HP1

Series HP1 Technical METAL CASE, CASE-MOUNTED SEMICONDUCTORS HP1 Series for Single TO-3 or Stud Mount Devices DESCRIPTION OF CURVES A. N.C. Horiz. Device Only Mounted to G-10. A. N.C. Horiz. & Vert. With Dissipator. B. 200 RPM w/Diss. C. 500 RPM w/Diss. E. 1000 RPM w/Diss. • • Thermal Resistance Case to Sink is 0.1-0.3 °C/W w/Joint Compound. Derate 1.0 °C/watt for unplated part in natural convection only. Ordering Information Unplated IERC PART NO. Comm’l. Black Anodize HP1-000-CB HP1-TO3-CB HP1-TO3-33CB HP1-TO3-44CB HP1-436-CB HP1-T06-CB HP1-TO15-CB HP1-420-CB Mil. Black Anodize HP1-000-B HP1-TO3-B HP1-TO3-33B HP1-TO3-44B HP1-436-B HP1-T06-B HP1-TO15-B HP1-420-B Semiconductor Accommodated Hole patt. Ref. No. (see pg. 1-28) -16 17 31 18 19 23 27 Max. Weight (Grams) HP1-000-U HP1-TO3-U HP1-TO3-33U HP1-TO3-44U HP1-436-U HP1-TO6-U HP1-TO15-U HP1-420-U Undrilled TO-3 TO-3 IC TO-3 panel mount TO-3 (4-pin) TO-6, TO-36 TO-15, DO-5 Universal 35.0 35.0 35.0 35.0 35.0 35.0 35.0 35.0 HP1 Series for Single TO-66 Outline DESCRIPTION OF CURVES B. N.C. Horiz. Device Only Mounted to G-10. D. N.C. Horiz. & Vert. With Dissipator. E. 200 RPM w/Diss. F. 500 RPM w/Diss. E. 1000 RPM w/Diss. • • Thermal Resistance Case to Sink is 0.5-0.7 °C/W w/Joint Compound. Derate 1.0 °C/watt for unplated part in natural convection only. Ordering Information Unplated IERC PART NO. Comm’l. Black Anodize HP1-TO66-CB HP1-TO66-35CB HP1-TO66-49CB Mil. Black Anodize HP1-TO66-B HP1-TO66-35B HP1-TO66-49B Semiconductor Accommodated Hole patt. Ref. No. (see pg. 1-28) 24 25 26 Max. Weight (Grams) HP1-TO66-U HP1-TO66-35U HP1-TO66-49U TO-66 TO-66 IC TO-66 IC (Socket) 35.0 35.0 35.0 HP1 Series for Dual TO-66 Outline DESCRIPTION OF CURVES C. N.C. Horiz. Device Only Mounted to G-10. G. N.C. Horiz. & Vert. With Dissipator. H. 200 RPM w/Diss. I. 500 RPM w/Diss. E. 1000 RPM w/Diss. • • • Thermal Resistance Case to Sink is 0.5-0.7 °C/W w/Joint Compound. Derate 2.0 °C/watt per device for unplated part in natural convection only. Case Temperatures Match Within 2°C at equivalent power levels. Ordering Information Unplated IERC PART NO. Comm’l. Black Anodize HP1-TO66-4CB HP1-TO66-36CB Mil. Black Anodize HP1-TO66-4B HP1-TO66-36B Semiconductor Accommodated Hole patt. Ref. No. (see pg. 1-30) 32 34 Max. Weight (Grams) HP1-TO66-4U HP1-TO66-36U Two TO-66s Two TO-66 Ics 35.0 35.0 HP1 Series for Three TO-66 Outline DESCRIPTION OF CURVES D. N.C. Horiz. Device Only Mounted to G-10. J. N.C. Horiz. & Vert. With Dissipator. K. 200 RPM w/Diss. L. 500 RPM w/Diss. E. 1000 RPM w/Diss. • • • Thermal Resistance Case to Sink is 0.5-0.7 °C/W w/Joint Compound. Derate 3.0 °C/watt per device for unplated part in natural convection only. Case Temperatures Match Within 2°C at equivalent power levels in natural convection. Ordering Information Unplated IERC PART NO. Comm’l. Black Anodize HP1-TO66-8CB HP1-TO66-39CB Mil. Black Anodize HP1-TO66-8B HP1-TO66-39B Semiconductor Accommodated Hole patt. Ref. No. (see pg. 1-30) 33 35 Max. Weight (Grams) HP1-TO66-8U HP1-TO66-39U Two TO-66s Two TO-66 Ics 35.0 35.0 HOLE PATTERNS 16. Hole pattern no. 1 accommodates T0-3s. Available in UP, 17. Hole pattern no. 202 accommodates T0-3 ICs. Available in UP1, UP2, HP1, and HP3 series heat dissipators. UP, UP1, UP2, HP1, and HP3 series heat dissipators. 18. Hole pattern no. 436 accommodates t0-3s (4-pin). Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. 19. Hole pattern no. 2 accommodates T0-6s or T0-36s. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. 23. Hole pattern no. 3 accommodates TO-15s, DO-5s and other ¼” stud mount devices. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. 24. Hole pattern no. 114 accommodates TO-66s. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. 25. Hole pattern no. 199 accommodates TO-66 ICs. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. 26. Hole pattern no. 226 accommodates TO-66 ICs (socket). Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. 31. Hole pattern no. 213 accommodates one TO-3 (panel mounted). Available in HP1 and HP3 series heat dissipators only. 32. Hole pattern no. 150 accommodates two TO-66s. Available in HP1 and HP3 series heat dissipators only. 33. Hole pattern no. 185 accommodates three TO-66s. Available in HP1 and HP3 series heat dissipators only. 34. Hole pattern no. 201 accommodates two TO-66s ICs. Available in HP1 and HP3 series heat dissipators only. 35. Hole pattern no. 203 accommodates three TO-66 ICs. Available in HP1 and HP3 series heat dissipators only. 27. Hole pattern no. 420 (Universal) accommodates T0-3s, T066s, T0-126s, T0-127s, or T0-220s. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. CTS IERC, Heat Sinks and Thermal Management Solutions 413 North Moss Street, Burbank, California 91502 Tel: (818) 842-7277 Fax: (818) 848-8872 Rev. 03-15-04