HP3

Series HP3 Technical METAL CASE, CASE-MOUNTED SEMICONDUCTORS HP3 Series for Single TO-3 or Stud Mount DESCRIPTION OF CURVES A. B. C. D. E. N.C. Horiz. Device Only Mounted to G-10. N.C Horiz. & Vert. With Dissipator. 200 FPM w/Diss. 500 FPM w/Diss. 1000 FPM w/Diss. • • Thermal Resistance Case to Sink is 0.1-0.3 °C/W w/Joint Compound. Derate 1.0 °C/watt for unplated part in natural convection only. Ordering Information Unplated HP3-000-U HP3-T03-U HP3-T03-33U CTS IERC PART NO. Comm'l. Black Anodize HP3-000-CB HP3-T03-CB HP3-T03-33CB Mil. Black Anodize HP3-000-B HP3-T03-B HP3-T03-33B Semiconductor Accommodated Undrilled T0-3 T0-3 IC Hole patt. ref. no. -16 17 Max. Weight (Grams) 55.0 55.0 55.0 HP3-T03-44U HP3-436-U HP3-T015-U HP3-T06-U HP3-420-U HP3-T03-44CB HP3-436-CB HP3-T015-CB HP3-T06-CB HP3-420-CB HP3-T03-44B HP3-436-B HP3-T015-B HP3-T06-B HP3-420-B T0-3 PANEL MOUNT T0-3 (4 PIN) T0-15, D0-5 T0-6, T0-36 UNIVERSAL 31 18 23 19 27 55.0 55.0 55.0 55.0 55.0 HP3 for Dual TO-3 Outline DESCRIPTION OF CURVES A. B. C. D. E. N.C. Horiz. Device Only Mounted to G-10. N.C Horiz. & Vert. With Dissipator. 200 FPM w/Diss. 500 FPM w/Diss. 1000 FPM w/Diss. • • Thermal Resistance Case to Sink is 0.1-0.3 °C/W w/Joint Compound. Derate 2.0 °C/watt for unplated part in natural convection only. Ordering Information Unplated HP3-T03-4U HP3-437-U CTS IERC PART NO. Comm'l. Black Anodize HP3-T03-4CB HP3-437-CB Mil. Black Anodize HP3-T03-4B HP3-437-B Semiconductor Accommodated Two TO-3s Two TO-3s (4 pin) Hole patt. ref. no. 6 12 Max. Weight (Grams) 55.0 55.0 HP3 for Three TO-3 Outline DESCRIPTION OF CURVES A. B. C. D. E. N.C. Horiz. Device Only Mounted to G-10. N.C Horiz. & Vert. With Dissipator. 200 FPM w/Diss. 500 FPM w/Diss. 1000 FPM w/Diss. • • Thermal Resistance Case to Sink is 0.1-0.3 °C/W w/Joint Compound. Derate 3.0 °C/watt for unplated part in natural convection only. Ordering Information Unplated HP3-T03-8U CTS IERC PART NO. Comm'l. Black Anodize HP3-T03-8CB Mil. Black Anodize HP3-T03-8B Semiconductor Accommodated Three TO-3s Hole patt. ref. no. 13 Max. Weight (Grams) 55.0 HOLE PATTERNS 6. Hole pattern no. 124 accomodates two TO-3s. Available in 12. Hole pattern no. 437 accommodates two TO-3s (4-pin). HP3 series heat dissipators only. Available in HP3 series heat dissipators only. 13. Hole pattern no. 186 accommodates three TO-3s. Available in HP3 series heat dissipators only. 16. Hole pattern no. 1 accommodates T0-3s. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. 17. Hole pattern no. 202 accommodates T0-3 ICs. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. 18. Hole pattern no. 436 accomodates T0-3s (4-pin). Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. 19. Hole pattern no. 2 accommodates T0-6s or T0-36s. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. 23. Hole pattern no. 3 accommodates T0-15s, D0-5s and other 1/4" stud mount devices. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. 27. Hole pattern no. 420 (Universal) accommodates T0-3s, T066s, T0-126s, T0-127s, or T0-220s. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. 31. Hole pattern no. 213 accommodates one TO-3 (panel mounted). Available in HP1 and HP3 series heat dissipators only. CTS IERC, Heat Sinks and Thermal Management Solutions 413 North Moss Street, Burbank, California 91502 Tel: (818) 842-7277 Fax: (818) 848-8872 Rev. 04-13-04