SN65LVPE502CP1RGER

SN65LVPE502CP SLLSE79B – MARCH 2011 – REVISED FEBRUARY 2012 www.ti.com Dual Channel USB3.0 Redriver/Equalizer Check for Samples: SN65LVPE502CP FEATURES • 1 • • • • • • • • Single Lane USB 3.0 Equalizer/Redriver Selectable Equalization, De-Emphasis and Output Swing Control Integrated Termination Hot-Plug Capable Low Active Power (U0 state) – 315 mW (TYP), VCC = 3.3V USB 3.0 Low Power Support – 7 mW (TYP) When no Connection Detected – 70 mW (TYP) When Link in U2/U3 Mode Excellent Jitter and Loss Compensation Capability: – >40" of Total 4 mil Stripline on FR4 Small Foot Print – 24 Pin (4mm x 4mm) QFN Package High Protection Against ESD Transient – HBM: 5,000 V – CDM: 1,500 V – MM: 200 V APPLICATIONS • Notebooks, Desktops, Docking Stations, Active Cable, Backplane and Active Cable DESCRIPTION The SN65LVPE502CP is a dual channel, single lane USB 3.0 redriver and signal conditioner supporting data rates of 5.0Gbps. The device complies with USB 3.0 spec revision 1.0, supporting electrical idle condition and low frequency periodic signals (LFPS) for USB 3.0 power management modes. SPACER Main PCB Redriver USB Host USB Connector 20" Main PCB USB Host Connector Device PCB Device Redriver 20" 3m USB 3.0 Cable 1"-6" Figure 1. Typical Application 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011–2012, Texas Instruments Incorporated SN65LVPE502CP SLLSE79B – MARCH 2011 – REVISED FEBRUARY 2012 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. EN_RXD RX1+ RX1- Dual Termination Detect TX1+ Receiver/ Equalizer CHANNEL 1 Driver TX1- EQ1 EQ CNTRL EQ2 DE1 VTX_CM_DC DEMP CNTRL DE2 CHANNEL 2 Driver Dual Termination TX2+ Receiver/ Equalizer TX2- Detect VTX_CM_DC OS Cntrl. RX2+ RX2- EN_RXD OS1 OS2 Figure 2. Data Flow Block Diagram ORDERING INFORMATION (1) (1) 2 PART NUMBER PART MARKING PACKAGE SN65LVPE502CPRGER 502CP 24-pin RGE Reel (Large) SN65LVPE502CPRGET 502CP 24-pin RGE Reel (Small) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): SN65LVPE502CP SN65LVPE502CP SLLSE79B – MARCH 2011 – REVISED FEBRUARY 2012 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VALUE Supply voltage range (2) Voltage range MAX VCC –0.5 4 V Differential I/O –0.5 4 V Control I/O –0.5 VCC + 0.5 V (3) ±5000 V Charged-device model (4) ±1500 V Machine model (5) ±200 V Human body model Electrostatic discharge Continuous power dissipation (1) (2) (3) (4) (5) UNIT MIN See Thermal Table Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values, except differential voltages, are with respect to network ground terminal. Tested in accordance with JEDEC Standard 22, Test Method A114-B Tested in accordance with JEDEC Standard 22, Test Method C101-A Tested in accordance with JEDEC Standard 22, Test Method A115-A THERMAL INFORMATION SN65LVPE502CP THERMAL METRIC (1) RGE PACKAGE UNITS 24 PINS θJA Junction-to-ambient thermal resistance 46 θJCtop Junction-to-case (top) thermal resistance 42 θJB Junction-to-board thermal resistance 13 θJCbot Junction-to-case (bottom) thermal resistance 4 (1) °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. THERMAL CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX (1) UNIT PD Device power dissipation RSVD, EN_RXD, EQ cntrl pins = NC, K28.5 pattern at 5 Gbps, VID = 1000mVp-p 330 450 mW PSlp Device power dissipation in sleep mode EN_RXD= GND 0.3 1 mW (1) The maximum rating is simulated under 3.6V VCC. Device Power The SN65LVPE502CP is designed to operate from a single 3.3V supply. Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): SN65LVPE502CP 3 SN65LVPE502CP SLLSE79B – MARCH 2011 – REVISED FEBRUARY 2012 www.ti.com RECOMMENDED OPERATING CONDITIONS PARAMETER VCC Supply voltage CCOUPLING AC Coupling capacitor CONDITIONS MIN 3 Operating free-air temperature TYP MAX UNITS 3.6 V 75 3.3 200 nF 0 85 °C DEVICE PARAMETERS EN_RXD, RSVD, EQ cntrl = NC, K28.5 pattern at 5 Gbps, VID = 1000mVp-p ICC ICCRx.Detect Supply current ICCsleep 100 In Rx.Detect mode EN_RXD = GND ICCU2-U3 Link in USB low power state 120 2 5 0.01 0.1 21 Maximum data rate 5 tENB Device enable time Sleep mode exit time EN_RXD L → H With Rx termination present tDIS Device disable time Sleep mode entry time EN_RXD H → L TRX.DETECT Rx.Detect start event Power-up time mA Gbps 100 µs 2 µs 100 µs CONTROL LOGIC VIH High level input voltage 1.4 VCC V VIL Low level input voltage –0.3 0.5 V VHYS Input hysteresis 150 OSx, EQx, DEx = VCC IIH High level input current EN_RXD = VCC 1 RSVD = VCC IIL Low level input current 4 –30 EN_RXD = GND –30 Submit Documentation Feedback µA 30 OSx, EQx, DEx = GND RSVD = GND mV 30 µA –1 Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): SN65LVPE502CP SN65LVPE502CP SLLSE79B – MARCH 2011 – REVISED FEBRUARY 2012 www.ti.com ELECTRICAL CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER CONDITIONS MIN TYP MAX UNITS 1200 mVp-p RECEIVER AC/DC Vindiff_p-p RX1, RX2 input voltage swing VCM_RX RX1, RX2 common mode voltage AC coupled differential RX peak to peak signal 100 VinCOM_P RX1, RX2 AC peak common mode voltage ZDC_RX DC common mode impedance 18 Zdiff_RX DC differential input impedance 72 50 85 3.3 Measured at Rx pins with termination enabled ZRX_High_IMP+ DC Input high impedance Device in sleep mode Rx termination not powered measured with respect to GND over 500mV max VRX-LFPS-DETpp Low voltage periodic signaling (LFPS) detect threshold Measured at receiver pin, below minimum output is squelched, above max input signal is passed to output RLRX-DIFF Differential return loss RLRX-CM Common mode return loss V 150 mVP 26 30 Ω 80 120 Ω 100 kΩ 300 50 MHz – 1.25 GHz 10 11 1.25 GH – 2.5 GHz 6 7 50 MHz– 2.5 GHz 11 13 800 1042 mVpp dB dB TRANSMITTER AC/DC RL = 100 Ω ±1%, DEx, OSx = NC, Transition Bit VTXDIFF_TB_P-P Differential peak-to-peak output voltage (VID = 800, 1200 mVpp, 5Gbps) VTXDIFF_NTB_P-P RL = 100 Ω ±1%, DEx = NC, OSx = GND Transition Bit 908 RL = 100 Ω ±1%, DEx = NC, OSx = VCC Transition Bit 1127 RL = 100 Ω ±1%, DEx=NC, OSx = 0,1,NC Non-Transition Bit 1042 RL = 100 Ω ±1%, DEx=0 OSx = 0,1,NC Non-Transition Bit 661 RL = 100 Ω ±1%, DEx=1 OSx = 0,1,NC Non-Transition Bit 507 DE1/DE2 = NC DE De-emphasis level OS1,2 = NC (for OS1, 2 = 1 and 0 see Table 2) De-emphasis width Zdiff_TX DC differential impedance ZCM_TX DC common mode impedance mV mV 0 –3.0 DE1/DE2 = 0 –3.5 –4.0 dB –6.0 DE1/DE2 = 1 TDE 1200 0.85 UI 72 90 120 Ω 18 23 30 Ω f = 50 MHz – 1.25 GHz 9 10 f = 1.25 GHz – 2.5 GHz 6 7 11 12 Measured w.r.t to AC ground over 0-500mV RLdiff_TX Differential return loss dB RLCM_TX Common mode return loss f = 50 MHz – 2.5 GHz ITX_SC TX short circuit current TX± shorted to GND VTX_CM_DC Transmitter DC common-mode voltage VTX_CM_AC_Active TX AC common mode voltage active VTX_idle_diff-AC-pp Electrical idle differential peak to peak output voltage VTX_CM_DeltaU1-U0 Absolute delta of DC CM voltage during active and idle states VTX_idle_diff-DC DC Electrical idle differential output voltage Voltage must be low pass filtered to remove any AC component Vdetect Voltage change to allow receiver detect Positive