0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
TPS2590EVM

TPS2590EVM

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    -

  • 描述:

    TPS2590 - Power Management, Hot Swap Controller Evaluation Board

  • 数据手册
  • 价格&库存
TPS2590EVM 数据手册
User's Guide SLUU373A – July 2009 – Revised June 2014 TPS2590 Hot Swap Controller Evaluation Module This user’s guide describes the setup and operation of the TPS2590 evaluation module. 1 2 3 4 5 6 7 8 9 Contents Introduction ................................................................................................................... 2 Description .................................................................................................................... 2 2.1 Applications .......................................................................................................... 2 2.2 Features .............................................................................................................. 2 EVM Block Diagram ......................................................................................................... 3 Schematic ..................................................................................................................... 4 Bill of Materials ............................................................................................................... 5 EVM PCB Layout ............................................................................................................ 6 Circuit Description ........................................................................................................... 8 7.1 Test Points ........................................................................................................... 8 7.2 Connectors .......................................................................................................... 8 7.3 Jumpers .............................................................................................................. 8 7.4 Switches ............................................................................................................. 8 EVM Test Setup.............................................................................................................. 9 8.1 Test Equipment ..................................................................................................... 9 8.2 Equipment Supplied ................................................................................................ 9 8.3 Recommended Test Setup ........................................................................................ 9 8.4 Operation ........................................................................................................... 10 Test Results ................................................................................................................. 10 List of Figures 1 TPS2590EVM Block Diagram .............................................................................................. 3 2 TPS2590EVM Schematic ................................................................................................... 4 3 Component Placement (Top View) 4 5 6 7 8 ....................................................................................... 6 Board Layout (Top View) ................................................................................................... 6 Board Layout (Bottom View) ............................................................................................... 7 Component Placement (Bottom View) .................................................................................... 7 Equipment Connections..................................................................................................... 9 Example Scope Trace ..................................................................................................... 10 List of Tables 1 TPS2590EVM Bill of Materials ............................................................................................. 5 2 Test Points .................................................................................................................... 8 3 Connectors 4 Jumpers ....................................................................................................................... 8 5 EVM Configurations ......................................................................................................... 9 ................................................................................................................... SLUU373A – July 2009 – Revised June 2014 Submit Documentation Feedback TPS2590 Hot Swap Controller Evaluation Module Copyright © 2009–2014, Texas Instruments Incorporated 8 1 Introduction 1 www.ti.com Introduction This user’s guide describes the features of the TPS2590EVM. The TPS2590 schematic, printed-circuit board (PCB) layout, and bill of materials (BOM) are provided as well as a setup and getting started. 