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TPS92315DBVR

TPS92315DBVR

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    SOT23-6

  • 描述:

    IC LED DRIVER OFFLINE SOT23-6

  • 数据手册
  • 价格&库存
TPS92315DBVR 数据手册
TPS92315 www.ti.com SNVS904A – NOVEMBER 2012 – REVISED FEBRUARY 2013 Off-Line Primary-Side Sensing Controller Check for Samples: TPS92315 FEATURES DESCRIPTION • The TPS92315 flyback power supply controller provides isolated output current regulation without the use of an optical coupler. The devices process operating information from the primary power switch and an auxiliary flyback winding to provide precise output current control. Low start-up current, dynamically controlled operating states and a tailored modulation profile support very low stand-by power without sacrificing start-up time or output transient response. 1 • • • • • • • • Primary-Side Regulation (PSR) eliminates opto-coupler ±5% LED current regulation 130 kHz maximum switching frequency enables high power density SSL drivers designs Quasi-resonant valley switching operation for highest overall efficiency Patent-pending frequency jitter scheme to ease EMI compliance Wide VCC range (35V) allows small bias capacitor Drive output for MOSFET Protection functions: over-voltage, low-line, and over-current SOT23-6 package Control algorithms in the TPS92315 allow operating efficiencies to meet or exceed applicable standards. The drive output interfaces to a FET power switch. Discontinuous Conduction Mode (DCM) with valley switching is used to reduce switching losses. A combination of switching frequency and peak primary current amplitude modulation is used to keep conversion efficiency high across the full load and input voltage range. The controller has a maximum switching frequency of 130 kHz and always maintains control of the peak primary current in the transformer. Protection features help keep secondary and primary component stress levels in check across the operation range. APPLICATIONS • • LED lighting driver applications Small form factor LED light bulbs (E14, GU-10) SIMPLIFIED APPLICATION DIAGRAM 85-264VAC TPS92315 VCC GATE ISNS VSNS GND 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012–2013, Texas Instruments Incorporated TPS92315 SNVS904A – NOVEMBER 2012 – REVISED FEBRUARY 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ABSOLUTE MAXIMUM RATINGS (1) (2) (3) over operating free-air temperature range (unless otherwise noted) VALUE MIN Input voltage range UNIT MAX VCC 38 Continuous gate current sink IGATE 50 Continuous gate current source IGATE Self-limiting Peak VSNS pin current IVSNS -1.2 Gate-drive voltage at GATE IGATE -0.5 Self-limiting VSNS –0.75 7 ISNS –0.5 5 Voltage range Electrostatic discharge Human body model (HBM) QSS 009-105 (JESD22-A114A) 2000 Charged device model (CDM) QSS 009-147 (JESD22-C101B.01) 500 Junction temperature range, TJ -55 150 Storage temperature range, Tstg -65 150 Lead temperature 0.6 mm from case for 10 seconds (1) (2) (3) V mA V V °C 260 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to the network ground terminal unless otherwise noted. Voltage values are with respect to the SW terminal. RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) MIN TYP MAX UNIT VCC Bias supply operating voltage CVCC VCC bypass capacitor RLC ISNS pin line compensation programming resistor 0 kΩ IVSNS VSNS pin current -1 mA TJ Operating junction temperature 2 9 35 V 0.047 1 µF −20 Submit Documentation Feedback 125 °C Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPS92315 TPS92315 www.ti.com SNVS904A – NOVEMBER 2012 – REVISED FEBRUARY 2013 THERMAL INFORMATION TPS92315 THERMAL METRIC (1) DBV UNITS 6 PINS Junction-to-ambient thermal resistance (2) θJA (3) 180.0 θJCtop Junction-to-case (top) thermal resistance θJB Junction-to-board thermal resistance (4) 44.4 ψJT Junction-to-top characterization parameter (5) 5.1 ψJB Junction-to-board characterization parameter (6) 43.8 (1) (2) (3) (4) (5) (6) 71.2 °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDECstandard test exists, but a close description can be found in the ANSI SEMI standard G30-88. The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7). The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7). Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPS92315 3 TPS92315 SNVS904A – NOVEMBER 2012 – REVISED FEBRUARY 2013 www.ti.com ELECTRICAL CHARACTERISTICS over operating free-air temperature range, VCC = 25V, -20°C ≤ TA ≤ 125°C, TJ = TA (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNITS Bias Supply Input IRUN Supply current, run IGATE = 0, run state 2.1 3.0 ISTART Supply current, start VVCC = 18V, IGATE = 0, start state 1.0 3.0 mA µA IFAULT Supply current, fault IGATE = 0, fault state 2.1 2.8 mA Under-Voltage Lockout VVCCON VCC turn-on threshold VVCC low to high 18 21 24 VVCCOFF VCC turn-off threshold VVCC high to low 7.70 8.10 8.45 VVSNSR Regulating level Measured at no-load condition, TJ = 25°C 4.0 4.05 4.1 V VVSNSNC Negative clamp level IVSNS = -300 µA, volts below ground 190 250 325 mV IVSNSB Input bias current VVSNS = 4V -0.5 0 0.5 µA VISNSTMAX Max ISNS threshold voltage VVSNS = 3.7V (1) 715 750 775 VISNSTMIN Min ISNS threshold voltage VVSNS = 4.35V (1) 230 250 270 KAM AM control ratio VISNSTMAX / VISNSTMIN 2.75 3.0 3.15 V/V VCCR constant-current regulating level CC regulation constant 310 319 329 mV KLC Line compensating current ratio IVSNSLS = -300 µA, IVSNSLS / current out of ISNS pin 23 25 28 A/A TISNSLEB Leading-edge blanking time GATE output duration, VISNS = 1 V 195 235 275 ns IGATE GATE source current VGATE = 8V, VVCC = 9V 20 25 RGATELS GATE low-side drive resistance IGATE = 10 mA VGATECL GATE clamp voltage RGATESS GATE pull-down in start state V VSNS Input ISNS Input mV GATE VVCC = 35V 150 mA Ω 6 12 14 16 V 200 230 kΩ Timing FSW(max) Maximum switching frequency VVSNS = 3.7V (1) 120 130 140 kHz FSW(min) Minimum switching frequency VVSNS = 4.35V (1) 875 1000 1100 Hz TZTO Zero-crossing timeout delay 1.80 2.10 2.45 µs (1) 4 These devices automatically vary the control frequency and current sense thresholds to improve EMI performance, these threshold voltages and frequency limits represent average levels. Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPS92315 TPS92315 www.ti.com SNVS904A – NOVEMBER 2012 – REVISED FEBRUARY 2013 ELECTRICAL CHARACTERISTICS (continued) over operating free-air temperature range, VCC = 25V, -20°C ≤ TA ≤ 125°C, TJ = TA (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNITS Protection VOVP Over-voltage threshold At VSNS input, TJ = 25°C 4.52 4.6 4.68 VOCP Over-current threshold At ISNS input 1.4 1.5 1.6 IVSNSL(run) VSNS line-sense run current Current out of VSNS pin – increasing 190 220 260 IVSNSL(stop) VSNS line-sense stop current Current out of VSNS pin – decreasing 70 80 95 KVSNSL VSNS line-sense ratio IVSNSL(run) / IVSNSL(stop) 2.5 2.8 3.05 TJ(stop) Thermal shut-down temperature Internal junction temperature V µA A/A 165 °C DEVICE INFORMATION Functional Block Diagram POWER & FAULT MANAGEMENT UVLO 21V/8V VCC OC FAULT OV FAULT TSD LINE FAULT VCC 5V GND 4.05V 25 mA + CONTROL LAW E/A VSNS SAMPLER GATE VISNS + VALLEY SWITCHING 14V 1 / fSW 200k OV FAULT VOVP S Q R Q CURRENT REGULATION VISNS LEB IVSNSL LINE SENSE ISNS + SECONDARY TIMING DETECT IVSNSL 10k IVSNSL / KLC + LINE FAULT OC FAULT + 1.5V 2.2V / 0.80V Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPS92315 5 TPS92315 SNVS904A – NOVEMBER 2012 – REVISED FEBRUARY 2013 www.ti.com DBV PACKAGE 6 PIN (TOP VIEW) DNC 1 6 VSNS VCC 2 5 GND GATE 3 4 ISNS Table 1. TERMINAL FUNCTIONS PIN 6 I/O DESCRIPTION NAME NO. DNC 1 — DNC, the Do Not Connect pin is only for device testing. For all end applications, this pin should left unconnected. VCC 2 P VCC is the supply pin to the controller. A carefully placed bypass capacitor to GND is required on this pin. The turn on threshold is 21V and turn off threshold is 8V. GATE 3 O GATE is an output used to drive the gate of an external high voltage MOSFET switching transistor. The driver output is limited to 14V with a 25 mA current source turn on and 6Ω turn off internal resistance. ISNS 4 I ISNS, current sense input connects to a ground-referenced current-sense resistor in series with the power switch. The resulting voltage is used to monitor and control the peak primary current. A series resistor can be added to this pin to compensate the peak switch current levels as the AC-mains input varies. The current sense voltage range is 0.25V to 0.75V for the peak primary current range. GND 5 P The GND pin is both the reference pin for the controller and the low-side return for the drive output. Special care should be taken to return all AC decoupling capacitors as close as possible to this pin and avoid any common trace length with analog signal return paths. VSNS 6 I VSNS, voltage sense is an input used to provide voltage and timing feedback to the controller. This pin is connected to a voltage divider between an auxiliary winding and GND. The value of the upper resistor of this divider is used to program low line shutdown thresholds and compensate the current sense threshold at the ISNS pin across the AC input range. Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPS92315 TPS92315 www.ti.com SNVS904A – NOVEMBER 2012 – REVISED FEBRUARY 2013 Detailed Pin Description VCC (Device Bias Voltage Supply): The VCC pin is connected to a bypass capacitor to ground and a start-up resistance to the input bulk capacitor (+) terminal. The VCC turn-on UVLO threshold is 21 V and turn-off UVLO threshold is 8.1 V, with an available operating range up to 35 V. GND (Ground): This is a single ground reference external to the device for the gate drive current and analog signal reference. Place the VCC bypass capacitor close to GND and VCC with short traces to minimize noise on the VSNS and ISNS signal pins. VSNS (Voltage-Sense): The VSNS pin is connected to a resistor divider from the auxiliary winding to ground. The output-voltage feedback information is sampled at the end of the transformer secondary current demagnetization time to provide an accurate representation of the output voltage. Timing information to achieve valley-switching and to control the duty cycle of the secondary transformer current is determined by the waveform on the VSNS pin. Avoid placing a filter capacitor on this input which would interfere with accurate sensing of this waveform. The VSNS pin also senses the bulk capacitor voltage to provide for AC-input run and stop thresholds, and to compensate the current-sense threshold across the AC-input range. This information is sensed during the MOSFET on-time. For the AC-input run/stop function, the run threshold on VSNS is 220 µA and the stop threshold is 80 µA. The values for the auxilliary voltage divider upper-resistor RAUX1 and lower-resistor RAUX2 can be determined by the equations below. VIN(run) × 2 R AUX1 = NPA × IVSNS(run) where • • • NPA is the transformer primary-to-auxiliary turns ratio, VIN(run) is the AC RMS voltage to enable turn-on of the controller (run), IVSNSL(run) is the run-threshold for the current pulled out of the VSNS pin during the MOSFET on-time. (see ELECTRICAL CHARACTERISTICS) R AUX 2 = (1) R AUX1 × VVSNSR NAS × (VOCV + VF ) − VVSNSR where • • • • • VOCV is the converter regulated output voltage VF is the output rectifier forward drop at near-zero current NAS is the transformer auxiliary to secondary turns ratio RAUX1 is the VSNS divider high-side resistance VVSNSR is the CV regulating level at the VSNS input (see ELECTRICAL CHARACTERISTICS) (2) GATE (Gate Drive): The GATE pin is connected to the MOSFET gate pin, usually through a series resistor. The gate driver provides a gate-drive signal limited to 14V. The turn-on characteristic of the driver is a 25 mA current source which limits the turn-on dv/dt of the MOSFET drain and reduces the leading-edge current spike, but still provides gate-drive current to overcome the Miller plateau. The gate-drive turn-off current is determined by the low-side driver RDS(on) and any external gate-drive resistance. The user can reduce the turn-off MOSFET drain dv/dt by adding external gate resistance. Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPS92315 7 TPS92315 SNVS904A – NOVEMBER 2012 – REVISED FEBRUARY 2013 www.ti.com ISNS (Current Sense): The current-sense pin is connected through a series resistor (RLC) to the current-sense resistor (RISNS). The series resistor RLC provides the function of feed-forward line compensation to eliminate change in IPP (primary side peak current) due to change in di/dt and the propagation delay of the internal comparator and MOSFET turn-off time. There is an internal leading-edge blanking time of 235 ns to eliminate sensitivity to the MOSFET turn-on current spike. It should not be necessary to place a bypass capacitor on the ISNS pin. The value of RISNS is determined by the target output current in constant-current (CC) regulation. The values of RISNS and RLC can be determined by the equations below. The term ηXFMR is intended to account for the energy stored in the transformer but not delivered to the secondary. This includes transformer resistance and core loss, bias power, and primary-to-secondary leakage ratio. Example: With a transformer core and winding loss of 5%, primary-to-secondary leakage inductance of 3.5%, and bias power to output power ratio of 1.5%. The ηXFMR value is approximately: 1 - 0.05 - 0.035 - 0.015 = 0.9. V × NPS RISNS = CCR × ηXFMR 2IOCC where • • • • RLC = VCCR is a current regulation constant (see ELECTRICAL CHARACTERISTICS), NPS is the transformer primary-to-secondary turns ratio (a ratio of 7 to 8 is recommended for a 9V output), IOCC is the target output current in constant-current regulation, ηXFMR is the transformer efficiency. (3) K LC × R AUX1 × RISNS × TD × NPA LP where • • • • • • 8 RAUX1 is the VSNS pin high-side resistor value, RISNS is the current-sense resistor value, TD is the current-sense delay including MOSFET turn-off delay, add ~50 ns to MOSFET delay, NPA is the transformer primary-to-auxiliary turns ratio, LP is the transformer primary inductance, KLC is a current-scaling constant (see ELECTRICAL CHARACTERISTICS). Submit Documentation Feedback (4) Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPS92315 TPS92315 www.ti.com SNVS904A – NOVEMBER 2012 – REVISED FEBRUARY 2013 TYPICAL CHARACTERISTICS At VCC = 25 V, unless otherwise noted. 