HLMP-3351-D0000

Data Sheet HLMP-3351, HLMP-3366, HLMP-3451, HLMP-3554, HLMP-3568 T-1¾ (5 mm) Low Profile LED Lamps Description The Broadcom® low profile T-1¾ package provides space savings and is excellent for backlighting applications. Package Dimensions Features        Broadcom High intensity AlInGaP material Low profile: 5.8 mm (0.23 in.) nominal T-1¾ diameter package Diffused and non-diffused types General-purpose leads IC compatible/low current requirements Reliable and rugged AV02-1559EN August 10, 2021 HLMP-3351, HLMP-3366, HLMP-3451, HLMP-3554, HLMP-3568 Data Sheet T-1¾ (5 mm) Low Profile LED Lamps Device Selection Guide Color Package Description Viewing Angle (degree) 2½a Red T-1¾ Tinted, diffused 50 Yellow Green T-1¾ Tinted, non-diffused 45 T-1¾ Tinted, diffused 50 T-1¾ Tinted, diffused Luminous Intensity Iv (mcd) at 10 mA Part Number HLMP- Min. Max. 3351 5.4 — 3351-D00xx 2.1 — 3351-F00xx 5.4 — 3366 13.8 — 3451 3.6 — 3451-D00xx 3.6 — 50 T-1¾ Tinted, non-diffused 3554 6.7 — 3554-E00xx 6.7 — 3568 10.6 — 40 a. ½ is the off-axis angle at which the luminous intensity is half the axial luminous intensity. Part Numbering System H L M P - x1 x2 x3 x4 - x5 x6 x7 x8 Code Description Option x1 Package Type 3 T-1¾ (5 mm) x2 Color 3 Red 4 Yellow x9 5 Green x3 x4 Lens Option 5x Tinted, diffused 6x Tinted, non-diffused x5 Minimum Intensity Bin See Intensity Bin Limits x6 Maximum Intensity Bin 0 Open bins (no maximum Iv bin limit) x7 Color Bin Option 0 Full distribution x8 x9 Packing Option Broadcom 00 Bulk (loose forms packaging) 01 Tape and reel, crimped leads 02 Tape and reel, straight leads R1 Tape and reel, counterclockwise AV02-1559EN 2 HLMP-3351, HLMP-3366, HLMP-3451, HLMP-3554, HLMP-3568 Data Sheet T-1¾ (5 mm) Low Profile LED Lamps Bin Information Intensity Range (mcd) Intensity Bin Limits Color Bin Min. Max. Yellow D 4.0 6.5 E 6.5 10.3 F 10.3 16.6 Intensity Range (mcd) Color Red Bin Min. Max. G 16.6 26.5 26.5 42.3 42.3 67.7 D 2.4 3.8 H E 3.8 6.1 I F 6.1 9.7 J 67.7 108.2 108.2 173.2 173.2 250.0 G 9.7 15.5 K H 15.5 24.8 L I 24.8 39.6 M 250.0 360.0 360.0 510.0 510.0 800.0 J 39.6 63.4 N K 63.4 101.5 O L 101.5 162.4 P 800.0 1250.0 1250.0 1800.0 M 162.4 234.6 Q N 234.6 340.0 R 1800.0 2900.0 O 340.0 540.0 S 2900.0 4700.0 850.0 T 4700.0 7200.0 U 7200.0 11700.0 P 540.0 Q 850.0 1200.0 R 1200.0 1700.0 V 11700.0 18000.0 W 18000.0 27000.0 E 7.6 12.0 19.1 S 1700.0 2400.0 T 2400.0 3400.0 U 3400.0 4900.0 F 12.0 7100.0 G 19.1 30.7 H 30.7 49.1 V 4900.0 Green W 7100.0 10200.0 X 10200.0 14800.0 I 49.1 78.5 78.5 125.7 Y 14800.0 21400.0 J Z 21400.0 30900.0 K 125.7 201.1 289.0 L 201.1 M 289.0 417.0 N 417.0 680.0 O 680.0 1100.0 P 1100.0 1800.0 Q 1800.0 2700.0 R 2700.0 4300.0 S 4300.0 6800.0 T 6800.0 10800.0 U 10800.0 16000.0 V 16000.0 25000.0 W 25000.0 40000.0 Maximum tolerance for each bin limit is ± 18%. Broadcom AV02-1559EN 3 HLMP-3351, HLMP-3366, HLMP-3451, HLMP-3554, HLMP-3568 Data Sheet T-1¾ (5 mm) Low Profile LED Lamps Color Categories Color Green Yellow Category Number Lambda (nm) Min. Max. 6 561.5 564.5 5 564.5 567.5 4 567.5 570.5 3 570.5 573.5 2 573.5 576.5 1 582.0 584.5 3 584.5 587.0 2 587.0 589.5 4 589.5 592.0 5 592.0 593.0 Tolerance for each bin limit is ± 0.5 nm. Packaging Option Matrix Packaging Option Code Definition 00 Bulk Packaging, minimum increment 500 pieces/bag 01 Tape and Reel, crimped leads, minimum increment 1300 pieces/reel 02 Tape and Reel, straight leads, minimum increment 1300 pieces/reel R1 Tape and Reel, crimped leads, reeled counterclockwise, anode leaves first, minimum increment 1300 pieces/reel NOTE: Broadcom All categories are established for classification of products. Products may not be available in all categories. Contact your local Broadcom representative for further