AOZ8000CI

AOS Semiconductor Product Reliability Report AOZ8000CI, rev 2 Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc 495 Mercury Drive Sunnyvale, CA 94085 U.S. Tel: (408) 830-9742 www.aosmd.com Mar 27, 2007 1 This AOS product reliability report summarizes the qualification result for AOZ8000CI. Review of t he electrical test results confirm that AOZ8000CI pass AOS quality and reliability requirements for product release. The continuous qualification testing and reliability monitoring program ensure that all outgoing products will continue to meet AOS quality and reliability standards. Table of Contents: I. II. III. IV. V. VI. Product Description Package and Die information Qualification Test Requirements Qualification Tests Result Reliability Evaluation Quality Assurance Information I. Product Description: The AOZ8000CI is a transient voltage suppressor array designed to protect high speed data lines from ESD and lightning. The product comes in RoHS compliant, SOT-23 package and is rated over a -40°C to +85°C ambient temperature range. . Absolute Maximum Ratings P arameter VP-VN 6V Peak Pulse Current (Ipp), tp=8/20uS 5A Storage Temperature (TS) -65°C to +150°C ESD Rating per IEC61000-4-2, contact (1) ±12kV ESD Rating per IEC61000-4-2, air (2) ±15kV ESD Rating per Human Body Model (2) ±15kV Junction Temperature (Tj) -40°C to +125°C Notes: (1) IEC-61000-4-2 discharge with CDischarge=150pF, RDischarge=330Ω (2) Human Body Discharge per MIL-STD-883, Method 3015 CDischarge=100pF, RDischarge=1.5kΩ II. Package and Die Information: Product ID Process Package Type Die L/F material Die attach material Die bond wire Mold Material Plating Material AOZ8000CI UMC 0.5um 5/18V 2P3M process SOT-23 UE003A3 (size: 716 x 616 um) Copper A194FH 84-3J epoxy Au, 1mil MP8000CH4 Pure Tin 2 III. Qualification Tests Requirments • • 2 lots of AOZ8000CI up to 168 hrs of B/I for New Product release. 2 lots of package qual testing (PCT, 250 cycles TC) for SOT-23 for package release to manufacturing. IV. Qualification Tests Result Test Item PreConditioning Test Condition Per JESD 22-A113 0 85 C /85%RH, 3 cyc 0 reflow@260 C Per JESD 22-A108_B Vdd=6V Temp = 125 0C Per JESD 22-A108_B Vdd=6V Temp = 125 0C '130 +/- 2 0C, 85%RH, 33.3 psi, at VCC min power dissapation. Sample Size 2 lots (82 /lot) Result pass Comment Lot 1 (wafer lot# FN2MT.54, marking: AB002), 82 units, passed pre-conditioning. Lot 2 (wafer lot# FN2MT.54, marking: AB003), 82 units, passed pre-conditioning. Lot 1 (wafer lot# F9AN1.51, wafer# 4, marking: AB001), 80 units, passed 168 hrs . Lot 2 (wafer lot# FN2MT.54, wafer# 18, marking: AB003), 80 units, passed 168 hrs . Lot 1 (wafer lot# FNG88-2/3, marking: AC001), 80 units, passed 500 hrs . Lot 2 (wafer lot# FAYY3.02-3 marking: AB008), 80 units, passed 168 hrs . Lot 1 (wafer lot# FN2MT.54, marking: AB002), 60 units, passed HAST 100 hrs. Lot 2 (wafer lot# FN2MT.54, marking: AB003), 60 units, passed HAST 100 hrs. Lot 1 (wafer lot# FN2MT.54, marking: AB002), 82 units, passed TC 500 cycles. Lot 2 (wafer lot# FN2MT.54, marking: AB003), 82 units, passed TC 500 cycles. Lot 1 (wafer lot# FN2MT.54, marking: AB002), 82 units, passed PCT 96 hrs. Lot 2 (wafer lot# FN2MT.54, marking: AB003), 82 units, passed PCT 96 hrs. Lot 1 (wafer lot# F9AN1.51, assembly marking: Z96R11), 20 units passed ±12kV Lot 2 (wafer lot# F162T, assembly marking: B1001), 10 units passed ±12kV Lot 1 (wafer lot# F9AN1.51, assembly marking: Z96R11), 20 units passed ±15kV Lot 1 (wafer lot# F162T, assembly marking: B1001), 3 units passed Latch-up. HTOL (old UE003A process) HTOL (new UH_EPI process) HAST 2 lots (80 /lot) pass 2 lots (80 /lot) pass 2 lots (60 /lot) pass Temperature Cycle '-65 0C to +150 0C, air to air (2cyc/hr) 2 lots (82 /lot) pass Pressure Pot 121C, 15+/-1 PSIG, RH= 100% 2 lots (82 /lot) pass ESD Rating Per IEC-61000-4-2, contact 30 units pass ESD Rating Latch-up Per IEC-61000-4-2, air Per JESD78A 20 units 3 units pass pass T he qualification test results confirm that AOZ8000CI pass AOS quality and reliability requirements for product release. 3 V. Reliability Evaluation A. Failure Rate Prediction FIT rate (per billion): see note 1 MTBF = see note 1 The presentation of FIT rate for the individual product reliability is restricted by the limited burn-in sample size of AOZ8000CI. T he calculation will be presented (using the method discussed below) on the final qualification report when more data are available. 1 AOS uses industry standard techniques (JEDEC Standard JESD 85) for failure rate prediction by applying the Arrhenius equation with an activation energy of 0.7eV and 60% of upper confidence level on the failure rate calculation. FIT means one failure per billion hours. The failure rate and MTBF are calculated as follows: AF = exp{(Ea/k) x [1/T0-1/Ts]} Looking up the χ2 /2 table (see above) for zero failure (see HTOL result above) with 60% confidence, the value of (χ2[CL,(2f+2)] /2) is 0.92. Failure Rate = Chi2 [CL, (2f+2)] x 109 / [2 (ss) (t) (AF)] 9 MTBF = 10 / FIT Chi² ( χ2) = Chi Squared Distribution, determined by the number of failures and confidence interval ss = Total Number of units from HTOL testing t = Duration of HTOL testing AF = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [AF] = exp [Ea / k (1/Tj u – 1/Tj s)] Tj s = Stressed junction temperature in degree (Kelvin), K = C+273 Tj u = Used junction temperature in degree (Kelvin), K = C+273 k = Boltznan’s constant, 8.617x10-5 V / K B. Package Qualification Testing Package qual. testing are performed (see section IV) to ensure the product meet AOS quality and reliability standards. VI. Quality Assurance Information Acceptable Quality Level for outgoing inspection: 0.1% for electrical and visual. Guaranteed Outgoing Defect Rate: < 50 ppm Quality Sample Plan: conform to Mil-Std -105D 4