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AN-6753

AN-6753

  • 厂商:

    FAIRCHILD(仙童半导体)

  • 封装:

  • 描述:

    AN-6753 - Highly Integrated Green-Mode PWM Controller - Fairchild Semiconductor

  • 数据手册
  • 价格&库存
AN-6753 数据手册
www.fairchildsemi.com AN-6753 FAN6753 — Highly Integrated Green-Mode PWM Controller Abstract This application note describes a detailed design strategy for a high-efficiency compact flyback converter. Design considerations, mathematical equations, and guidelines for a Printed-Circuit-Board (PCB) layout are presented. Introduction The highly integrated FAN6753 series of PWM controllers provides several features to enhance the performance of flyback converters. To minimize standby power consumption, a proprietary green-mode function provides off-time modulation to linearly decrease the switching frequency at light-load conditions. To avoid acoustic-noise problems, the minimum PWM frequency is set above 22KHz. This green-mode function enables the power supply to meet international power conservation requirements. With the internal highvoltage startup circuitry, the power loss due to bleeding resistors is also eliminated. To further reduce power consumption, FAN6753 is manufactured using the BiCMOS process, which allows an operating current of only 2.7mA. Built-in synchronized slope compensation achieves stable peak-current-mode control. The proprietary external line compensation ensures a constant output-power limit over a wide AC input voltage range, from 90VAC to 264VAC. FAN6753 provides many protection functions. In addition to cycle-by-cycle current limiting, the internal open-loop protection circuit ensures safety should an open-loop or output short-circuit failure occur. OVP (VDD) OLP (FB) External Latch (LATCH) Features High-Voltage Startup Low Operating Current: 2.7mA Linearly Decreasing PWM Frequency to 22KHz Frequency Hopping to Reduce EMI Emission Fixed PWM Frequency: 65KHz Peak-Current-Mode Control Cycle-by-Cycle Current Limiting Leading-Edge Blanking (LEB) Synchronized Slope Compensation Internal Open-Loop Protection Gate Output Maximum Voltage Clamp: 18V VDD Under-Voltage Lockout (UVLO) VDD Over-Voltage Protection (OVP) Programmable Over-Temperature Protection (OTP) Internal Latch Circuit (OTP) Built-In 5ms Soft-Start Function Constant Power Limit (Full AC Input Range) Internal OTP Sensor with Hysteresis FAN6753 Auto Restart Auto Restart Latch Applications General-purpose, switch-mode power supplies and flyback power converters, including: Power Adapters Open-Frame Switch-Mode Power Supply (SMPS) RT FB SENSE GND 1 2 3 4 SOP-8 8 7 6 5 HV NC VDD GATE Figure 1. Pin Configuration (Top View) © 2009 Fairchild Semiconductor Corporation Rev. 1.0.0 • 5/13/09 www.fairchildsemi.com AN-6753 APPLICATION NOTE Typical Application Figure 2. Typical Application Block Diagram HV 8 GND 4 VDD PWM Latch Soft Driver VDD-OVP IHV Frequency Hopping S R Q 5 GATE VDD 6 Internal BIAS Soft-Start UVLO Vlimit VDD-ON /VDD-OFF 3 SENSE VFB-OPEN Slope Compensation Green Mode Controller 3R 2 R FB I LATCH LATCH 1 Limit-Power Controller VFB-OLP 100 μs Counter IDD-OLP VDD VTH-OLP VDD VLATCHth Figure 3. Functional Block Diagram © 2009 Fairchild Semiconductor Corporation Rev. 1.0.0 • 5/13/09 www.fairchildsemi.com 2 AN-6753 APPLICATION NOTE Internal Block Operation Startup Circuitry When the power is turned on, the internal current source (typically 2mA) charges the hold-up capacitor C1 through a startup resistor RHV. During the startup sequence, the VAC provides a startup current of about 2mA and charges the VDD capacitor C1. RHV and D2 are series connections and can be directly connected by VAC to the HV pin. As the VDD pin reaches the start threshold voltage VDD-ON, the FAN6753 activates and signals the MOSFET. The high-voltage source current is switched off and the supply current is drawn from the auxiliary winding of the main transformer, as shown in Figure 4. For higher 6KV surge test, RHV of 100KΩ or above is recommended. Under-Voltage Lockout (UVLO) The FAN6753 has a voltage detector on the VDD pin to ensure that the chip has enough power to drive the MOSFET. Figure 6 shows a hysteresis of the turn-on and turn-off threshold levels and an open-loop-release voltage. IDD 2.7mA 70µA 10µA 7.5V 9.5V 15.5V VDD Figure 6. UVLO