DRV591VFP

 www.ti.com SLOS389A – NOVEMBER 2001– REVISED MAY 2002 ±    
 FEATURES DESCRIPTION D D D D D ±3-A Maximum Output Current The DRV591 is a high-efficiency, high-current power amplifier ideal for driving a wide variety of thermoelectric cooler elements in systems powered from 2.8 V to 5.5 V. PWM operation and low output stage on-resistance significantly decrease power dissipation in the amplifier. D D D D Two Selectable Switching Frequencies Low Supply Voltage Operation: 2.8 V to 5.5 V High Efficiency Generates Less Heat Over-Current and Thermal Protection Fault Indicators for Over-Current, Thermal and Under-Voltage Conditions The DRV591 is internally protected against thermal and current overloads. Logic-level fault indicators signal when the junction temperature has reached approximately 130°C to allow for system-level shutdown before the amplifier’s internal thermal shutdown circuitry activates. The fault indicators also signal when an over-current event has occurred. If the over-current circuitry is tripped, the DRV591 automatically resets (see application information section for more details). Internal or External Clock Sync PWM Scheme Optimized for EMI 9×9 mm PowerPAD Quad Flatpack APPLICATIONS The PWM switching frequency may be set to 500 kHz or 100 kHz depending on system requirements. To eliminate external components, the gain is fixed at approximately 2.3 V/V. D Thermoelectric Cooler (TEC) Driver D Laser Diode Biasing VDD OUT+ OUT+ PVDD PVDD PVDD FREQ INT/EXT PGND IN– PGND SHUTDOWN OUT– 10 µH FAULT1 FAULT0 10 µF 1 µF To TEC or Laser Diode Anode OUT– Shutdown Control PGND IN+ OUT– 1 kΩ PGND AREF OUT– 1 kΩ COSC PVDD 1 µF PGND PVDD 220 pF PGND ROSC PVDD DC Control Voltage 10 µH OUT+ AGND (Connect to PowerPAD) FAULT0 120 kΩ AVDD FAULT1 1 µF OUT+ 1 µF 10 µF 10 µF To TEC or Laser Diode Cathode Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments. 

   ! "#$ !  %#&'"  ( $) (#" ! "  !%$"" ! %$ *$ $!  $+! ! #$ ! ! (( , -) (#"  %"$!!. ($!  $"$!!'- "'#($ $! .  '' %$ $!) Copyright  2002, Texas Instruments Incorporated 
 www.ti.com SLOS389A – NOVEMBER 2001– REVISED MAY 2002 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION TA PowerPAD QUAD FLATPACK (VFP) DRV591VFP(1) –40°C to 85°C (1) This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., DRV591VFPR). ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted(1) Supply voltage, AVDD, PVDD Input voltage, VI Output current, IO (FAULT0, FAULT1) Continuous total power dissipation DRV591 UNIT –0.3 to 5.5 V –0.3 to VDD + 0.3 V 1 mA See Dissipation Rating Table Operating free-air temperature range, TA –40 to 85 °C Operating junction temperature range, TJ –40 to 150 °C Storage temperature range, Tstg –65 to 165 °C (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS ÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑ ÑÑÑ ÑÑÑ ÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑ ÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑ ÑÑÑÑÑ ÑÑ ÑÑÑ ÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑ ÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑ ÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑ ÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑ ÑÑÑ Ñ ÑÑ ÑÑÑ Ñ ÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑ ÑÑÑÑÑ ÑÑÑ MIN Supply voltage, AVDD, PVDD 2.8 High-level input voltage, VIH FREQ, INT/EXT, SHUTDOWN, COSC Low-level input voltage, VIL FREQ, INT/EXT, SHUTDOWN, COSC Operating free-air temperature, TA PACKAGE ΘJA(1) (°C/W) ΘJC (°C/W) TA = 25°C POWER RATING VFP 29.4 1.2 4.1 W (1) This data was taken using 2 oz trace and copper pad that is soldered directly to a JEDEC standard 4-layer 3 in × 3 in PCB. 2 5.5 2 –40 PACKAGE DISSIPATION RATINGS MAX UNIT V V 0.8 V 85 °C 
 www.ti.com SLOS389A – NOVEMBER 2001– REVISED MAY 2002 ELECTRICAL CHARACTERISTICS over operating free-air temperature range unless otherwise noted PARAMETER TEST CONDITIONS |VOO| Output offset voltage (measured differentially) |IIH| High-level input current |IIL| Low-level input current Vn Integrated output noise voltage VICM Common mode voltage range Common-mode Av Closed-loop voltage gain VI = VDD/2, VDD = 5.5V, IO = 0 A VI = VDD VDD = 5.5V, f =