User's Guide
SLUUB79 – May 2015
bq27542-G1 Single-Cell Impedance Track™ Technology
Evaluation Module
This evaluation module (EVM) is a complete evaluation system for the bq27542. The EVM includes one
bq27542 circuit module, a current sense resistor, and one thermistor. The circuit module includes one
bq27542 integrated circuit (IC), and all other onboard components necessary to monitor and predict
capacity. The circuit module connects directly across the cell in a battery. With the EV2400 interface board
and software, the user can read the bq27542 data registers, program the chipset for different pack
configurations, log cycling data for further evaluation, and evaluate the overall functionality of the bq27542
solution under different charge and discharge conditions.
9
10
Contents
Features ....................................................................................................................... 2
1.1
Kit Contents.......................................................................................................... 2
1.2
Ordering Information ............................................................................................... 2
bq27542-Based Circuit Module ............................................................................................ 2
2.1
Circuit Module Connections ....................................................................................... 2
2.2
Pin Descriptions ..................................................................................................... 3
Circuit Module Physical Layouts, Schematic, and Bill of Materials ................................................... 3
3.1
Board Layout ........................................................................................................ 3
3.2
Bill of Materials ...................................................................................................... 5
3.3
Schematic ............................................................................................................ 6
3.4
bq27542 Circuit Module Performance Specification Summary ............................................... 7
EVM Hardware and Software Setup ...................................................................................... 7
4.1
Software Installation ................................................................................................ 7
Troubleshooting Unexpected Dialog Boxes .............................................................................. 7
Hardware Connection ....................................................................................................... 8
6.1
Connecting the bq27542 Circuit Module to a Battery Cell .................................................... 8
6.2
PC Interface Connection ........................................................................................... 8
Operation ..................................................................................................................... 9
7.1
Starting the Program ............................................................................................... 9
7.2
Setting Programmable bq27542 Options ...................................................................... 10
Calibrate Screen ............................................................................................................ 11
8.1
To Calibrate the bq27542 ........................................................................................ 11
8.2
CC Offset Calibration ............................................................................................. 11
8.3
Voltage Calibration ................................................................................................ 11
8.4
Board Offset Calibration .......................................................................................... 11
8.5
Temperature Calibration .......................................................................................... 11
8.6
Pack Current Calibration ......................................................................................... 12
Advanced Communication I2C ........................................................................................... 13
Related Documentation From Texas Instruments ..................................................................... 15
1
bq27542EVM-696 Layout, Silk Screen
1
2
3
4
5
6
7
8
List of Figures
2
3
4
5
...................................................................................
Top Assembly ................................................................................................................
Top Layer .....................................................................................................................
Bottom Layer .................................................................................................................
Schematic .....................................................................................................................
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3
4
4
5
6
1
Features
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6
Registers Screen............................................................................................................. 9
7
Data Memory Screen ...................................................................................................... 10
8
Calibration Screen.......................................................................................................... 12
9
Advanced Comm I2C ...................................................................................................... 13
10
Parameter Q&A Screen ................................................................................................... 14
11
Golden Image Output Screen
12
............................................................................................
Perform Programming Screen ............................................................................................
14
14
List of Tables
Ordering Information
2
Bill of Materials ............................................................................................................... 5
3
Performance Specification Summary
7
4
Circuit Module to EV2400 Connections – I2C
8
5
1
8
Complete evaluation system for the bq27542 gas gauge with Impedance Track™ Technology
Populated circuit module for quick setup
PC software and interface board for easy evaluation
Software that allows data logging for system analysis
Kit Contents
•
•
1.2
.....................................................................................
...........................................................................
Circuit Module to EV2400 Connections – HDQ..........................................................................
2
Features
•
•
•
•
1.1
........................................................................................................
1
bq27542 circuit module
bq27542EVM-696 tool folder for support documentation and evaluation software
Ordering Information
Table 1. Ordering Information
2
EVM Part Number
Chemistry
Configuration
Capacity
bq27542EVM-696
Li-ion
1 cell
14500 mAh or less
bq27542-Based Circuit Module
The bq27542-based circuit module is a complete and compact example solution of a bq27542 circuit for
battery management. The circuit module incorporates a bq27542 battery gas gauge IC, and all other
components necessary to accurately predict the capacity of a 1-series Li-Ion cell.
2.1
Circuit Module Connections
Contacts on the circuit module provide the following connections:
• Direct connection to the cells: CELL+ and CELL–
• To the serial communications ports (SDA, SCL) or HDQ
• The system load and charger connect across PACK+ and PACK–
Impedance Track is a trademark of Texas Instruments.