Specification The turn-on and turn-off thresholds are internally fixed at 15.5V and 9.5V. During startup, the VDD capacitor must be charged to 15.5V to enable the IC. The capacitor continues to supply the VDD until the energy can be delivered from the auxiliary winding of the main transformer. The VDD must not drop below 9.5V during startup. If the secondary output short circuit or the feedback loop is open, the FB pin voltage rises rapidly toward the open-loop voltage, VFB-OPEN. If the FB voltage remains above VFB-OLP and lasts for tD-OLP, the FAN6753 stops emitting output pulses and enters auto-restart mode. To further limit the input power under a short-circuit or open-loop condition, a special two-step UVLO mechanism prolongs the discharge time of the VDD capacitor. Figure 7 shows the traditional UVLO method, along with the special two-step UVLO method. In the two-step UVLO mechanism, an internal sinking current, IDD-OLP, pulls the VDD voltage toward the VDD-OLP. This sinking current is disabled after the VDD drops below VDD-OLP; after which the VDD voltage is again charged towards VDD-ON. With the two-step UVLO mechanism, the average input power during a short-circuit or open-loop condition is greatly reduced. As a result, over-heating does not occur. 15.5V VDD 9.5V General UVLO Gate Figure 4. Startup Circuit for Power Transfer When the supply current is drawn from the transformer, it draws a leakage current of about 1µA from the HV pin. The maximum power dissipation of the RHV is: PRHV = IHV −LC( Typ.) × RHV 2 (1) where IHV-LC is the supply current drawn from HV pin. PRHV = 1μA 2 × 100KΩ ≅ 0.1μW (2) Soft Start For many applications, it is necessary to minimize the inrush current during the startup period. The built-in 5ms soft-start circuit significantly reduces the startup current spike and output-voltage overshoot. 15.5V VDD Figure 5. Soft-Start Circuit 9.5V 7.5V Two-Step UVLO Gate Figure 7. © 2009 Fairchild Semiconductor Corporation Rev. 1.0.0 • 5/13/09 3 UVLO Effect www.fairchildsemi.com AN-6753 APPLICATION NOTE FB Input The FAN6753 is designed for peak-current-mode control. A current-to-voltage conversion is accomplished externally with current-sense resistor RS. Under normal operation, the FB level controls the peak inductor current: IPEAK = VFB − 0.6 4 × RS Built-In Slope Compensation A flyback converter can be operated in Discontinuous Current Mode (DCM) or Continuous Current Mode (CCM). There are many advantages when operating the converter in CCM. With the same output power, a converter in CCM exhibits a smaller peak inductor current than one in DCM. Therefore, a small-sized transformer and a low-rated MOSFET can be applied. On the secondary side of the transformer, the RMS output current of DCM can be twice that of CCM. Larger wire gauge and output capacitors with larger ripple-current ratings are required. DCM operation also results in a higher output voltage spike. A large LC filter is added. Therefore, a flyback converter in CCM achieves better performance with lower component cost. Despite the above advantages of CCM operation, there is one concern—stability. In CCM operation, the output power is proportional to the average inductor current, while the peak current remains controlled. This causes sub-harmonic oscillation when the PWM duty cycle exceeds 50%. Adding slope compensation (reducing the current-loop gain) is an effective way to prevent oscillation. The FAN6753 introduces a synchronized positive-going ramp (VSLOPE) in every switching cycle to stabilize the current loop. Therefore, FAN6753 helps design a cost-effective, highly efficient, compact, flyback power supply that operates in CCM without additional external components. The positive ramp added is: Figure 8. Feedback Circuit (3) where VFB is the voltage on the FB pin and 4 is an internal divider ratio. When VFB is less than 0.6V, the FAN6753 terminates the output pulses. FB RFB CFB Rb VO R3 C1 R1 R2 VSLOPE = VSL • D where VSL = 0.33V and D = duty cycle. (5) Figure 8 is a typical feedback circuit consisting mainly of a shunt regulator and an opto-coupler. R1 and R2 form a voltage divider for the output-voltage regulation. R3 and C1 are adjusted for control-loop compensation. A small-value RC filter (e.g. RFB= 47Ω, CFB= 1nF) placed on the FB pin to the