10 10 Run State, VCC = 25 V Run State 1 IVCC - Bias Supply Current (mA) I VCC - Bias Supply Current (mA) 1 0.1 Wait State 0.01 VCC Turn ON VCC Turn OFF 0.001 Wait State, VCC = 25 V 0.1 0.01 0.001 Start State, VCC = 18 V 0.0001 Start State 0.0001 -25 0.00001 0 5 10 15 20 25 30 0 35 25 50 TJ - Temperature 75 100 125 (o C) VCC - Bias Supply Voltage (V) Figure 1. Bias Supply Current vs. Bias Supply Voltage Figure 2. Bias Supply Current vs. Temperature 4.10 300 250 VSNS Line Sense Current (µA) VVSNSR - VSNS Regulation Voltage (V) 4.08 4.06 4.04 4.02 4.00 I VSNSL(run) 200 150 100 I VSNSL(stop) 50 3.98 0 3.96 -25 0 25 50 75 100 125 -25 0 25 50 TJ - Temperature TJ - Temperature (oC) Figure 3. VSNS Regulation Voltage vs. Temperature 75 100 125 (o C) Figure 4. Line-Sense Current vs. Temperature Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPS92315 9 TPS92315 SNVS904A – NOVEMBER 2012 – REVISED FEBRUARY 2013 www.ti.com TYPICAL CHARACTERISTICS (continued) At VCC = 25 V, unless otherwise noted. 330 VCCR - Constatnt Current Regulating Level (mA) V ISNSTMIN - Minimum ISNS Threshold Voltage (mV) 270 265 260 255 250 245 240 235 230 325 320 315 310 -25 0 25 50 75 100 125 -25 0 TJ - Temperature (o C) 25 50 TJ - Temperature Figure 5. Minimum ISNS Threshold Voltage vs. Temperature 75 100 125 (o C) Figure 6. Constant-Current Regulating Level vs. Temperature 1100 34 VGATE = 8V, VVCC = 9V 32 I GATE - GATE Source Current (mA) FSW(min) - Minimum Switching Frequency (Hz) 1075 1050 1025 1000 975 950 925 28 26 24 22 900 20 875 -25 0 25 50 TJ - Temperature 75 100 125 -25 0 (o C) 25 50 TJ - Temperature Figure 7. Minimum Switching Frequency vs. Temperature 10 30 75 100 125 (o C) Figure 8. GATE Source Current vs. Temperature Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPS92315 TPS92315 www.ti.com SNVS904A – NOVEMBER 2012 – REVISED FEBRUARY 2013 TYPICAL CHARACTERISTICS (continued) VOVP - VSNS Over-Voltage Threshold (V) At VCC = 25 V, unless otherwise noted. Figure 9. Over-Voltage Threshold vs. Temperature Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPS92315 11 TPS92315 SNVS904A – NOVEMBER 2012 – REVISED FEBRUARY 2013 www.ti.com FUNCTIONAL DESCRIPTION The TPS92315 is a flyback power supply controller which provides accurate voltage and constant current regulation with primary-side feedback, eliminating the need for opto-coupler feedback circuits. The controller operates in discontinuous conduction mode with valley-switching to minimize switching losses. The modulation scheme is a combination of frequency and primary peak current modulation to provide high conversion efficiency across the load range. Another feature beneficial to achieve low quescient power without excessive start-up time is a wide operating VCC range to allow a high-value VCC start-up resistance and low-value VCC capacitance. During low-power operating ranges the device has power management features to reduce the device operating current at operating frequencies below 44 kHz. The TPS92315 controller includes features in the modulator to reduce the EMI peak energy of the fundamental switching frequency and harmonics. Accurate voltage and constant current regulation, fast dynamic response, and fault protection are achieved with primary-side control. A complete LED driver solution can be realized with a straightforward design process, low cost and low component count. Primary-Side Voltage Regulation Figure 10 illustrates a simplified flyback convertor with the main voltage regulation blocks of the device shown. The power train operation is the same as any DCM flyback circuit but accurate output voltage and current sensing is the key to primary-side control. Timing IS Bulk Voltage - VBULK Primary + VF - Secondary VOUT COUT Auxiliary RAUX1 VSNS RAUX2 Discriminator & Sampler Zero Crossings VCL Control Law GD GATE ‫־‬ Minimum Period And Peak Primary Current ISNS RISNS Figure 10. Simplified Flyback Convertor (with the main voltage regulation blocks) In primary-side control, the output voltage is sensed on the auxiliary winding during the transfer of transformer energy to the secondary. As shown in Figure 11 it is clear there is a down slope representing a decreasing total rectifier VF and resistance voltage drop (ISRS, where IS and RS are the current and equivalent resistance of the secondary winding) as the secondary current decreases to zero. To achieve an accurate representation of the secondary output voltage on the auxiliary winding, the discriminator reliably blocks the leakage inductance reset and ringing, continuously samples the auxiliary voltage during the down slope after the ringing is diminished, and captures the error signal at the time the secondary winding reaches zero current. The internal reference on VSNS is 4.05 V; the resistor divider is selected as outlined in the VSNS pin description. 