TS3A27518EIPWRQ1

TS3A27518E-Q1 SCDS311D – JANUARY 2010 – REVISED OCTOBER 2022 TS3A27518E-Q1 6-bit, 1-of-2 Multiplexer or Demultiplexer With Integrated IEC L-4 ESD and 1.8-V Logic Compatible Control Inputs 1 Features 3 Description • • The TS3A27518E-Q1 is a 6-bit 1-of-2 multiplexerdemultiplexer designed to operate from 1.65 V to 3.6 V. This device can handle both digital and analog signals, and signals up to V+ can be transmitted in either direction. The TS3A27518E-Q1 has two control pins, each controlling three 1-of-2 muxes at the same time, and an enable pin that is used to put all outputs in high-impedance mode. The control pins are compatible with 1.8-V logic thresholds and are backward compatible with 2.5-V and 3.3-V logic thresholds as well. • • • • • • • • • • Qualified for automotive applications AEC-Q100 qualified with the following results: – Device temperature grade 2: –40°C to 105°C ambient operating temperature range – Device HBM ESD classification level H2 – Device CDM ESD classification level C3B Functional Safety-Capable – Documentation available to aid functional safety system design 1.65-V to 3.6-V single-supply operation Powered-off protection (isolation in powerdown mode, Hi-Z when V+ = 0) Low capacitance switches, 21.5 pF (typical) Bandwidth up to 240 MHz for high-speed rail-to-rail signal handling Crosstalk and off isolation of −62 dB 1.8-V logic threshold compatibility for control inputs 3.6-V tolerant control inputs ESD performance: NC/NO ports – ±6-kV contact discharge (IEC 61000-4-2) 24-pin TSSOP (7.80 mm × 4.40 mm) and 24-pin QFN (4.00 mm × 4.00 mm) package The TS3A27518E-Q1 allows any SD, SDIO, and multimedia card host controllers to be expanded out to multiple cards or peripherals because the SDIO interface consists of 6-bits: CMD, CLK, and Data[0:3] signals. The TS3A27518E-Q1 has two control pins that give additional flexibility to the user, for example, the ability to mux two different audio-video signals in equipment such as an LCD television, an LCD monitor, or a notebook docking station. Package Information(1) PART NUMBER 2 Applications • • • TS3A27518E-Q1 SD/SDIO and MMC two port MUX PC VGA video MUX/video systems Audio and video signal routing (1) PACKAGE BODY SIZE (NOM) RTW (WQFN, 24) 4.00 mm × 4.00 mm PW (TSSOP, 24) 7.80 mm × 4.40 mm For all available packages, see the orderable addendum at the end of the data sheet. VCC IN1 EN Logic IN2 NC1 NO1 NC4 COM1 NO4 COM4 NC2 NO2 NC5 COM2 NO5 COM5 NC3 NO3 COM3 NC6 NO6 COM6 GND Copyright © 2016, Texas Instruments Incorporated Functional Block Diagram An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TS3A27518E-Q1 www.ti.com SCDS311D – JANUARY 2010 – REVISED OCTOBER 2022 Table of Contents 1 Features............................................................................1 2 Applications..................................................................... 1 3 Description.......................................................................1 4 Revision History.............................................................. 2 5 Pin Configuration and Functions...................................3 6 Specifications.................................................................. 4 6.1 Absolute Maximum Ratings........................................ 4 6.2 ESD Ratings............................................................... 4 6.3 Recommended Operating Conditions.........................4 6.4 Thermal Information....................................................5 6.5 Electrical Characteristics for 3.3-V Supply .................5 6.6 Electrical Characteristics for 2.5-V Supply .................7 6.7 Electrical Characteristics for 1.8-V Supply .................9 6.8 Typical Characteristics.............................................. 11 7 Parameter Measurement Information.......................... 14 8 Detailed Description......................................................19 8.1 Overview................................................................... 19 8.2 Functional Block Diagram......................................... 19 8.3 Feature Description...................................................19 8.4 Device Functional Modes..........................................19 9 Application and Implementation.................................. 20 9.1 Application Information............................................. 20 9.2 Typical Application.................................................... 20 10 Power Supply Recommendations..............................21 11 Layout........................................................................... 22 11.1 Layout Guidelines................................................... 22 11.2 Layout Example...................................................... 22 12 Device and Documentation Support..........................23 12.1 Documentation Support.......................................... 23 12.2 Receiving Notification of Documentation Updates..23 12.3 Support Resources................................................. 23 12.4 Trademarks............................................................. 23 12.5 Electrostatic Discharge Caution..............................23 12.6 Glossary..................................................................23 13 Mechanical, Packaging, and Orderable Information.................................................................... 