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2.2
Pin Descriptions
PIN NAME
3
DESCRIPTION
PACK+
Pack positive terminal
PACK-
Pack negative terminal
CELL+
Cell positive terminal
CELL-
Cell negative terminal
SDA
I2C communication data line
SCL
I2C communication clock line
HDQ
Single wire communication line
Circuit Module Physical Layouts, Schematic, and Bill of Materials
This section contains the printed-circuit board (PCB) layouts, schematic, and bill of materials for the
bq27542 circuit module.
3.1
Board Layout
This section shows the PCB layers (Figure 1 through Figure 4) for the bq27542 module.
Figure 1. bq27542EVM-696 Layout, Silk Screen
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Circuit Module Physical Layouts, Schematic, and Bill of Materials
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Figure 2. Top Assembly
Figure 3. Top Layer
4
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Figure 4. Bottom Layer
3.2
Bill of Materials
Table 2 lists the bq24572 bill of materials.
Table 2. Bill of Materials (1)
Designator
QTY
Value
Description
Package
Reference
Part Number
Manufacturer
C1, C2, C4, C5,
C7, C11, C12
7
0.1 µF
CAP, CERM, 0.1 µF, 10 V, ±10%,
X5R, 0402
0402
GRM155R61A104KA01D
Murata
C3, C6
2
0.47 µF
CAP, CERM, 0.47 µF, 6.3 V, ±10%,
X5R, 0402
0402
GRM155R60J474KE19D
Murata
C8–C10
3
150 pF
CAP, CERM, 150 pF, 50 V, ±5%,
C0G/NP0, 0402
0402
GRM1555C1H151JA01D
Murata
J1, J2
2
Terminal Block, 6A, 3.5mm Pitch, 2Pos, TH
7.0x8.2x6.5mm
ED555/2DS
On-Shore
Technology
J3, J4
2
Header (friction lock), 100mil, 4x1,
R/A, TH
4x1 R/A Header
22-05-3041
Molex
J5, J6
2
Header, 100mil, 2x1, Tin, TH
Header, 2 PIN,
100mil, Tin
PEC02SAAN
Sullins
Connector
Solutions
R1
1
0.01
RES, 0.01, 1%, 1 W, 1206
1206
WSLP1206R0100FEA
Vishay-Dale
R2, R14
2
10k
RES, 10 k, 5%, 0.063 W, 0402
0402
CRCW040210K0JNED
Vishay-Dale
R3, R4,
R11–R13
5
100
RES, 100, 5%, 0.063 W, 0402
0402
CRCW0402100RJNED
Vishay-Dale
R5–R7
3
300
RES, 300, 5%, 0.063 W, 0402
0402
CRCW0402300RJNED
Vishay-Dale
R8–R10
3
1.00Meg
RES, 1.00 M, 1%, 0.063 W, 0402
0402
CRCW04021M00FKED
Vishay-Dale
RT1
1
10.0 kΩ
Thermistor NTC, 10.0 kΩ, 1%, Disc,
5x8.4 mm
Disc, 5x8.4 mm
103AT-2
SEMITEC
Corporation
TP1–TP9
9
Black
Test Point, Miniature, Black, TH
Black Miniature
Testpoint
5001
Keystone
U1
1
Single Cell Li-Ion Battery Fuel Gauge
for Battery Pack Integration,
DRZ0012A
DRZ0012A
BQ27542DRZR-G1
Texas
Instruments
(1)
Alternate Part
Number
Alternate
Manufacturer
bq27542DRZT-G1
Texas
Instruments
Unless otherwise noted in the Alternate Part Number and/or Alternate Manufacturer columns, all parts may be substituted with
equivalents.
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Circuit Module Physical Layouts, Schematic, and Bill of Materials
3.3
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Schematic
Figure 5 shows the bq27542 schematic.