clarification/information. AV02-1559EN 4 HLMP-3351, HLMP-3366, HLMP-3451, HLMP-3554, HLMP-3568 Data Sheet T-1¾ (5 mm) Low Profile LED Lamps Absolute Maximum Ratings at TA = 25°C Parameter Red Yellow Green Units Peak Forward Current 90 60 90 mA Average Forward Currenta 25 20 25 mA DC Currentb 30 20 30 mA Power Dissipationc 135 85 135 mW Reverse Voltage (IR = 100 µA) 5 5 5 V Operating Temperature Range –40 to +100 –40 to +100 –20 to +100 °C Storage Temperature Range –40 to +100 –40 to +100 –40 to +100 °C Wave Soldering Temperature (1.59 mm [0.063 in.] from Body) 250°C for 3 seconds a. See Figure 4 (Red), Figure 8 (Yellow), or Figure 12 (Green) to establish pulsed operating conditions. b. For Green Series, derate linearly from 50°C at 0.5 mA/°C. For Red and Yellow Series, derate linearly from 50°C at 0.2 mA/°C. c. For Green Series, derate power linearly from 25°C at 1.8 mW/°C. For Red and Yellow Series, derate power linearly from 50°C at 1.6 mW/°C. Figure 1: Relative Intensity vs. Wavelength 1 RELATIVE INTENSITY 0.9 GREEN 0.8 YELLOW 0.7 RED 0.6 0.5 0.4 0.3 0.2 0.1 0 450 500 550 600 650 700 750 WAVELENGTH - nm Broadcom AV02-1559EN 5 HLMP-3351, HLMP-3366, HLMP-3451, HLMP-3554, HLMP-3568 Data Sheet T-1¾ (5 mm) Low Profile LED Lamps Red HLMP-335x/-336x Series Electrical/Optical Specifications at TA = 25°C Device HLMP- Min. Typ. Max. 3351 — 50 — 3366 — 45 — — 632 — nm Measurement at Peak Dominant Wavelength — 626 — nm Note b ½ Spectral Line Halfwidth — 14 — nm s Speed of Response — 90 — ns C Capacitance — 11 — pF RJ-PIN Thermal Resistance — 260 — °C/W VF Forward Voltage — 1.9 2.4 V IF = 10 mA VR Reverse Breakdown Voltage 5.0 — — V IR = 100 µA V Luminous Efficacy — 180 — lm/W Symbol Description 2½ Including Angle Between Half Luminous Intensity Points PEAK Peak Wavelength d Units Test Conditions Deg. Note a VF = 0; f = 1 MHz Junction to Cathode Lead Note c a. ½ is the off-axis angle at which the luminous intensity is half the axial luminous intensity. b. Dominant wavelength, d, is derived from the CIE chromaticity diagram and represents the single wavelength that defines the color of the device. c. Radiant Intensity, Ie, in watts/steradian may be found from the equation Ie = Iv / v, where Iv is the luminous intensity in candelas and hv is the luminous efficacy in lumens/watt. Figure 2: Forward Current vs. Forward Voltage Figure 3: Relative Luminous Intensity vs. Forward Current 2 25 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 10 mA) FORWARD CURRENT - mA 30 20 15 10 5 0 0 1 2 FORWARD VOLTAGE - V 1.5 1 0.5 3 0 0 5 10 15 20 25 30 DC FORWARD CURRENT - mA Broadcom AV02-1559EN 6 HLMP-3351, HLMP-3366, HLMP-3451, HLMP-3554, HLMP-3568 Data Sheet Figure 4: Maximum Tolerable Peak Current vs. Pulse Duration (IDC MAX as per MAX ratings) T-1¾ (5 mm) Low Profile LED Lamps Figure 5: Relative Luminous Intensity vs. Angular Displacement HLMP-3366 HLMP-3351 Yellow HLMP-345x Series Electrical/Optical Specifications at TA = 25°C Device HLMP- Min. Typ. Max. 3451 — 50 — Deg. Peak Wavelength — 590 — nm Measurement at Peak d Dominant Wavelength — 589 — nm Note b ½ Spectral Line Halfwidth — 12 — nm s Speed of Response — 90 — ns C Capacitance — 15 — pF RJ-PIN Thermal Resistance — 260 — °C/W VF Forward Voltage — 1.9 2.4 V IF = 10 mA VR Reverse Breakdown Voltage 5.0 — — V IR = 100 µA V Luminous Efficacy — 500 — lm/W Symbol Description 2½ Including Angle Between Half Luminous Intensity Points PEAK Units Test Conditions Note a VF = 0; f = 1 MHz Junction to Cathode Lead Note c a. ½ is the off-axis angle at which the luminous intensity is half the axial luminous intensity. b. Dominant wavelength, d, is derived from the CIE chromaticity diagram and represents the single wavelength that defines the color of the