2 Description The EVM is a 3- to 18-V module using the TPS2590 or TPS2591 hot swap controller with integrated MOSFET. At power on, the output is power limited to control inrush current and protect the MOSFET. On an overcurrent condition, the controller interrupts power to the load at high speed and signals load status. Operating current, fault current and fault timer settings are hardware programmable. 2.1 Applications Server: • Plug-in Circuit Boards • RAID / Disk Drive Telecom: • ATCA • Micro-ATCA General Hot Plug 2.2 Features • • • • • • • • • • • 3- to 20-V operation Controlled inrush current Fast circuit breaker control Hardware programmable – Operating current – Fault current – Fault timer to avoid nuisance tripping – Latch off or retry. TPS2590 is pin selectable LED status display A slide switch controls the ENABLE signal The area under the TPS2590 is copper pour with vias to the internal ground to take advantage of the power pad package On-board transorb for overvoltage input protection A common diode at the output prevents a negative spike if the load is removed while powered on Test points available to monitor circuit operation Design Calculator Tool (http://www.ti.com/product/TPS2590/toolssoftware) All trademarks are the property of their respective owners. 2 TPS2590 Hot Swap Controller Evaluation Module Copyright © 2009–2014, Texas Instruments Incorporated SLUU373A – July 2009 – Revised June 2014 Submit Documentation Feedback EVM Block Diagram www.ti.com 3 EVM Block Diagram Figure 1 shows the EVM block diagram. POWER TPS2590 LOAD+ FAULT INDICATOR ENABLE GND LOAD- Figure 1. TPS2590EVM Block Diagram SLUU373A – July 2009 – Revised June 2014 Submit Documentation Feedback TPS2590 Hot Swap Controller Evaluation Module Copyright © 2009–2014, Texas Instruments Incorporated 3 Schematic 4 www.ti.com Schematic Figure 2 shows the EVM schematic. Figure 2. TPS2590EVM Schematic 4 TPS2590 Hot Swap Controller Evaluation Module SLUU373A – July 2009 – Revised June 2014 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated Bill of Materials www.ti.com 5 Bill of Materials Table 1 lists the BOM for the EVM. Table 1. TPS2590EVM Bill of Materials Count RefDes Value Description Size Part Number MFR 2 C1, C3 0.1uF Capacitor Ceramic, 25V, X7R, 10% 0603 STD muRata 1 C2 1000pF Capacitor, Ceramic, 25V, X7R, 20% 0603 STD muRata 1 C4 .56uF Capacitor, Ceramic, 10V , X7R, 10% 0805 STD muRata 1 C5 1uF Capacitor, Ceramic, 25V, X7R, 20% 1206 STD muRata 1 C6 .1uF Capacitor Ceramic, 25V, X7R, 10% 0603 STD muRata 1 D1 LN1271R Diode, LED, Red, 20-mA, 0.9-mcd 0.068 x 0.049 inch LN1271R Panasonic 1 D2 MMBZ522 Diode, Zener, 4.3V, 350mW 9B SOT23 MMBZ5229B Motorola 1 D3 SMAJ18A Diode, SMT TVS 400W, 1-A, 18V SMA SMAJ18A Diodes 1 D4 MBR130L SFT1 Diode, Schottky, 1000-mA, 30-V SOD123 MBR130LSFT1 STD 4 J1, J2, J4, J5 7693 Screw Terminal 0.310 x 0.310 inch 7693 Keystone 1 J3 PEC02SA Header, 2-pin, 100mil spacing AN 0.100 inch x 2 PEC02SAAN Sullins 1 Q1 MMBT390 Bipolar, PNP, 40-V, 200-mA, 225-mW 6LT1 SOT23 MMBT3906LT1 On Semi 1 R1 0 Resistor, Chip, 1/16W, 1% 0603 STD Vishay 1 R2 499 Resistor, Chip, .5W, 1% 2512 STD STD 1 R3 10K Resistor, Chip, 1/16W, 5% 0603 STD Vishay 1 R4 1K Resistor, Chip, 1/16W, 1% 0603 STD Vishay 1 R5 10K Resistor, Chip, 1/16W, 1% 0603 STD Vishay 1 R6 20K Resistor, Chip, 1/16W, 5% 0603 STD Vishay 1 R7 300 Resistor, Chip, 1/10W, 5% 0805 STD Vishay 1 R8 40.2K Resistor, Chip, 1/16W, 1% 0603 STD Vishay 1 R9 49.9K Resistor, Chip, 1/16W, 1% 0603 STD Vishay 1 S1 09-03201- Switch, SPDT, Slide, PC-mount, 500-mA 02 0.400 x 0.100 inch 09-03201-02 EAO 7 TP1, TP2, TP3, TP4, TP5, TP6, TP9 5012 Test Point, White, Thru Hole 0.125 x 0.125 inch 5012 Keystone 4 TP10, TP11, TP12, TP13 GND Test Point, SM, 0.150 x 0.090 0.185 x 0.135 inch 5016 Keystone 4 TP7, TP8, TP14, TP15 Test Point, 0.062 Hole 0.250 inch 5012 Keystone 1 U1 IC, 3V to 20V Integrated FET Load Switch QFN-16 TPS2590RSA TI TPS2590 RSA SLUU373A – July 2009 – Revised June 2014 Submit Documentation Feedback TPS2590 Hot Swap Controller Evaluation Module Copyright © 2009–2014, Texas Instruments Incorporated 5 EVM PCB Layout 6 www.ti.com EVM PCB Layout Figure 3 through Figure 6 illustrate the board outline drawings. Figure 3. Component Placement (Top View) Figure 4. Board Layout (Top View) 6 TPS2590 Hot Swap Controller Evaluation Module Copyright © 2009–2014, Texas Instruments Incorporated SLUU373A – July 2009 – Revised June 2014 Submit Documentation Feedback EVM PCB Layout www.ti.com Figure 5. Board Layout (Bottom View) Figure 6. Component Placement (Bottom View) SLUU373A – July 2009 – Revised June 2014 Submit Documentation Feedback TPS2590 Hot Swap Controller Evaluation Module Copyright © 2009–2014, Texas Instruments Incorporated 7 Circuit Description www.ti.com 7 Circuit Description 7.1 Test Points Table 2 lists the test point descriptions. Table 2. Test Points 7.2 Name Description VIN Input voltage power supply 4.3 V 4.3-V reference EN Enable signal, high true FLT Fault signal, low true LATCH Latch signal, high true, low for retry VOUT Output voltage CT Fault timer capacitor GND Scope ground test point GND Scope ground test point GND Scope ground test point GND Scope ground test point Connectors Table 3 lists the connector descriptions. Table 3. Connectors 7.3 Connector Description J1 Main power input, VIN J2 Main power ground, GND J4 Load J5 Load ground, GND Jumpers R1 is used to disconnect the LEDs for test measurement of TPS2590 quiescent current. This 0-Ω resistor is normally installed. Table 4 provides the jumper description of jumper J3. Table 4. Jumpers 7.4 7.4.1 Jumper Description J3 TPS2590 Only Off = Latch, On = Retry Switches Enable Switch S1 The ENABLE slide switch turns on the hot plug controller to ramp the output voltage. When the switch is off, the output is off. 7.4.2 Indicators Red LED indicator for FAULT (FLT). 