RT1
t°
10.0k ohm
C6
GND
TP9
13
1
TP1
8
7
TP3
J1
3
4
CELL +
TP4
U1
6
VSS
TS
EP
SE
SRN
SRP
REGIN
BAT
SDA
SCL
HDQ
0.47µF
9
C11
0.1µF
10
11
R6
12
TP8
REG25
2
VCC
5
TP2
C1
0.1µF
C9
150pF
C3
0.47µF
BQ27542DRZR-G1
100
C12
0.1µF
R9
1.00M
C2
0.1µF
J4
GND
R5
GND
PACK+
PACK -
R12
300
CELL -
J2
GND
GND
TP7
300
R11
100
4
3
2
1
J6
J5
SHDQ
PACK -
R2
10k
C8
150pF
J3
4
3
2
1
R3
GND
R1
0.01
100
C4
0.1µF
R4
100
TP6
GND
R7
C7
0.1µF
R14
10k
R8
1.00M
300
SDA
SCL
PACK -
R13
100
C5 GND
0.1µF
C10
150pF
R10
1.00M
GND
TP5
Figure 5. Schematic
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Circuit Module Physical Layouts, Schematic, and Bill of Materials
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3.4
bq27542 Circuit Module Performance Specification Summary
This section summarizes the performance specifications of the bq27542 circuit module.
Table 3. Performance Specification Summary
Specification
Min
Typ
Max
Input voltage Pack+ to Pack–
2.7
3.6
5
Input voltage CELL+ to CELL–
2.7
3.6
5
0
1
2
Charge and discharge current
4
Unit
V
A
EVM Hardware and Software Setup
This section describes how to install the bq27542EVM-696 PC software, and how to connect the different
components of the EVM.
4.1
Software Installation
Find the latest software version in the bq27542 product folder on http://www.ti.com/. Search by product for
bq27542 to access the product folder. Use the following steps to install Battery Management Studio:
1. Ensure that the EV2400 is not connected to the PC through a USB cable before starting this
procedure.
2. Select the Tool and Software tab in the product folder.
3. Under the Software section, click on Battery Management Studio (bqStudio) Software Suite.
4. Click the Download button to download the software.
5. Download software to hard drive.
6. Double-click the software executable and follow all instructions and prompts.
5
Troubleshooting Unexpected Dialog Boxes
The user that is downloading the files must be logged in as the administrator.
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Hardware Connection
6
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Hardware Connection
The bq27542EVM-696 comprises three hardware components: the bq27542 circuit module, the EV2400
PC interface board, and the PC.
6.1
Connecting the bq27542 Circuit Module to a Battery Cell
The bq27542EVM-696 should be connected to a battery cell or power supply with a voltage not to exceed
the maximum voltage specified in Table 3. The connection should be made between the CELL+ and
CELL– terminals on the EVM. The Load/Charger should connect between the PACK+/PACK– terminals
on the EVM.
6.2
PC Interface Connection
The bq27542 can be configured as an HDQ communication device or left in default as an I2C device.
Once the bq27542 is configured for HDQ communication, it cannot be reverted to I2C mode.
The following steps configure the hardware for interfacing to the PC:
1. Connect the bq27542-based pack to the EV2400 using wire leads as shown in Table 4.
Table 4. Circuit Module to EV2400 Connections – I2C
bq27542-Based Battery (I2C mode)
EV2400 (I2C port)
SDA
SDA
SCL
SCL
PACK-
VSS
Table 5. Circuit Module to EV2400 Connections – HDQ
bq27542-Based Battery (HDQ mode)
EV2400 (HDQ port)
HDQ
SDA
PACK–
VSS
2. Connect the PC USB cable to the EV2400 and the PC USB port.
The bq27542EVM-696 is now set up for operation.
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Operation
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7
Operation
This section details the operation of the bq27542 evaluation software.
7.1
Starting the Program
Run bqStudio from the Start | All Programs | Texas Instruments | Battery Management Studio. The main
screen (Figure 6) appears. Data begins to appear once the (single-time scan) button is clicked,
or when the Scan button is clicked. To disable the scan feature, simply click the Scan button again.
The continuous scanning period can be set by opening Window | Preferences → Registers section. The
range for this interval is 0 ms to 65,535 ms. Only items that are selected for scanning are scanned within
this period.
Battery Management Studio provides a logging function which logs the values that were last scanned. To
enable this function, select the Start Log button; this causes the Scan button to be pressed. When logging
is Stopped, the Scan button will still be selected and has to be manually clicked again.
Figure 6. Registers Screen
This screen (Figure 6) shows the RAM data in the bq27542 device. Additional Flags and Status data can
be viewed at the bottom of the Registers screen.
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Operation
7.2
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Setting Programmable bq27542 Options
The bq27542 data memory comes configured per the default settings detailed in the bq27542 technical
reference manual (SLUUB65). Ensure that the settings are correctly changed to match the pack and
application for the bq27542 solution being evaluated.
IMPORTANT: The correct setting of these options is essential to get the best performance.
The settings can be configured using the Data Memory screen (Figure 7).