device. c. Radiant Intensity, Ie, in watts/steradian may be found from the equation Ie = Iv / v, where Iv is the luminous intensity in candelas and hv is the luminous efficacy in lumens/watt. Broadcom AV02-1559EN 7 HLMP-3351, HLMP-3366, HLMP-3451, HLMP-3554, HLMP-3568 Data Sheet Figure 6: Forward Current vs. Forward Voltage T-1¾ (5 mm) Low Profile LED Lamps Figure 7: Relative Luminous Intensity vs. Forward Current 2 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 10 mA) FORWARD CURRENT - mA 20 15 10 5 0 0 1 2 3 FORWARD VOLTAGE - V Figure 8: Maximum Tolerable Peak Current vs. Pulse Duration (IDC MAX as per MAX ratings) 1.5 1 0.5 0 0 5 10 15 20 DC FORWARD CURRENT - mA Figure 9: Relative Luminous Intensity vs. Angular Displacement HLMP-3466 HLMP-3451 Broadcom AV02-1559EN 8 HLMP-3351, HLMP-3366, HLMP-3451, HLMP-3554, HLMP-3568 Data Sheet T-1¾ (5 mm) Low Profile LED Lamps Green HLMP-355x/-356x Series Electrical/Optical Specifications at TA = 25°C Device HLMP- Min. Typ. Max. 3554 — 50 — Deg. Peak Wavelength — 570 — nm Measurement at Peak d Dominant Wavelength — 569 — nm Note b ½ Spectral Line Halfwidth — 13 — nm s Speed of Response — 500 — ns C Capacitance — 18 — pF RJ-PIN Thermal Resistance — 260 — °C/W VF Forward Voltage — 2.0 2.7 V IF = 10 mA VR Reverse Breakdown Voltage 5.0 — — V IR = 100 µA V Luminous Efficacy — 640 — lm/W Symbol Description 2½ Including Angle Between Half Luminous Intensity Points PEAK 3568 Units Test Conditions Note a 40 VF = 0; f = 1 MHz Junction to Cathode Lead Note c a. ½ is the off-axis angle at which the luminous intensity is half the axial luminous intensity. b. Dominant wavelength, d, is derived from the CIE chromaticity diagram and represents the single wavelength that defines the color of the device. c. Radiant Intensity, Ie, in watts/steradian may be found from the equation Ie = Iv / v, where Iv is the luminous intensity in candelas and hv is the luminous efficacy in lumens/watt. Figure 10: Forward Current vs. Forward Voltage Figure 11: Relative Luminous Intensity vs. Forward Current 2.5 25 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 10 mA) FORWARD CURRENT - mA 30 20 15 10 5 0 0 1 2 FORWARD VOLTAGE - V Broadcom 3 2 1.5 1 0.5 0 0 5 10 15 20 25 DC FORWARD CURRENT - mA 30 AV02-1559EN 9 HLMP-3351, HLMP-3366, HLMP-3451, HLMP-3554, HLMP-3568 Data Sheet Figure 12: Maximum Tolerable Peak Current vs. Pulse Duration (IDC MAX as per MAX ratings) T-1¾ (5 mm) Low Profile LED Lamps Figure 13: Relative Luminous Intensity vs. Angular Displacement HLMP-3568 HLMP-3554 Broadcom AV02-1559EN 10 HLMP-3351, HLMP-3366, HLMP-3451, HLMP-3554, HLMP-3568 Data Sheet Precautions T-1¾ (5 mm) Low Profile LED Lamps  Lead Forming    The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. For better control, use the proper tool to precisely form and cut the leads to applicable length rather than doing it manually. If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground that prevents mechanical stress due to lead cutting from traveling into LED package. Use this method for the hand soldering operation, because the excess lead length also acts as small heat sink. Soldering and Handling   Take care during the PCB assembly and soldering process to prevent damage to the LED component. LED component may be effectively hand soldered to PCB. However, do this under unavoidable circumstances, such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59 mm. Soldering the LED using soldering iron tip closer than 1.59 mm might damage the LED. 1.59 mm   Wave Solderinga, b NOTE: 1. PCBs with different size and design (component density) will have a different heat mass (heat capacity). This might cause a change in temperature experienced by the board if the same wave soldering setting is used. Therefore, recalibrate the soldering profile again before loading a new type of PCB. 2. Take extra precautions during wave soldering to ensure that the maximum wave temperature does not exceed 250°C and the solder contact time does not exceed 3s. Over-stressing the LED during the soldering process might cause premature failure to the LED due to delamination.    