12 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPS92315 TPS92315 www.ti.com SNVS904A – NOVEMBER 2012 – REVISED FEBRUARY 2013 VSNS Sample (VOUT + VF + ISRS) NA / NS 0V (VBULK) NA / NP Figure 11. Auxiliary Winding Voltage The TPS92315 VSNS signal sampler includes signal discrimination methods to ensure an accurate sample of the output voltage from the auxiliary winding. There are however some details of the auxiliary winding signal to ensure reliable operation, specifically the reset time of the leakage inductance and the duration of any subsequent leakage inductance ring. Refer to Figure 12 below for a detailed illustration of waveform criteria to ensure a reliable sample on the VSNS pin. The first detail to examine is the duration of the leakage inductance reset pedestal, TLK_RESET in Figure 12. Since this can mimic the waveform of the secondary current decay, followed by a sharp downslope, it is important to keep the leakage reset time less than 500 ns for IPRI minimum, and less than 1.5 µs for IPRI maximum. The second detail is the amplitude of ringing on the VAUX waveform following TLK_RESET. The peak-to-peak voltage at the VSNS pin should be less than approximately 100 mVp-p at least 200 ns before the end of the demagnetization time, tDM. If there is a concern with excessive ringing, it usually occurs during light or no-load conditions, when tDM is at the minimum. The tolerable ripple on VSNS is scaled up to the auxiliary winding voltage by RAUX1 and RAUX2, and is equal to 100 mV x (RAUX1 + RAUX2) / RAUX2. TLK_RESET TSMPL VSNS ring p-p TDM Figure 12. Auxiliary Waveform Details During voltage regulation, the controller operates in frequency modulation mode and amplitude modulation mode as illustrated in Figure 13 below. The internal operating frequency limits of the device are 130 kHz maximum and 1 kHz minimum. The transformer primary inductance and primary peak current chosen sets the maximum operating frequency of the converter. The output preload resistor and efficiency at low power determines the converter minimum operating frequency. There is no stability compensation required for the TPS92315 controller. Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPS92315 13 TPS92315 SNVS904A – NOVEMBER 2012 – REVISED FEBRUARY 2013 www.ti.com Control Law Profile in Constant Voltage (CV) Mode 130 kHz IPP (peak primary current) fSW (1 / MINP) IPP(max) IPP fSW 44 kHz FM AM IPP(max) / 3 FM fSW(min) = 1kHz 4.4 kHz 0.75 V 1.3 V 2.2 V 3.55 V 5V Control Voltage, E/A Output - VCL Figure 13. Frequency and Amplitude Modulation Modes (during voltage regulation) Primary-Side Current Regulation Timing information at the VSNS pin and current information at the ISNS pin allow accurate regulation of the secondary average current. The control law dictates that as power is increased in CV regulation and approaching CC regulation the primary-peak current is at IPP(max). Referring to Figure 14 below, the primary-peak current, turns ratio, secondary demagnetization time (tDM), and switching period (TSW) determine the secondary average output current. Ignoring leakage inductance effects, the average output current is given by Equation 5. When the average output current reaches the regulation reference in the current control block, the controller operates in frequency modulation mode to control the output current at any output voltage at or below the voltage regulation target as long as the auxiliary winding can keep VCC above the UVLO turn-off threshold. IPP tON IS NS NP tDM TSW Figure 14. Transformer Currents IOUT = 14 IPP NP t DM × × 2 NS TSW (5) Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPS92315 TPS92315 www.ti.com SNVS904A – NOVEMBER 2012 – REVISED FEBRUARY 2013 Output Voltage VOUT VOCV Output Current IOUT IOCC Figure 15. Typical Target Output V-I Characteristic Valley-Switching The TPS92315 utilizes valley-switching to reduce switching losses in the MOSFET, to reduce induced-EMI, and to minimize the turn-on current spike at the sense resistor. The controller operates in valley-switching in all load conditions unless the VDS ringing has diminished. Referring to Figure 16 below, the TPS92315 operates in a valley-skipping mode in most load conditions to maintain an accurate voltage or current regulation point and still switch on the lowest available VDS voltage. VDS VGATE Figure 16. Valley-Skipping Mode Start-Up Operation Upon application of input voltage to the converter, the start-up resistor connected to VCC from the bulk capacitor voltage (VBULK) charges the VCC capacitor. During charging of the VCC capacitor the device bias supply current is less than 1.5 µA. When VCC reaches the 21V UVLO turn-on threshold, the controller is enabled and the converter starts switching. The initial three cycles are limited to IPP(min). This allows sensing any initial input or output faults with minimal power delivery. After the initial three cycles at minimum IPP(min), the controller responds to the condition dictated by the control law. The converter remains in discontinuous mode during charging of the output capacitor(s), maintaining a constant output current until the output voltage is in regulation. Fault Protection There is comprehensive fault protection incorporated into the TPS92315. Protection functions include: • Output Over Voltage • Input Under Voltage • Internal Over Temperature Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPS92315 15 TPS92315 SNVS904A – NOVEMBER 2012 – REVISED FEBRUARY 2013 • • • www.ti.com Primary Over-current fault ISNS pin fault VSNS pin fault An UVLO reset and restart sequence applies for all fault protection events. The output over-voltage function is determined by the voltage feedback on the VSNS pin. If the voltage sample on VSNS exceeds 115% of the nominal VOUT, the device stops switching and keeps the internal circuitry enabled to discharge the VCC capacitor to the UVLO turn-off threshold. After that, the device returns to the start state and a start-up sequence ensues. The TPS92315 always operates with cycle-by-cycle primary peak current control. The normal operating range of the ISNS pin is 0.75V to 0.25V. There is additional protection if the ISNS pin reaches 1.5V. This results in a UVLO reset and restart sequence. There is no leading-edge blanking on the 1.5V threshold on ISNS. The line input run and stop thresholds are determined by current information at the VSNS pin during the MOSFET on-time. While the VSNS pin is clamped close to GND during the MOSFET on-time, the current through RAUX1 is monitored to determine a sample of the bulk capacitor voltage. A wide separation of run and stop thresholds allows clean start-up and shut-down of the power supply with the line voltage. The run current threshold is 220 µA and the stop current threshold is 80 µA. The internal over-temperature protection threshold is 165°C. If the junction temperature reaches this threshold the device initiates a UVLO reset cycle. If the temperature is still high at the end of the UVLO cycle, the protection cycle repeats. Protection is included in the event of component failures on the VSNS pin. If complete loss of feedback information on the VSNS pin occurs, the controller stops switching and restarts. 16 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPS92315 TPS92315 www.ti.com SNVS904A – NOVEMBER 2012 – REVISED FEBRUARY 2013 DESIGN PROCEDURE This procedure outlines the steps to design a constant-voltage, constant-current flyback converter using the TPS92315 family of controllers. Refer to the Figure 17 for component names and network locations. The design procedure equations use terms that are defined below. L1 DOUT LED+ ZD1 CIN2 CIN1 T1 CIN3 R1 D1 LP D2 LS 3–4 LEDs COUT 85-264VAC DVCC LAUX RAUX1 CVCC LED- RAUX2 CY Q1 TPS92315 VCC GATE RLC ISNS VSNS GND RISNS Figure 17. Design Procedure Application Example Definition of Terms Capacitance Terms in Farads • CBULK: total input capacitance of CIN1, CIN2 and CIN3. • CVCC: minimum required capacitance on the VCC pin. • COUT: minimum output capacitance required. Duty Cycle Terms • DMAGCC: secondary diode conduction duty cycle in CC, 0.425. • DMAX: MOSFET maximum on-time duty cycle. Frequency Terms in Hertz • fLINE: minimum line frequency. • fMAX: target full-load maximum switching frequency of the converter. • fMIN: minimum switching frequency of the converter, add 15% margin over the fSW(min) limit of the device. • fSW(min): minimum switching frequency (see ELECTRICAL CHARACTERISTICS). Current Terms in Amperes • IOCC: converter output constant-current target. • IPP(max): maximum transformer primary current. • ISTART: start-up bias supply current (see ELECTRICAL CHARACTERISTICS). • ITRAN : required positive load-step current. Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPS92315 17 TPS92315 SNVS904A – NOVEMBER 2012 – REVISED FEBRUARY 2013 • www.ti.com IVSNSL(run): VSNS pin run current (see ELECTRICAL CHARACTERISTICS). Current and Voltage Scaling Terms • KAM: maximum-to-minimum peak primary current ratio (see ELECTRICAL CHARACTERISTICS). • KLC: current-scaling constant (see ELECTRICAL CHARACTERISTICS). Transformer Terms • LP: transformer primary inductance. • NAS: transformer auxiliary-to-secondary turns ratio. • NPA: transformer primary-to-auxiliary turns ratio. • NPS: transformer primary-to-secondary turns ratio. Power Terms in Watts • PIN: converter maximum input power. • POUT: full-load output power of the converter. • PR1: VCC start-up resistor power dissipation. Resistance Terms in Ω • RISNS: primary current programming resistance. • RESR: total ESR of the output capacitor(s). • RAUX1: high-side VSNS pin resistance. • RAUX2: low-side VSNS pin resistance. • R1: maximum start-up resistance to achieve the turn-on time target. Timing Terms in Seconds • TD: current-sense delay including MOSFET turn-off delay; add 50 ns to MOSFET delay. • TDMAG(min): minimum secondary rectifier conduction time. • TON(min): minimum MOSFET on time. • TR: the reciprocal of resonant frequency during the DCM (discontinuous conduction mode) operation. • TSTR: converter start-up time requirement. Voltage Terms in Volts • VBULK: highest bulk capacitor voltage for quescient power measurement. • VBULK(min): minimum voltage on CB1 and CB2 at full power. • VCCR: constant-current regulating voltage (see ELECTRICAL CHARACTERISTICS). • VISNSTMAX: ISNS pin maximum current-sense