Figure 7. Data Memory Screen
To read all the data from the bq27542 data flash, click on the menu option | Data Flash | Read All |.
To write to a data flash location, click on the desired location, enter the data and press , which
writes the entire tab of flash data, or select menu option | Data Flash | Write All |. The data flash must be
read before any writes are performed to avoid any incorrect data being written to the device.
The | File | Special Export | menu options allows the data flash to be exported, but it configures the
exported data flash to a learned state ready for mass production use.
The data flash configuration can be saved to a file by selecting | File | Export | and entering a file name. A
data flash file can also be retrieved in this way, imported, and written to the bq27542 using the | Write All |
button.
The module calibration data is also held in the bq27542 data flash.
Battery Management Studio allows for an automatic data flash export function, similar to the Registers
logging function. This feature, when selected via | Auto Export |, exports Data Flash to a sequential series
of files named as FilenameNNNNN.gg.csv where N = a decimal number from 0 to 9.
The AutoExport interval is set under the | Window | Preferences → Data Memory | window with a default
value of 1800 seconds. There is also the ability to select Classic or Default style. Classic is the standard
.gg file that can be opened with typical notepad editors. Default style is the gg.csv which is a comma
delimited file.
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Calibrate Screen
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When AutoExport is pressed, the Auto Export is in progress. The same button is used to turn on/off
AutoExport. AutoExport is typically used for troubleshooting experiments, but is highly recommended for
any experiment. The standard AutoExport interval is typically 30 minutes.
8
Calibrate Screen
To ensure proper calibration, perform the following steps. These steps may or may not be required,
depending on the type of calibration being performed. Only one calibration item can be selected and
calibrated at a time.
8.1
To Calibrate the bq27542
Calibrate each item one at a time in the order presented in this document. Select the types of calibration
to be performed by selecting the corresponding checkbox (see Figure 8).
Enter the measured values for the types selected, if necessary.
Then press the Calibrate Part as indicated below button. After all calibration is complete, close the
Calibrate subwindow. While the Calibrate subwindow is open, even in the background, the calibration
routines are running in firmware. Close the subwindow to ensure that they are stopped before proceeding
with configuration or testing.
8.2
CC Offset Calibration
This performs the internal calibration of the coulomb counter input offset. Press the Calibrate Coulomb
Counter button.
8.3
Voltage Calibration
•
•
•
•
•
8.4
Measure the voltage across Pack+ and Pack– with a calibrated meter.
Type the voltage value in mV into Enter Actual Voltage.
Measure the temperature for PACK.
Type the temperature value into Enter Actual Temperature.
Press the Calibrate Voltage and Temperature as indicated below button.
Board Offset Calibration
This performs the offset calibration for the current offset of the board. It is expected that no current is
flowing through the sense resistor while performing this calibration step.
• Remove load and short Pack– to GND.
• Press the Calibration Board Offset button.
8.5
Temperature Calibration
Measure the temperature for PACK. Type the temperature value into Enter Actual Temperature. Select if
the temperature sensor to calibrate is the internal or the external.
Press the Calibrate Part as indicated below button.
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Calibrate Screen
8.6
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Pack Current Calibration
•
•
•
Connect a load to GND and SYS that draws approximately 1 A, or connect a current source to GND
and Pack–. Ensure that the Measured Current reported is negative, or else reverse the connections.
Measure the current with a calibrated meter, and type the value into Enter Actual Current using (–) for
current in discharge direction.
Press the Calibrate Pack Current button.
Figure 8. Calibration Screen
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Advanced Communication I2C
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9
Advanced Communication I2C
I2C Communication
The set of read/write operations over I2C are not specific to any gas gauge. These operations serve as
general-purpose communication tools (Figure 9).
Figure 9. Advanced Comm I2C
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Advanced Communication I2C
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Figure 10. Parameter Q&A Screen
Figure 11. Golden Image Output Screen
Figure 12. Perform Programming Screen
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Related Documentation From Texas Instruments
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10
Related Documentation From Texas Instruments
To obtain a copy of any of the following TI documents, call the Texas Instruments Literature Response
Center at (800) 477-8924 or the Support Center at (512) 434-1560. When ordering, identify this document
by its title and literature number. Updated documents also can be obtained through the TI Web site at
www.ti.com.
• bq27542, Single Cell Li-Ion Battery Fuel Gauge for Battery Pack Integration data sheet (SLUSC33)
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STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
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IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
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TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
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TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
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Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
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Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
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In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
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requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
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Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
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