Apply ESD precautions on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Refer to Broadcom application note AN 1142 for details. The soldering iron used must have a grounded tip to ensure electrostatic charge is properly grounded. Recommended soldering condition. Manual Solder Dipping Pre-heat Temperature 105°C max. — Pre-heat Time 60s max. Peak Temperature 250°C max. 260°C max. Dwell Time 3s max. 5s max. — a. The preceding conditions refer to measurement with a thermocouple mounted at the bottom of the PCB. Set and maintain wave soldering parameters according to the recommended temperature and dwell time. Perform daily checks on the soldering profile to ensure that it always conforms to the recommended soldering conditions.  Loosely fit any alignment fixture that is being applied during wave soldering and do not apply weight or force on the LED. Use nonmetal material because it absorbs less heat during the wave soldering process. At elevated temperature, LED is more susceptible to mechanical stress. Therefore, allow the PCB to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. If PCB board contains both through-hole (TH) LED and other surface-mount components, solder surface-mount components on the top side of the PCB. If the surface mount must be on the bottom side, solder these components using reflow soldering prior to the insertion of the TH LED. The recommended PC board plated through holes (PTH) size for LED component leads follows. LED Component Lead Size Diagonal Plated ThroughHole Diameter Lead size (typ.) 0.45 × 0.45 mm 0.636 mm 0.98 to 1.08 mm (0.018 × 0.018 in.) (0.025 in.) (0.039 to 0.043 in.) Dambar shear- 0.65 mm off area (max.) (0.026 in.) 0.919 mm (0.036 in.) Lead size (typ.) 0.50 × 0.50 mm 0.707 mm 1.05 to 1.15 mm (0.020 × 0.020 in.) (0.028 in.) (0.041 to 0.045 in.) Dambar shear- 0.70 mm off area (max.) (0.028 in.) 0.99 mm (0.039 in.) b. Use only bottom pre-heaters to reduce thermal stress experienced by LED. Broadcom AV02-1559EN 11 HLMP-3351, HLMP-3366, HLMP-3451, HLMP-3554, HLMP-3568 Data Sheet NOTE:  T-1¾ (5 mm) Low Profile LED Lamps Refer to application note AN1027 for more information on soldering LED components. Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. Figure 14: Example of Wave Soldering Temperature Profile for TH LED Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead-free solder alloy) LAMINAR HOT AIR KNIFE TURBULENT WAVE 250 Flux: Rosin flux Solder bath temperature: 245qC ± 5 qC (maximum peak temperature = 250qC) TEMPERATURE (qC) 200 Dwell time: 1.5s – 3.0s (maximum = 3 seconds) 150 Note: Allow for board to be sufficiently cooled to room temperature before you exert mechanical force. 100 50 PREHEAT 0 Broadcom 10 20 30 40 50 60 TIME (SECONDS) 70 80 90 100 AV02-1559EN 12 Broadcom, the pulse logo, Connecting everything, Avago Technologies, Avago, and the A logo are among the trademarks of Broadcom and/or its affiliates in the United States, certain other countries, and/or the EU. Copyright © 2008–2021 Broadcom. All Rights Reserved. The term “Broadcom” refers to Broadcom Inc. and/or its subsidiaries. For more information, please visit www.broadcom.com. Broadcom reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design. Information furnished by Broadcom is believed to be accurate and reliable. However, Broadcom does not assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others.