threshold (see ELECTRICAL CHARACTERISTICS). • VISNSTMIN: ISNS pin minimum current-sense threshold (see ELECTRICAL CHARACTERISTICS). • VVCCOFF: UVLO turn-off voltage (see ELECTRICAL CHARACTERISTICS). • VVCCON: UVLO turn-on voltage (see ELECTRICAL CHARACTERISTICS). • VOΔ: output voltage drop allowed during the load-step transient. • VDSPK: peak MOSFET drain-to-source voltage at high line. • VF: secondary rectifier forward voltage drop at near-zero current. • VFA: auxiliary rectifier forward voltage drop. • VLK: estimated leakage inductance energy reset voltage. • VOCV: pre-set output voltage of the converter. • VOUT: LED string voltage. • VOCC: target lowest converter output voltage in constant-current regulation. • VREV: peak reverse voltage on the secondary rectifier. • VRIPPLE: output peak-to-peak ripple voltage at full-load. • VVSNSR: CV regulating level at the VSNS input (see ELECTRICAL CHARACTERISTICS). 18 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPS92315 TPS92315 www.ti.com SNVS904A – NOVEMBER 2012 – REVISED FEBRUARY 2013 AC Voltage Terms in VRMS • VIN(max): maximum input voltage to the converter. • VIN(min): minimum input voltage to the converter. • VIN(run): converter input start-up (run) voltage. Efficiency Terms • ηSB: estimated efficiency of the converter at no-load condition, not including start-up resistance or bias losses. For a E14 or GU-10 application, 70% to 75% is a good initial estimate. • η: converter overall efficiency. • ηXFMR: transformer primary-to-secondary power transfer efficiency. Input Bulk Capacitance and Minimum Bulk Voltage Determine the minimum voltage on the input capacitance, CIN1 and CIN2 total, in order to determine the maximum Np to Ns turns ratio of the transformer. The input power of the converter based on target full-load efficiency, minimum input RMS voltage, and minimum AC input frequency are used to determine the input capacitance requirement. Maximum input power is determined based on VOCV, IOCC, and the full-load efficiency target. V ×I PIN = OCV OCC η (6) The below equation provides an accurate solution for input capacitance based on a target minimum bulk capacitor voltage. To target a given input capacitance value, iterate the minimum capacitor voltage to achieve the target capacitance. CBULK  VBULK (min)  1 × arcsin 2PIN × 0.25 +  2×V 2π  IN(min)  = 2 2 2VIN(min) − VBULK(min) × fLINE (     ) (7) Transformer Turns Ratio, Inductance, Primary-Peak Current The maximum primary-to-secondary turns ratio can be determined by the target maximum switching frequency at full load, the minimum input capacitor bulk voltage, and the estimated DCM quasi-resonant time. Initially determine the maximum available total duty cycle of the on time and secondary conduction time based on target switching frequency and DCM resonant time. For DCM resonant time, assume 500 kHz if you do not have an estimate from previous designs. For the transition mode operation limit, the period required from the end of secondary current conduction to the first valley of the VDS voltage is ½ of the DCM resonant period, or 1 µs assuming 500 kHz resonant frequency. DMAX can be determined using the equation below. T  DMAX = 1 −  R × fMAX  − DMAGCC  2  (8) Once DMAX is known, the maximum turns ratio of the primary to secondary can be determined with the equation below. DMAGCC is defined as the secondary diode conduction duty cycle during constant-current, CC, operation. It is set internally by the TPS92315 at 0.425. The total voltage on the secondary winding needs to be determined; which is the sum of VOCV and the secondary rectifier VF. For the E14 or GU-10 applications with VOUT of around 10V at an IOCC of 350 mA, a turns ratio range of 7 to 8 is typically used. DMAX × VBULK(min) NPS(max) = DMAGCC × (VOCV + VF ) (9) Once an optimum turns ratio is determined from a detailed transformer design, use this ratio for the following parameters. The TPS92315 controller constant-current regulation is achieved by maintaining a maximum DMAG (the secondary diode conduction duty cycle) of 0.425 at the maximum primary current setting. The transformer turns ratio and constant-current regulating voltage determine the current sense resistor for a target constant current. Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPS92315 19 TPS92315 SNVS904A – NOVEMBER 2012 – REVISED FEBRUARY 2013 www.ti.com Since not all of the energy stored in the transformer is transferred to the secondary, a transformer efficiency term is included. This efficiency number includes the core and winding losses, leakage inductance ratio, and bias power ratio to rated output power. For a typical E14 or GU-10 application, bias power of 1.5% is a good estimate. An overall transformer efficiency of 0.9 is a good estimate to include 3.5% leakage inductance, 5% core and winding loss, and 1.5% bias power. V × NPS RISNS = CCR × ηXFMR 2IOCC (10) The primary transformer inductance can be calculated using the standard energy storage equation for flyback transformers. Primary current, maximum switching frequency and output current and transformer power losses are included in the equation below. Initially determine transformer primary current. Primary current is simply the maximum current sense threshold divided by the current sense resistance. V IPP(max) = ISNSTMAX RISNS LP = (11) 2( VOCV + VF ) × IOCC 2 η XFMR × IPP (max) × fMAX (12) The secondary winding to auxiliary winding transformer turns ratio (NAS) is determined by the lowest target operating output voltage in constant-current regulation and the VVCCOFF of the TPS92315. There is additional energy supplied to VCC from the transformer leakage inductance energy which allows a lower turns ratio to be used in many designs. V + VFA NAS = VCCOFF VOCC + VF (13) Transformer Parameter Verification The transformer turns ratio selected affects the MOSFET VDS and secondary rectifier reverse voltage so these should be reviewed. The TPS92315 controller requires a minimum on time of the MOSFET (TON) and minimum DMAG time (TDMAG) of the secondary rectifier in the high line, minimum load condition. The selection of FMAX, LP and RISNS affects the minimum TON and TDMAG. The secondary rectifier and MOSFET voltage stress can be determined by the equations below. VREV = VIN(max) × 2 NPS + VOCV (14) For the MOSFET VDS voltage stress, an estimated leakage inductance voltage spike (VLK) needs to be included. ( ) VDSPK = VIN(max) × 2 + (VOCV + VF ) × NPS + VLK (15) The following equations are used to determine if the minimum TON target of 300 ns and minimum TDMAG target of 1.1 µs is achieved. IPP(max) × VISNSTMIN LP × TON(min) = VISNSTMAX VIN(max) × 2 ( TDMAG(min) = ) (16) TON(min) × VIN(max) × 2 NPS × ( VOCV + VF ) (17) Output Capacitance The output capacitance value is typically determined by the current ripple requirement of the LED current. For example, some E14 or GU-10 applications requires the current ripple to be 30% of the LED current. Then the equation below assumes that the switching frequency can be at the TPS92315 minimum of fSW(min). 20 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPS92315 TPS92315 www.ti.com SNVS904A – NOVEMBER 2012 – REVISED FEBRUARY 2013 COUT   1 + 150 µs  0.3 × IS   fSW (min)  = VO∆ (18) Another consideration of the output capacitor(s) is the ripple voltage requirement which is reviewed based on secondary peak current and ESR. A margin of 20% is added to the capacitor ESR requirement in the equation below. V × 0.8 RESR = RIPPLE IPP(max) × NPS (19) VCC Capacitance, CVCC The capacitance on VCC needs to supply the device operating current until the output of the converter reaches the target minimum operating voltage in constant-current regulation. At this time the auxiliary winding can sustain the voltage to the TPS92315. The total output current available to the load and to charge the output capacitors is the constant-current regulation target. The equation below assumes the output current of the flyback is available to charge the output capacitance until the minimum output voltage is achieved. There is an estimated 1 mA of gate-drive current in the equation and 1V of margin added to VCC. C ×C (IRUN + 1mA ) × OUT OCC IO C VCC = (VVCCON − VVCCOFF ) − 1V (20) VCC Start-Up Resistance, R1 Once the VCC capacitance is known, the start-up resistance from VBULK to achieve the turn-on time target can be determined. R1 = ISTART 2 × VIN(max) V × C VCC + VCCON TSTR (21) VSNS Resistor Divider The VSNS divider resistors determine the output voltage regulation point of the flyback converter, also the highside divider resistor (RAUX1) determines the line voltage at which the controller enables continuous GATE operation. RAUX1 is initially determined based on transformer auxiliary to primary turns ratio and desired input voltage operating threshold. R AUX1 = VIN(run) × 2 NPA × IVSNS(run) (22) The low-side VSNS pin resistor is selected based on desired VOUT regulation voltage. R AUX1 × VVSNSR R AUX 2 = NAS × (VOCV + VF ) − VVSNSR (23) The TPS92315 can maintain tight constant-current regulation over input line by utilizing the line compensation feature. The line compensation resistor (RLC) value is determined by current flowing in RAUX1 and expected gate drive and MOSFET turn-off delay. Assume a 50 ns internal delay in the TPS92315. K × R AUX1 × RISNS × TD × NPA RLC = LC LP (24) Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPS92315 21 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TPS92315DBVR ACTIVE SOT-23 DBV 6 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 T315 TPS92315DBVT ACTIVE SOT-23 DBV 6 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 T315 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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TPS92315DBVR
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    • 1+12.26880
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