SN65HVS881PWPR

SN65HVS881 www.ti.com................................................................................................................................................................................................... SLAS642 – MARCH 2009 INDUSTRIAL 8-DIGITAL-INPUT SERIALIZER WITH DIAGNOSTICS FEATURES 1 • Eight Inputs – High Input Voltage – up to 34 V – Selectable Debounce Filters – 0 ms to 3 ms – Flexible Input Current Limit: 0.2 to 5.2 mA – Field Pins Protected to 15-kV HBM ESD • Diagnostics: – Parity Check – Undervoltage Indication – Overtemperature Indication • Output Drivers for External Status LEDs 2 • • • Cascadable in Multiples of Eight Inputs SPI-Compatible Interface Regulated 5-V Output for External Isolator APPLICATIONS • • • • Sensor Inputs for Industrial Automation and Process Control High Channel Count Digital Input Modules for PC and PLC Systems Decentralized I/O Modules Motion Control Systems DESCRIPTION The SN65HVS881 is an eight channel, digital-input serializer for high-channel density digital input modules in industrial automation. In combination with galvanic isolators the device completes the interface between the high voltage signals on the field-side and the low-voltage signals on the controller side. Input signals are current-limited and then validated by internal debounce filters. With the addition of a few external components, the input switching characteristics can be configured in accordance with IEC61131-2 for Type 1, 2 and 3 sensor switches. Upon the application of load and clock signals, input data is latched in parallel into the shift register and afterwards clocked out serially. Cascading of multiple devices is possible by connecting the serial output of the leading device with the serial input of the following device, enabling the design of high-channel count input modules. Multiple devices can be cascaded through a single serial port, reducing both the isolation channels and controller inputs required. Input status can be visually indicated via constant current LED outputs. The current limit on the inputs is set by a single external precision resistor. An integrated voltage regulator provides a 5V output to supply low-power isolators. An on-chip temperature sensor provides diagnostic information for graceful shutdown and system safety. An internal parity check for odd parity ensures trustworthy transmission of serial data to the system controller. The SN65HVS881 is available in a 28-pin PWP PowerPAD™ package, allowing for efficient heat dissipation. The device is characterized for operation at temperatures from –40°C to 125°C 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2009, Texas Instruments Incorporated SN65HVS881 SLAS642 – MARCH 2009................................................................................................................................................................................................... www.ti.com Voltage Regulator VCC Debounce Select DB0 : DB1 Serial Input 5V 8 8 3 8 SERIALIZER LED Outputs RE0 : RE7 2 Signal Conditioning Field Inputs IP0 : IP7 5V out IREF Adj: RLIM Field Ground Control Inputs LD, CE, CLK Serial Output DB0 DB1 IP0 RE0 IP1 RE1 IP2 RE2 IP3 RE3 IP4 RE4 RLIM VCC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 GND SIP LD CLK CE SOP IP7 RE7 IP6 RE6 IP5 RE5 HOT 5VOP FUNCTIONAL BLOCK DIAGRAM Voltage Regulator VCC 5V Thermal Sensor HOT Debounce Select DB0 DB1 Supply Monitor GND RLIM 5VOP Adj. Current Thresholds SIP Current Sense & Voltage Sense Debounce Filter Channel 0 Parity Generator RE7 IP7 SERIALIZER RE0 IP0 LD CE CLK Channel 7 SOP 2 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN65HVS881 SN65HVS881 www.ti.com................................................................................................................................................................................................... SLAS642 – MARCH 2009 TERMINAL FUNCTIONS TERMINAL PIN NO. NAME DESCRIPTION 1, 2 DB0, DB1 3, 5, 7, 9, 11, 18, 20, 22 Debounce select inputs IPx Input channel x 4, 6, 8, 10, 12, 17, 19, 21 REx Return path x (LED drive) 13 RLIM Current limiting resistor 14 VCC 15 5VOP 5-V output to supply low-power isolators 16 HOT Active low over-temperature indication 23 SOP Serial data output 24 CE Clock enable input 25 CLK Serial clock input 26 LD Load pulse input 27 SIP Serial data input 28 GND Field ground Field supply voltage Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN65HVS881 3 SN65HVS881 SLAS642 – MARCH 2009................................................................................................................................................................................................... www.ti.com ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VALUE UNIT –0.3 to 36 V IPx –0.5 to 36 V Voltage at any logic input DB0, DB1, CLK, SIP, CE, LD –0.5 to 6 V Output current HOT, SOP ±8 mA All pins ±4 IPx, VCC ±15 VCC Field power input VIPx Field digital inputs VID IO Human-Body Model (2) VESD Electrostatic discharge PTOT Continuous total power dissipation TJ Junction temperature (1) (2) (3) (4) kV Charged-Device Model (3) All pins ±1 kV Machine Model (4) All pins ±100 V 170 °C See Thermal Characteristics Table Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. JEDEC Standard 22, Method A114-A. JEDEC Standard 22, Method C101 JEDEC Standard 22, Method A115-A THERMAL CHARACTERISTICS PARAMETER θJA Junction-to-air thermal resistance θJB Junction-to-board thermal resistance θJC Junction-to-case thermal resistance PD Device power dissipation TEST CONDITIONS MIN High-K JEDEC thermal resistance model IP0-IP7 = ICC and IIP-LIM = worst case with IP0-IP7 = RLIM = 25 kΩ, ILOAD = 50 mA on 5VOP, IP0-IP7 = RE0-RE7 = GND, fIP = 100 MHz IP0-IP7 = TYP MAX UNIT 35 °C/W 15 °C/W 4.27 °C/W VCC = 34 V 2970 VCC = 30 V 2600 VCC = 24 V 2020 VCC = 12 V 890 mW RECOMMENDED OPERATING CONDITIONS MIN NOM MAX 10 34 V VCC Field supply voltage VIPL Field input low-state input voltage VIPH Field input high-state input voltage VIL Logic low-state input voltage VIH Logic high-state input voltage 2.0 RLIM Current limiter resistor 17 fIP (1) Input data rate (each field input) TA TJ (1) 4 Free-air temperature, see Thermal Characteristics 0 4 V 5.5 34 V 0 0.8 V 25 5.5 V 500 kΩ 0 1 VCC ≤ 34 V –40 85 VCC ≤ 27 V –40 105 VCC ≤ 18 V –40 125 Junction temperature UNIT 150 Mbps °C °C Maximum data rate corresponds to 0 ms debounce time, (DB0 = open, DB1 = GND), and RIN = 0 Ω Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN65HVS881 SN65HVS881 www.ti.com................................................................................................................................................................................................... SLAS642 – MARCH 2009 ELECTRICAL CHARACTERISTICS Over full-range of recommended operating conditions, unless otherwise noted PARAMETER TERMINAL TEST CONDITIONS MIN TYP MAX UNIT FIELD INPUTS VTH–(IP) Low-level device input threshold voltage VTH+(IP) High-level device input threshold voltage VHYS(IP) Device input hysteresis VTH–(IN) Low-level field input threshold voltage VTH+(IN) High-level field input threshold voltage VHYS(IN) Field input hysteresis VTH– (VCC) Low-level VCC-monitor threshold voltage VTH+ (VCC) High-level VCC-monitor threshold voltage VHYS (VCC) VCC-monitor hysteresis 4.0 IP0–IP7 RLIM = 25 kΩ 5.2 6 Measured at field side of RIN 18 V < VCC 1 µF CL Temperature Sensor An on-chip temperature sensor monitors the device temperature and signals a fault condition if the internal temperature reaches 150°C. If the internal temperature exceeds this trip point, the HOT output switches to an active low state. If the internal temperature continues to rise, passing a