voltage to sense receiver termination tR, tF Output rise/fall time 20%–80% of differential voltage measured 1" from the output pin tRF_MM Output rise/fall time mismatch 20%–80% of differential voltage measured 1" from the output pin 1.5 20 ps Tdiff_LH, Tdiff_HL Differential propagation delay De-Emphasis = –3.5 dB (CH 0 and CH 1). Propagation delay between 50% level at input and output 305 370 ps tidleEntry, tidleExit Idle entry and exit times See Figure 4 4 6 CTX Tx input capacitance to GND At 2.5 GHz dB 60 2.0 HPF to remove DC 2.6 3.0 V 30 100 mVpp 10 mVpp 200 mV 10 mV 600 mV 0 35 0 30 65 ps 1.25 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): SN65LVPE502CP mA ns pF 5 SN65LVPE502CP SLLSE79B – MARCH 2011 – REVISED FEBRUARY 2012 www.ti.com ELECTRICAL CHARACTERISTICS (continued) over recommended operating conditions (unless otherwise noted) PARAMETER CONDITIONS MIN TYP MAX 0.23 0.5 0.14 0.3 Random jitter (Rj) 0.08 0.2 Total jitter (Tj) at point B 0.15 0.5 0.07 0.3 0.08 0.2 UNITS EQUALIZATION TTX-EYE (1) (2) DJTX (2) RJTX (2) (4) TTX-EYE Total jitter (Tj) at point A (1) (2) DJTX (2) Deterministic jitter (Dj) RJTX (2) (4) Random jitter (Rj) (1) (2) (3) (4) Device setting: OS1 = L, DE1 = –6 dB, EQ1 = 7 dB Deterministic jitter (Dj) Device setting: OS2 = H, DE2 = –6 dB, EQ2 = 7dB UI (3)p-p UI (3)p-p Includes RJ at 10-12 BER Determininstic jitter measured with K28.5 pattern, Random jitter measured with K28.5 pattern at the ends of reference channel in Figure 6, VID=1000mVpp, 5Gbps, –3.5dB DE from source UI = 200ps Rj calculated as 14.069 times the RMS random jitter for 10-12 BER IN Tdiff_HL Tdiff_LH OUT Figure 3. Propagation Delay IN+ VEID_TH Vcm INtidleEntry tidleExit OUT + Vcm OUT - Figure 4. Electrical Idle Mode Exit and Entry Delay 80% 20% tr tf Figure 5. Ouput Rise and Fall Times 6 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): SN65LVPE502CP SN65LVPE502CP SLLSE79B – MARCH 2011 – REVISED FEBRUARY 2012 www.ti.com Jitter Measurement CH1 SN65LVPE502CP A 1 2 AWG* CH1 Up to 3 m (30 AWG) 20" 4" 1"-6" B AWG* CH2 Jitter Measurement CH2 Figure 6. Jitter Measurement Setup 1-bit 1 to N bits tDE DEx = 0dB 1-bit 1 to N bits -3.5dB -6dB Vcm VTXDIFF_NTB_P-P VTXDIFF_TB_P-P tDE Figure 7. Output De-Emphasis Levels OSx = NC Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): SN65LVPE502CP 7 SN65LVPE502CP SLLSE79B – MARCH 2011 – REVISED FEBRUARY 2012 www.ti.com DEVICE INFORMATION VCC EQ1 DE1 OS1 EN_RXD GND 1 6 NC SN65LVPE502CP 24 7 NC TX1- RX1CH1 RX1+ TX1+ Thermal Pad (must be soldered to GND plane) GND GND RX2- TX2CH2 12 TX2+ RX2+ 19 13 18 GND EQ2 DE2 OS2 RSVD VCC Bottom View GND EN_RXD OS1 DE1 EQ1 VCC 6 NC 1 SN65LVPE502CP 7 24 NC TX1- RX1CH1 RX1+ TX1+ Thermal Pad (must be soldered to GND plane) GND TX2- GND RX2- CH2 CH2 CH2 TX2+ 12 19 RX2+ 18 13 VCC RSVD OS2 DE2 EQ2 GND Top View Figure 8. Flow-Through Pin-Out Table 1. Pin Functions PIN Number Name I/O Type Description HIGH SPEED DIFFERENTIAL I/O PINS 8 8 RX1– I, CML 9 RX1+ I, CML 20 RX2– I, CML 19 RX2+ I, CML Non-inverting and inverting CML differential input for CH 1 and CH 2. These pins are tied to an internal voltage bias by dual termination resistor circuit. Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): SN65LVPE502CP SN65LVPE502CP SLLSE79B – MARCH 2011 – REVISED FEBRUARY 2012 www.ti.com Table 1. Pin Functions (continued) PIN I/O Type Number Name 23 TX1– O, VML 22 TX1+ O, VML 11 TX2– O, VML 12 TX2+ O, VML Description Non-inverting and inverting VML differential output for CH 1 and CH 2. These pins are internally tied to voltage bias by termination resistors. DEVICE CONTROL PIN 5 EN_RXD 14 7, 24 I, LVCMOS Sets device operation modes per Table 2. Internally pulled to VCC RSVD I, LVCMOS RSVD, internally pulled to GND. Can be left as No-connect. NC No-connect Pads are not internally connected EQ CONTROL PINS (1) 3, 16 DE1, DE2 I, LVCMOS Selects de-emphasis settings for CH 1 and CH 2 per Table 2. Internally tied to Vcc/2 2, 17 EQ1, EQ2 I, LVCMOS Selects equalization settings for CH 1 and CH 2 per Table 2. Internally tied to Vcc/2 4, 15 OS1, OS2 I, LVCMOS Selects output amplitude for CH 1 and CH 2 per Table 2. Internally tied to Vcc/2 POWER PINS VCC Power Positive supply should be 3.3V ± 10% 6, 10, 18, 21 GND Power Supply ground 1,13 (1) Internally biased to Vcc/2 with >200kΩ pull-up/pull-down. When pins are left as NC board leakage at this pin pad must be < 1 µA otherwise drive to Vcc/2 to assert mid-level state Table 2. Signal Control Pin Setting OUTPUT SWING AND EQ CONTROL (at 2.5 GHz) OSx (1) TRANSISTION BIT AMPLITUDE (TYP mVpp) EQx (1) EQUALIZATION (dB) NC (default) 1042 NC (default) 0 0 908 0 7 1127 1 15 1 OUTPUT DE CONTROL (at 2.5 GHz) DEx (1) OSx (1) = NC OSx (1) = 0 OSx (1) = 1 NC (default) 0 dB 0 dB 0 dB 0 –3.5 dB –2.2 dB –4.4 dB 1 –6.0 dB –5.2 dB –6.0 dB CONTROL PINS SETTINGS (1) EN_RXD DEVICE FUNCTION 1 (default) Normal Operation 0 Sleep Mode Where x = Channel 1 or Channel 2 USB Host USB Device SN65LVPE502CP Device PCB 8"-20" 2"-6" Up to 3 m (30 AWG ) 1 "-6 " NOTE: For more detailed placement example of redriver see typical eye diagrams and jitter plots at end of data sheet. Figure 9. Redriver Placement Example Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): SN65LVPE502CP 9 SN65LVPE502CP SLLSE79B – MARCH 2011 – REVISED FEBRUARY 2012 www.ti.com DETAILED DESCRIPTION Programmable EQ, De-Emphasis and Amplitude Swing The SN65LVPE502CP is designed to minimize signal degradation effects such as crosstalk and inter-symbol interference (ISI) that limits the interconnect distance between two devices. The input stage of each channel offers selectable equalization settings that can be programmed to match loss in the channel. The differential outputs provide selectable de-emphasis to compensate for the anticipated distortion USB 3.0 signal will experience. Level of de-emphasis will depend on the length of interconnect and its characteristics. The SN65LVPE502CP provides a unique way to tailor output de-emphasis on a per channel basis with use of DE and OS pins. All Rx and Tx equalization settings supported by the device are programmed by six 3-state pins as shown in Table 2. Low Power Modes Device supports three low power modes as described below 1. Sleep Mode Initiated anytime EN_RXD undergoes a high to low transition and stays low or when device powers up with EN_RXD set low. In sleep mode both input and output terminations are held at HiZ and device ceases operation to conserve power. Sleep mode max power consumption is 1mW, entry time is 2µs, device exits sleep mode to Rx.Detect mode after EN_RXD is driven to Vcc, exit time is 100µs max. 2. RX Detect Mode--When no remote device is connected Anytime LVPE502CP detects a break in link (i.e. when upstream device is disconnected) or after power-up fails to find a remote device, LVPE502CP goes to Rx Detect mode and conserves power by shutting down majority of its internal circuitry. In this mode input termination for both channels are driven to Hi-Z. In Rx Detect mode device power is