23 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision C (January 2019) to Revision D (November 2022) Page • Updated the numbering format for tables, figures, and cross-references throughout the document..................1 • Added functional safety-capable information to the Features section................................................................ 1 Changes from Revision B (May 2012) to Revision C (January 2019) Page • Added Device Information table, ESD Ratings table, Recommended Operating Conditions table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ..................................................................................................1 • Updated the numbering format for tables, figures, and cross-references throughout the document..................1 Changes from Revision A (March 2012) to Revision B (May 2012) Page • Changed device temp grade from 1 to 2, removed maximum withstand voltage info, changed C3B2 to C3B.. 1 • Added extra row to ordering information table....................................................................................................1 • Changed TA = –40°C to 85°C to TA = –40°C to 105°C.......................................................................................5 • Changed Full to –40°C to 85°C and added extra row with 85°C to 105°C and limits -7.5 to 7.5........................5 • Changed Full to –40°C to 85°C and added extra row with 85°C to 105°C with limits 68................................... 5 • Changed Full to –40°C to 85°C and added extra row with 85°C to 105°C with limits 70................................... 5 • Changed Full to –40°C to 85°C and added extra row with 85°C to 105°C with limits 5 µA................................ 5 • Changed TA = –40°C to 85°C to TA = –40°C to 105°C.......................................................................................7 • Changed Full to –40°C to 85°C and added extra row with 85°C to 105°C with limits 38.4................................ 7 • Changed Full to –40°C to 85°C and added extra row with 85°C to 105°C with limits 3..................................... 7 • Changed TA = –40°C to 85°C to TA = –40°C to 105°C.......................................................................................9 • Changed Full to –40°C to 85°C and added extra row with 85°C to 105°C and limits –5.8 to 5.8.......................9 • Changed Full to –40°C to 85°C and added extra row with 85°C to 105°C with limits 35.2................................ 9 • Changed Full to –40°C to 85°C and added extra row with 85°C to 105°C with limits 2.5.................................. 9 2 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: TS3A27518E-Q1 TS3A27518E-Q1 www.ti.com SCDS311D – JANUARY 2010 – REVISED OCTOBER 2022 20 NC6 19 NC3 IN1 21 NC2 22 NC1 23 24 N.C. 5 Pin Configuration and Functions CO M1 1 18 NC4 GND 2 17 EN CO M2 3 16 NC5 15 NO5 NC2 1 24 IN1 NC1 2 23 NC3 N.C. 3 22 NC6 CO M1 4 21 NC4 GND 5 20 EN CO M2 6 19 NC5 CO M3 7 18 NO5 VCC 8 17 NO4 CO M4 9 16 NO6 CO M5 10 15 NO3 NO1 11 14 IN2 CO M6 12 13 NO2 Th ermal CO M3 Pad 4 6 13 NO6 NO3 11 IN2 NO2 CO M6 NO1 CO M5 12 CO M4 10 NO4 9 14 8 5 7 VCC No t to scale Figure 5-1. RTW Package, 24-Pin WQFN (Top View) No t to scale Figure 5-2. PW Package, 24-Pin TSSOP (Top View) Table 5-1. Pin Functions PIN NAME TYPE(1) DESCRIPTION RTW PW COM1 1 4 I/O Common-signal path COM2 3 6 I/O Common-signal path COM3 4 7 I/O Common-signal path COM4 6 9 I/O Common-signal path COM5 7 10 I/O Common-signal path COM6 9 12 I/O Common-signal path EN 17 20 I GND 2 5 — IN1 21 24 I Digital control to connect COM to NC or NO IN2 11 14 I Digital control to connect COM to NC or NO N.C. 24 3 — Not connected NC1 23 2 I/O Normally closed-signal path NC2 22 1 I/O Normally closed-signal path NC3 20 23 I/O Normally closed-signal path NC4 18 21 I/O Normally closed-signal path NC5 16 19 I/O Normally closed-signal path NC6 19 22 I/O Normally closed-signal path NO1 8 11 I/O Normally open-signal path NO2 10 13 I/O Normally open-signal path NO3 12 15 I/O Normally open-signal path NO4 14 17 I/O Normally open-signal path NO5 15 18 I/O Normally open-signal path NO6 13 16 I/O Normally open-signal path VCC 5 8 — Voltage supply (1) Digital control to enable or disable all signal paths Ground. I = input, O = output Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: TS3A27518E-Q1 3 TS3A27518E-Q1 www.ti.com SCDS311D – JANUARY 2010 – REVISED OCTOBER 2022 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) range(2) MIN MAX –0.5 4.6 V –0.5 4.6 V V+ Supply voltage VNC VNO VCOM Analog voltage range(2) (3) (4) IK Analog port diode current(5) V+ < VNC, VNO, VCOM < 0 –50 INC INO ICOM ON-state switch current(6) VNC, VNO, VCOM = 0 to V+ –50 50 VI Digital input voltage range(2) (3) –0.5 4.6 IIK Digital input clamp current(2) (3) I+ Continuous current through V+ IGND Continuous current through GND Tstg Storage temperature range (1) (2) (3) (4) (5) (6) VIO < VI < 0 UNIT mA mA V –50 mA 100 mA –100 mA –65 150 °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to ground, unless otherwise specified. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. This value is limited to 5.5 V maximum. Requires clamp diodes on analog port to V+. Pulse at 1-ms duration