second trip point at 170°C, all device outputs are put in a high-impedance state. A special condition occurs, however, when the chip temperature exceeds the second temperature trip point due to an output short. Then the output buffer becomes 3-state, thus separating the buffer from the external circuitry. An internal 100-kΩ pull-down resistor, connecting the HOT pin to ground, is used as a cooling down resistor, which continues to provide a logic low level to the external circuitry. Parity Generator A • • • parity bit is generated when one or more of the following conditions occur: a change in input status a change in Undervoltage status a change in Overtemperature status Upon the application of a load pulse the input status (IP0–IP7) and the diagnostic bits (HOT, UVO, and PAR) are loaded parallel into the serializer assuming the following format: Bit 11 PAR Bit 1 UVO HOT PIP0 PIP1 PIP2 PIP3 PIP4 PIP5 PIP6 PIP7 Figure 16. Sequence of Status Bits in Serializer 12 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN65HVS881 SN65HVS881 www.ti.com................................................................................................................................................................................................... SLAS642 – MARCH 2009 APPLICATION INFORMATION System-Level EMC The SN65HVS881 is designed to operate reliably in harsh industrial environments. At a system level, the device is tested according to several international electromagnetic compatibility (EMC) standards. In addition to the device internal ESD structures, external protection circuitry, as shown in Figure 17, can be used to absorb as much energy from burst- and surge-transients as possible. R1 VSUP = 24V V24 CS R1 56 W, 1/3 W MELF Resistor D1 33 V – 36 V fast Zener Diode, Z2SMB36 C1 10 µF, 60 V Ceramic Capacitor RIN 1.2 kW, 1/4 W MELF Resistor CIN 22 nF, 60 V Ceramic Capacitor CS 4.7 nF, 2 kV Polypropylene Capacitor DS 39V Transient Voltage Suppressor: SM15T39CA D2 Super Rectifier: BYM10-1000, or General Purpose rectifier: 1N4007 D1 DS C1 SN65HVS881 FE 0V FGND R IN IPx IP0 – IP7 CIN 0V FGND D2 CS FE Figure 17. Typical EMC Protection Circuitry for Supply and Signal Inputs Input Channel Switching for IEC61131-2 PLC Applications The input stage of the SN65HVS881 is designed so that with a 24-V supply on VCC and an input resistor RIN = 1.2 kΩ, the trip point for signaling an ON-condition is at 9.4 V at 3.6 mA. This trip point satisfies the switching requirements of IEC61131-2 type-1 and type-3 switches. Type 2 Type 1 30 25 25 30 25 VIN / V VIN / V ON 20 15 15 10 10 5 5 0 -3 OFF 5 10 IIN / mA ON 20 20 ON 15 10 5 OFF 0 -3 15 VIN / V 30 Type 3 5 10 15 IIN / mA 0 -3 20 25 30 OFF 5 10 IIN / mA 15 Figure 18. Switching Characteristics for IEC61131-2 Type 1, 2, and 3 Proximity Switches For a type-2 switch application two inputs are connected in parallel. The current limiters then add to a total maximum current of 7.2 mA. While the return-path (RE-pin), of one input might be used to drive an indicator LED, the RE-pin of the other input channel should be connected to ground (GND). Paralleling input channels reduces the number of available input channels from an octal Type 1 or Type 3 input to a quad Type 2 input device. Note, that in this configuration output data of an input channel is represented by two shift register bits. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN65HVS881 13 SN65HVS881 SLAS642 – MARCH 2009................................................................................................................................................................................................... www.ti.com RIN R IN IP 0 C IN IP0 C IN RE 0 R IN RE0 R IN IP 1 C IN IP1 C IN RE1 RE1 Figure 19. Paralleling Two Type 1 or Type 3 Inputs Into One Type 2 Input Digital Interface Timing The digital interface of the SN65HVS881 is SPI compatible and interfaces, isolated or non-isolated, to a wide variety of standard microcontrollers. SN65HVS881 SIP IP7 SERIALIZER IP0 HOST CONTROLLER ISO7241 LD OUTA INA CE OUTB INB CLK OUTC INC SOP IND OUTD LOAD STE SCLK SOMI Figure 20. Simple Isolation of the Shift Register Interface Upon a low-level at the load input, /LD, the information of the field inputs and the diagnostic bits are latched into the shift register. Taking LD high again blocks the parallel inputs of the shift register from the field inputs. A low-level at the clock-enable input, CE, enables the clock signal, CLK, to serially shift the data to the serial output, SOP. Data is clocked at the rising edge of CLK. Thus after eleven consecutive clock cycles all data have been clocked out of the shift register and the information of the serial input, SIP, appears at the serial output, SOP. 14 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN65HVS881 SN65HVS881 www.ti.com................................................................................................................................................................................................... SLAS642 – MARCH 2009 CLK CE SIP high LD PAR - PIP 6 PIP 7 SOP don’t care IP7 IP6 IP5 IP4 IP3 IP2 IP1 IP0 HOT UVO PAR SIP Serial shift inhibit Figure 21. Interface Timing for Parallel-Load and Serial-Shift Operation of the Shift Register Cascading for High Channel Count Input Modules Designing high-channel count modules requires cascading multiple SN65HVS881 devices. Simply connect the serial output (SOP) of a leading device with the serial input (SIP) of a following device without changing the processor interface. HOST CONTROLLER ISO7241 4 x SN65HVS881 OUTA INA OUTB INB OUTC INC SCLK SOMI SOP /CE CLK /LD IP7 SIP SOP /CE OUTD STE SERIALIZER IP0 IP7 SERIALIZER IP0 IP7 CLK /LD SIP CLK SOP /LD SERIALIZER IP0 IP7 IP0 SERIALIZER /CE SIP CLK SOP /LD /CE SIP IND LOAD Figure 22. Cascading Four SN65HVS881 for a 32-Channel Input Module Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN65HVS881 15 SN65HVS881 SLAS642 – MARCH 2009................................................................................................................................................................................................... www.ti.com Typical Digital Input Module Application SM15T39CA 24 V (Logic) 24V1 5V 5 V-ISO SM15T39A (Sensors) 24V2 Isolated DC / DC 4.7 nF 2 kV 4.7 nF 2 kV GND2 0V Power Supply GND1 0 V-ISO 4.7 nF 2 kV 56 W MELF FE Z2SMB36 10 mF 60 V Screw Terminals 1N4007 1 mF 0.1 mF SN65 HVS 881 1.2 kW MELF 22 nF S0 V24 5VOP IP0 CHOK RE0 1.2 kW MELF S7 VCC1 HOST CONTROLLER EN2 EN1 VCC LD OUTA INA LOAD CLK OUTB INB SCLK SIP CE INC OUTC INT RE7 SOP IND OUTD SOMI RLIM DB0 GND2 GND1 DGND FGND DB1 IP7 22 nF ISO7242 VCC2 24.9 kW Figure 23. Typical Digital Input Module Application 16 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN65HVS881 PACKAGE MATERIALS INFORMATION www.ti.com 5-Jan-2022 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN65HVS881PWPR Package Package Pins Type Drawing SPQ HTSSOP 2000 PWP 28 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 16.4 Pack Materials-Page 1 6.9 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 10.2 1.8 12.0 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 5-Jan-2022 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN65HVS881PWPR HTSSOP PWP 28 2000 350.0 350.0 43.0 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 5-Jan-2022 TUBE *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) SN65HVS881PWP PWP HTSSOP 28 50 530 10.2 3600 3.5 Pack Materials-Page 3 GENERIC PACKAGE VIEW TM PWP 28 PowerPAD TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE 4.4 x 9.7, 0.65 mm pitch This image is a representation of the package family, actual package may vary. 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