BTC945A3

CYStech Electronics Corp. General Purpose NPN Epitaxial Planar Transistor Spec. No. : C204A3 Issued Date : 2003.04.01 Revised Date : 2005.01.03 Page No. : 1 / 5 BTC945A3 Description • The BTC945A3 is designed for use in driver stage of AF amplifier and low speed switching. • Complementary to BTA733A3. • Pb-free package Symbol BTC945A3 Outline TO-92 B：Base C：Collector E：Emitter ECB Absolute Maximum Ratings (Ta=25°C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Base Current Power Dissipation @Ta=25℃ Thermal Resistance, Junction to Ambient Junction Temperature Storage Temperature Symbol VCBO VCEO VEBO IC IB Pd RθJA Tj Tstg Limits 60 50 5 100 20 625 200 150 -55~+150 Unit V V V mA mA mW °C/W °C °C BTC945A3 CYStek Product Specification CYStech Electronics Corp. Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) VBE hFE1 hFE2 fT Cob Min. 60 50 5 0.55 50 135 150 Typ. 0.2 0.85 Max. 100 100 0.3 1.0 0.65 600 4 Unit V V V nA nA V V V MHz pF Spec. No. : C204A3 Issued Date : 2003.04.01 Revised Date : 2005.01.03 Page No. : 2 / 5 Test Conditions IC=100µA IC=1mA IE=10µA VCB=60V VEB=5V IC=100mA, IB=10mA IC=100mA, IB=10mA VCE=6V, IC=1mA VCE=6V, IC=0.1mA VCE=6V, IC=1mA VCE=6V, IC=10mA, f=100MHz VCB=6V, IE=0A, f=1MHz *Pulse Test: Pulse Width ≤380µs, Duty Cycle≤2% Classification of hFE 2 Rank Range Q 135-270 P 200-400 K 300-600 BTC945A3 CYStek Product Specification CYStech Electronics Corp. Characteristic Curves C urrent Gain vs Collector Current 1000 Saturation Voltage-(mV) 1000 Spec. No. : C204A3 Issued Date : 2003.04.01 Revised Date : 2005.01.03 Page No. : 3 / 5 Saturation Voltage vs Collector Current HFE@VCE=6V Current Gain---HFE VCE(SAT)@IC=10I 100 100 0.1 1 10 100 1000 Collector Current--- IC(mA) 10 0.1 1 10 100 1000 Collector Current--- IC(mA) Saturation Voltage vs Collector Current 1000 Cutoff Frequency---FT(GHZ) Saturation Voltage---(mV) 1 Cutoff Frequency vs Collector Current VBE(SAT)@IC=10IB FT@VCE=6V 100 0.1 1 10 100 1000 Collector Current ---IC(mA) 0.1 1 10 Collector Current---IC(mA) 100 Power Derating Curve 700 Power Dissipation--- PD(mW) 600 500 400 300 200 100 0 0 50 100 150 Ambient Temperature---Ta(℃) BTC945A3 CYStek Product Specification CYStech Electronics Corp. TO-92 Taping Outline Spec. No. : C204A3 Issued Date : 2003.04.01 Revised Date : 2005.01.03 Page No. : 4 / 5 H2 H2 H2A H2A A D2 H3 L H4 H L1 H1 F1 F2 D1 D W1 W T2 T T1 P1 P P2 DIM A D D1 D2 F1,F2 F1,F2 H H1 H2 H2A H3 H4 L L1 P P1 P2 T T1 T2 W W1 BTC945A3 Item Component body height Tape Feed Diameter Lead Diameter Component Body Diameter Component Lead Pitch F1-F2 Height Of Seating Plane Feed Hole Location Front To Rear Deflection Deflection Left Or Right Component Height Feed Hole To Bottom Of Component Lead Length After Component Removal Lead Wire Enclosure Feed Hole Pitch Center Of Seating Plane Location 4 Feed Hole Pitch Over All Tape Thickness Total Taped Package Thickness Carrier Tape Thickness Tape Width Adhesive Tape Width 20 pcs Pitch Millimeters Min. 4.33 3.80 0.36 4.33 2.40 15.50 8.50 2.50 12.50 5.95 50.30 0.36 17.50 5.00 253 Max. 4.83 4.20 0.53 4.83 2.90 ±0.3 16.50 9.50 1 1 27 21 11 12.90 6.75 51.30 0.55 1.42 0.68 19.00 7.00 255 CYStek Product Specification CYStech Electronics Corp. TO-92 Dimension α2 Spec. No. : C204A3 Issued Date : 2003.04.01 Revised Date : 2005.01.03 Page No. : 5 / 5 A B 1 2 3 Marking: α3 C945 C D H I E F G α1 Style: Pin 1.Emitter 2.Collector 3.Base 3-Lead TO-92 Plastic Package CYStek Package Code: A3 *: Typical DIM A B C D E F Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I α1 α2 α3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5° *2° *2° Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5° *2° *2° Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: 42 Alloy ; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BTC945A3 CYStek Product Specification