TPS65652RTET

Sample & Buy Product Folder Support & Community Tools & Software Technical Documents TPS65652 SLVSDC8 – JANUARY 2016 TPS65652 Triple Output AMOLED Display Power Supply 1 Features • • 1 • • • 2.9-V to 4.5-V Input Voltage Range Synchronous Boost Converter (AVDD) – 5.2-V to 7.3-V Output Voltage (Programmable) – 5.8-V Default Output Voltage – 1% Accuracy – 80-mA Output Current Capability – 100-mA Output Current Protection (±20%) – VI to VO and VO to VI Isolation Synchronous Boost Converter (ELVDD) – 4.6-V to 5-V Output Voltage (Programmable) – 4.6-V Default Output Voltage – 0.5% Accuracy – 300-mA Output Current Capability – External Output Voltage Sensing Pin for Load Drop Compensation – Excellent Line Transient Response – VI to VO and VO to VI Isolation Synchronous Inverting Buck-Boost Converter (ELVSS) – –6.4-V to –1.4-V Output Voltage (Programmable) – –5.4-V Default Output Voltage – 0.7% Accuracy at –5.4 V (±40 mV) – 300-mA Output Current Capability – VI to VO and VO to VI Isolation Single-Wire Digital Interface for Programming • • • Short Circuit Protection Thermal Shutdown Available in 3-mm × 3-mm x 0.75-mm 16-Pin WQFN Package 2 Applications • • • Smartphones Small Size Tablets Active Matrix OLED Displays ≤ 8" 3 Description The TPS65652 is designed to drive AMOLED displays (Active Matrix Organic Light Emitting Diode) requiring V(AVDD), V(ELVDD) and V(ELVSS). The device integrates a boost converter for V(ELVDD), an inverting buck-boost converter for V(ELVSS) and a boost converter for V(AVDD), which are suitable for battery operated products. The digital interface control pin (CTRL) allows programming V(AVDD), V(ELVDD) and V(ELVSS) in digital steps. The TPS65652 uses a novel technology enabling excellent line and load regulation. To request the full data sheet, please send an email to: display_contact@list.ti.com Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) TPS65652 WQFN (16) 3.00 mm x 3.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. . Simplified Schematic SW1 SNS1 90 SW2 V(ELVS S) ±5.4 V / 300 mA OUT2 V(AVDD) 5.8 V / 80 mA OUT3 EN3 10 F VDDP VDDA 3u 10 F CTRL FD PGND GND CT 70 Efficiency (%) SW3 Ena ble discha rge 80 2u 10 F 10 H Ena ble V(ELVD D) / V(ELVS S) Pro gram d evi ce 100 10 F 4.7 H Ena ble V(AVDD) Efficiency V(ELVD D) 4.6 V / 300 mA OUT1 4.7 H VI = 2.9 V to 4.5 V 60 50 40 30 20 V (ELVDD) = 4.6 V 10 V(ELVSS) = 5.4 V TOKO DFE252012C-4R7 0 0 50 100 150 200 Output Current (mA) VI = 4.5 V VI = 3.7 V VI = 2.9 V 250 300 D008 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TPS65652 SLVSDC8 – JANUARY 2016 www.ti.com 4 Device and Documentation Support 4.1 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 4.2 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 4.3 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 4.4 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 5 Mechanical, Packaging, and Orderable Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 2 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: TPS65652 PACKAGE OPTION ADDENDUM www.ti.com 11-Jan-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) TPS65652RTER PREVIEW WQFN RTE 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 T65652 TPS65652RTET PREVIEW WQFN RTE 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 T65652 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Jan-2016 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jan-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TPS65652RTER WQFN RTE 16 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 TPS65652RTET WQFN RTE 16 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jan-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS65652RTER WQFN RTE 16 3000 552.0 367.0 36.0 TPS65652RTET WQFN RTE 16 250 552.0 185.0 36.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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