8 TPS2590 Hot Swap Controller Evaluation Module Copyright © 2009–2014, Texas Instruments Incorporated SLUU373A – July 2009 – Revised June 2014 Submit Documentation Feedback EVM Test Setup www.ti.com 8 EVM Test Setup 8.1 Test Equipment Voltage Source: The input voltage source, VIN is a 20-V variable dc source at 10 A. Oscilloscope: A digital oscilloscope can be used to monitor the test points. Current Probe: A current probe is helpful to observe turn-on characteristics of the external load. Recommended Wire Gague: Power is limited to 5 W; 18-gage wire, minimum, is recommended. 8.2 Equipment Supplied The TPS2590EVM module configured with TPS2590 is supplied. Table 5. EVM Configurations Evaluation Module Component HPA490EVM-001 TPS2590 spacer 8.3 Recommended Test Setup Figure 1 illustrates the equipment connections for power up and testing. • Connect the positive voltage input power supply to J1 and the negative voltage to GND, J2. Connectors J1 and J2 can accept #6 ring or spade lugs. • Connect the RC load at J4 and the load return at J5. The example here uses 220 µF, 15 Ω. • Scope to current probe to measure the load current. • Scope the VOUT and EN. Current Probe + Power Supply 12V@10A EN/ Vout - Scope J1 J4 J2 J5 220 µF 15 O Note: Connects to Scope Figure 7. Equipment Connections SLUU373A – July 2009 – Revised June 2014 Submit Documentation Feedback TPS2590 Hot Swap Controller Evaluation Module Copyright © 2009–2014, Texas Instruments Incorporated 9 EVM Test Setup 8.4 www.ti.com Operation Use the following steps for EVM operation: 1. Turn on the power supply. 2. Trigger the scope on EN low-going edge. 3. Slide the EN to the EN position as screened on the circuit board. 9 Test Results Observe waveforms similar to Figure 8. • The current to the load is not constant but increases after the initial inrush. Current is low, initially, because the voltage across the internal MOSFET is initially at its highest level and the controller is power-limiting the MOSFET. • Although the current limit, IFLT, is set to 4 A, the start up current never goes above 2.2 A because of the power limiting. However, 4 A is available to the steady state load when the MOSFET is fully enhanced. • At the end of the capacitor charge time, the current drops to the dc level powering the resistive part of the load, about 0.8 A. Refer to SLUS960 for more details. Figure 8. Example Scope Trace 10 TPS2590 Hot Swap Controller Evaluation Module Copyright © 2009–2014, Texas Instruments Incorporated SLUU373A – July 2009 – Revised June 2014 Submit Documentation Feedback Revision History www.ti.com Revision History Changes from Original (July 2009) to A Revision ........................................................................................................... Page • • • • • • • • • • Added Design Calculator tool and link to the list of features. ....................................................................... Changed device name in title of Figure 1. ............................................................................................. Changed schematic, Figure 2............................................................................................................ Changed contents of BOM. .............................................................................................................. Added Component Placement (Bottom View) image. ................................................................................ Changed Board Layout (Top View) image. ............................................................................................ Changed Board Layout (Bottom View) image. ........................................................................................ Added Component Placement (Bottom View) image. ................................................................................ Changed entire content of first paragraph in the Test Points section. ............................................................. Changed R9 to R1 in first paragraph of Jumpers section. ........................................................................... SLUU373A – July 2009 – Revised June 2014 Submit Documentation Feedback Revision History Copyright © 2009–2014, Texas Instruments Incorporated 2 3 4 5 6 6 7 7 8 8 11 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2014, Texas Instruments Incorporated
TPS2590EVM 价格&库存

很抱歉,暂时无法提供与“TPS2590EVM”相匹配的价格&库存,您可以联系我们找货

免费人工找货