GND can further increase stability. The maximum sourcing current of the FB pin is 1.5mA. The phototransistor must be capable of sinking this current to pull the FB level down at no load. The value of the biasing resistor, Rb, is determined as follows: VOUT − VD − VZ ⋅ K ≥ 1.5mA Rb (4) where: VD is the drop voltage of photodiode, approximately 1.2V; VZ is the minimum operating voltage, 2.5V of the shunt regulator; and K is the current transfer rate (CTR) of the opto-coupler. For an output voltage VOUT = 5V, with CTR = 100%, the maximum value of Rb is 860Ω. Figure 9. Synchronized Slope Compensation © 2009 Fairchild Semiconductor Corporation Rev. 1.0.0 • 5/13/09 www.fairchildsemi.com 4 AN-6753 APPLICATION NOTE Constant Output-Power Limit The maximum output power of a flyback converter can generally be determined from the current-sense resistor RS. When the load increases, the peak inductor current increases accordingly. When the output current arrives at the protection value, the Output-Current-Protection (OCP) comparator dominates the current-control loop. OCP occurs when the current-sense voltage reaches the threshold value. The output GATE driver is turned off after a small propagation delay, tPD. The delay time results in unequal power-limit levels under universal input. A sawtooth power limiter (saw limiter) is designed to solve the unequal power limit problem. As shown in Figure 10, the saw limiter is designed as a positive ramp signal (Vlimit_ramp) and is fed into the inverting input of the OCP comparator. This results in a lower current limit at high-line inputs than at low-line inputs. However, with the fixed propagation delay tPD, the peak primary current would be the same for various line-input voltages. Therefore, the maximum output power can remain a constant value within a wide input voltage range without adding any external circuitry. Actual Power Limit Point High-Line Sense Voltage Figure 11. LEB Circuit Open-Loop Protection (OLP) The FAN6753 contains an open-loop protection function. If the output load is higher than the maximum output current, the output voltage drops and the feedback error amplifier is saturated. Once the FB voltage trips the OLP threshold of 4.8V for longer than 56ms, the protection is activated to turns off the gate output to stop the switching of power circuit. As shown in Figure 1, the FB voltage is compared with 4.8V reference voltage. If the FB voltage is higher than 4.8V, the OLP timer starts counting. If the OLP condition persists for 56ms, the OLP signal could be asserted. This protection is reset after UVLO. 0.9V 0.56V Low-Line Sense Voltage ton1 tPD ton2 0 Figure 10. Constant Power-Limit Compensation Leading-Edge Blanking (LEB) A voltage signal proportional to the MOSFET current develops on the current-sense resistor RS. Each time the MOSFET is turned on, a spike induced by the diode reverse recovery and the output capacitances of the MOSFET and diode appears on the sensed signal. A leading-edge blanking time of about 140ns is introduced to avoid premature termination of the MOSFET by the spike. Therefore, only a small-value RC filter (e.g. 100Ω + 470pF) is required between the SENSE pin and RS. Still, a non-inductive resistor for the RS is recommended. FB OLP 56ms Timer 4.8V Figure 12. Open-Loop Protection Circuit © 2009 Fairchild Semiconductor Corporation Rev. 1.0.0 • 5/13/09 www.fairchildsemi.com 5 AN-6753 APPLICATION NOTE Output Driver / Soft Driving The output stage is a fast totem-pole gate driver capable of directly driving an external MOSFET. An internal Zener diode clamps the driver voltage under 18V to protect the MOSFET against over-voltage. By integrating special circuits to control the slew rate of switch-on rising time, the external resistor RG may not be necessary to reduce switching noise, improving Electromagnetic Interference (EMI) performance. External Latch Function (LATCH Pin) The LATCH pin can be used to control the FAN6753 entering latch mode by pulling this pin over 5.2V for 100µs. If floating, the LATCH pin is internally pulled HIGH to 3.5V. It is not recommended to float or short the LATCH pin to GND. This pin also includes a test mode to disable the jitter function. LATCH pin internally sources 100µA, so place a resistor in series to GND. Do not let this voltage