
Thus, an octet value of FE representing a code-group value of K30.7 would be represented in bit notation as 111
11110.
VDD
TXP
ZO
5 kΩ
RXP
7.5 kΩ
ZO
GND
+
_
VDD
ZO
5 kΩ
ZO
TXN
RXN
7.5 kΩ
GND
Transmitter
Media
Receiver
Figure 10. High-Speed I/O Directly-Coupled Mode
VDD
TXP
ZO
5 kΩ
RXP
7.5 kΩ
ZO
GND
+
_
VDD
ZO
5 kΩ
TXN
ZO
RXN
7.5 kΩ
GND
Transmitter
Media
Receiver
Figure 11. High-Speed I/O AC-Coupled Mode
14
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Copyright © 2000–2007, Texas Instruments Incorporated
Product Folder Link(s): TLK2201 TLK2201I
TLK2201
TLK2201I
ETHERNET TRANSCEIVERS
www.ti.com
SLLS420F – JUNE 2000 – REVISED SEPTEMBER 2007
5 Ω at 100 MHz
2.5 V
2.5 V
18
VDD VDDA
GND
0.01 µF
VDDPLL
GNDPLL
64
GNDA
TLK2201
TLK2201I
17
TESTEN
10
TD0-TD9
22
16
TXP
62
Controlled Impedance
Transmission Line
61
Controlled Impedance
Transmission Line
54
Controlled Impedance
Transmission Line
REFCLK
PRBSEN
19
LOOPEN
24
Host
Protocol
Device
47
10
SYNCEN
TXN
SYNC/PASS
RD0-RD9
2
RBC0-RBC1
28
26
ENABLE
RXP
LOS
32
Rt
50 Ω
Rt
50 Ω
RBCMODE
15
MODESEL
49
55
48
JTAG
Controller
56
27
TCK
JTMS
RXN
Controlled Impedance
Transmission Line
52
JTDI
JTRSTN
JTDO
Figure 12. Typical Application Circuit (AC mode)
Designing With PowerPAD™
The TLK2201 and TLK2201I are housed in a high performance, thermally enhanced, 64-pin VQFP (RCP64)
PowerPAD package. Use of the PowerPAD package does not require any special considerations except to note
that the PowerPAD, which is an exposed die pad on the bottom of the device, is a metallic thermal and electrical
conductor. Therefore, if not implementing PowerPAD PCB features, the use of solder masks (or other assembly
techniques) may be required to prevent any inadvertent shorting by the exposed PowerPAD of connection etches
or vias under the package. It is strongly recommended that the PowerPAD be soldered to the thermal land. The
recommended convention, however, is to not run any etches or signal vias under the device, but to have only a
grounded thermal land as explained below. Although the actual size of the exposed die pad may vary, the
minimum size required for the keepout area for the 64-pin PFP PowerPAD package is 8 mm נ8 mm.
It is recommended that there be a thermal land, which is an area of solder-tinned-copper, underneath the
PowerPAD package. The thermal land varies in size depending on the PowerPAD package being used, the PCB
construction, and the amount of heat that needs to be removed. In addition, the thermal land may or may not
contain numerous thermal vias depending on PCB construction.
Copyright © 2000–2007, Texas Instruments Incorporated
Product Folder Link(s): TLK2201 TLK2201I
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TLK2201
TLK2201I
ETHERNET TRANSCEIVERS
www.ti.com
SLLS420F – JUNE 2000 – REVISED SEPTEMBER 2007
Other requirements for thermal lands and thermal vias are detailed in the TI application note PowerPAD
Thermally Enhanced Package Application Report, TI literature number SLMA002, available via the TI Web pages
beginning at URL: http://www.ti.com.
Figure 13. Example of a Thermal Land
For the TLK2201, this thermal land must be grounded to the low-impedance ground plane of the device. This
improves not only thermal performance but also the electrical grounding of the device. It is also recommended
that the device ground pin landing pads be connected directly to the grounded thermal land. The land size must
be as large as possible without shorting device signal pins. The thermal land may be soldered to the exposed
PowerPAD using standard reflow soldering techniques.
While the thermal land may be electrically floated and configured to remove heat to an external heat sink, it is
recommended that the thermal land be connected to the low-impedance ground plane for the device. More
information may be obtained from the TI application note PHY Layout, TI literature number SLLA020.
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Copyright © 2000–2007, Texas Instruments Incorporated
Product Folder Link(s): TLK2201 TLK2201I
PACKAGE OPTION ADDENDUM
www.ti.com
12-Aug-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TLK2201IRCP
LIFEBUY
HVQFP
RCP
64
160
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
TLK2201I
TLK2201RCP
LIFEBUY
HVQFP
RCP
64
160
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
0 to 70
TLK2201
TLK2201RCPR
LIFEBUY
HVQFP
RCP
64
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
0 to 70
TLK2201
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
12-Aug-2016
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TLK2201RCPR
Package Package Pins
Type Drawing
HVQFP
RCP
64
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
1000
330.0
24.4
Pack Materials-Page 1
13.0
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
13.0
1.5
16.0
24.0
Q2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TLK2201RCPR
HVQFP
RCP
64
1000
367.0
367.0
45.0
Pack Materials-Page 2
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