Product
Folder
Order
Now
Support &
Community
Tools &
Software
Technical
Documents
DS280DF810
SNLS538A – SEPTEMBER 2016 – REVISED OCTOBER 2019
DS280DF810 28 Gbps Multi-Rate 8-Channel Retimer
1 Features
3 Description
•
The DS280DF810 is an eight-channel multi-rate
Retimer with integrated signal conditioning. It is used
to extend the reach and robustness of long, lossy,
crosstalk-impaired high-speed serial links while
achieving a bit error rate (BER) of 10-15 or less.
1
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Octal-Channel Multi-Rate Retimer with Integrated
Signal Conditioning
All Channels Lock Independently from 20.2 Gbps
to 28.4 Gbps (Including Sub-Rates Like 10.1376
Gbps, 10.3125 Gbps, 12.5 Gbps, and More)
Ultra-Low Latency: 10 MHz, sinusoidal (1)
10
mVpp
TrampVDD
VDD supply ramp time, from 0 V to 2.375 V
150
TJ
Operating junction temperature
-40
110
ºC
TA
Operating ambient temperature
-40
85 (2)
ºC
VIO2.5V
2.5 V I/O voltage (LVCMOS, CMOS and Analog)
2.375
2.625
V
VIO3.3V,INT_N
Open Drain LVCMOS I/O voltage (INT_N)
3.6
V
VIO3.3V
Open Drain LVCMOS I/O voltage (SDA, SDC)
3.6
V
(1)
(2)
μs
2.375
Steps must be taken to ensure the combined AC plus DC supply noise meets the specified VDD supply voltage limits.
Steps must be taken to ensure the operating junction temperature range and ambient temperature stay-in-lock range (TEMPLOCK+,
TEMPLOCK-) are met. Refer to Timing Requirements, Retimer Jitter Specifications for more details concerning TEMPLOCK+ and
TEMPLOCK-.
7.4 Thermal Information
DS280DF810
THERMAL METRIC (1)
CONDITIONS/ASSUMPTIONS (2)
FC/CSP (ABV)
UNIT
135 PINS
4-Layer JEDEC Board
26.4
10-Layer 8-in x 6-in Board
9.3
20-Layer 8-in x 6-in Board
8.5
RθJA
Junction-to-ambient thermal resistance
30-Layer 8-in x 6-in Board
8.2
RθJC(top)
Junction-to-case (top) thermal resistance
4-Layer JEDEC Board
1.6
°C/W
RθJB
Junction-to-board thermal resistance
4-Layer JEDEC Board
9.3
°C/W
4-Layer JEDEC Board
0.1
10-Layer 8-in x 6-in Board
0.1
20-Layer 8-in x 6-in Board
0.1
30-Layer 8-in x 6-in Board
0.1
4-Layer JEDEC Board
9.3
10-Layer 8-in x 6-in Board
5.0
20-Layer 8-in x 6-in Board
4.9
30-Layer 8-in x 6-in Board
4.6
Junction-to-top characterization parameter
ΨJT
Junction-to-board characterization parameter
ΨJB
(1)
(2)
°C/W
°C/W
°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
No heat sink or airflow was assumed for these estimations. Depending on the application, a heat sink, faster airflow, or reduced ambient
temperature (
很抱歉,暂时无法提供与“DS280DF810ABVR”相匹配的价格&库存,您可以联系我们找货
免费人工找货- 国内价格 香港价格
- 1+480.692471+58.14493
- 10+451.5927910+54.62501
- 25+437.0242825+52.86279
- 100+404.97739100+48.98638
- 国内价格 香港价格
- 1000+364.188151000+44.05248