exceed 5.2V for the FAN6753 to function normally. Over-Temperature Protection (OTP) The built-in temperature-sensing circuit shuts down PWM output once the junction temperature exceeds 135°C. While PWM output is shut down, VDD gradually drops to the UVLO voltage (around 7.5V). VDD then charges up to the startup threshold voltage of 15.5V through the startup resistor until PWM output is restarted. This hiccup-mode protection occurs repeatedly as long as the temperature remains above 130°C. The temperature hysteresis window for the OTP circuit is 25°C. Figure 13. Gate Driver © 2009 Fairchild Semiconductor Corporation Rev. 1.0.0 • 5/13/09 www.fairchildsemi.com 6 AN-6753 APPLICATION NOTE Printed Circuit Board Layout Current, voltage, and switching frequency make PCB layout and design very important. Good PCB layout minimizes excessive EMI and prevents the power supply from being disrupted during surge/ESD tests. The following are some general guidelines: For better EMI performance and to reduce line frequency ripples, the output of the bridge rectifier should be connected to capacitor Cbulk first, then to switching circuits. The high-frequency current loop is found in the loop Cbulk – Transformer – MOSFET – RS – Cbulk in Figure 14. The area enclosed by this current loop should be as small as possible. Keep the traces (especially 4→1) short, direct, and wide. High-voltage drain traces related to the MOSFET and RCD snubber should be kept far from control circuits to prevent unnecessary interference. If a heatsink is used for the MOSFET, grounding the heatsink is recommended. As indicated by 3 in Figure 14, the control circuits’ ground should be connected first, then to other circuitry. As indicated by 2 in Figure 14, the area enclosed by the transformer auxiliary winding, D1, and C1 should also be kept small. Place C1 close to FAN6753 for good decoupling. Two suggestions with pros and cons for ground connections are recommended. GND3→2→4→1: Possible method for circumventing the sense signals and common impedance interference. GND3→2→1→4: Potentially better for ESD testing where a ground is not available for the power supply. The charges for the ESD discharge path go from secondary, through the transformer stray capacitance, to the GND2 first. Then, the charges go from GND2 to GND1 and back to the mains. It should be noted that control circuits should not be placed on the discharge path. Point discharge for common choke can decrease high-frequency impedance and help increase ESD immunity. Should a Y-cap between primary and secondary be required, the Y-cap should be connected to the positive terminal of the Cbulk (VDC). If this Y-cap is connected to the primary GND, it should be connected to the negative terminal of the Cbulk (GND1) directly. Point discharge of the Y-cap also helps with ESD. However, according to safety requirements, the creepage between the two pointed ends should be at least 5mm. FAN6753 Figure 14. Layout Considerations © 2009 Fairchild Semiconductor Corporation Rev. 1.0.0 • 5/13/09 www.fairchildsemi.com 7 AN-6753 APPLICATION NOTE PCB Layout Suggestions for LCD monitor / TV Application: 1. Safety distance for EMI loop requirement in LCD monitor /TV application: UL60950 safety distance for lightening surge standard. © 2009 Fairchild Semiconductor Corporation Rev. 1.0.0 • 5/13/09 www.fairchildsemi.com 8 AN-6753 APPLICATION NOTE The UL60950 standard defines the safety distance for product operation where voltage is under 600V. The following table details distance for the power system PCB layout requirements from LCD monitor / TV specifications. Application Surge Voltage (V) 30000 4000V 5000V 6000V 9000V 12000V Location L-FG / N-FG / L-N L-FG / N-FG / L-N L-FG / N-FG / L-N L-FG / N-FG / L-N L-FG / N-FG / L-N L-FG / N-FG / L-N Layout Distance 2mm 3mm 4mm 5.5mm 9mm 14mm Design Rule (Practical) 2.6mm 4mm 5mm 6mm 9mm 14mm From the surge discharge loop function, it is necessary to lead the surge energy to ground. Two concepts can solve the issue: Provide enough distance (follow no.1). Use air and gap to replace SPA tube and reduce the cost by PCB layout. The location is as the table below describes: Location L -> FG(SG) N -> FG(SG) YC1 -> FG YC2 -> FG CM CHOKE Safety Distance( CL ) Table G.2 Table G.2 Table G.2 Table G.2 Table G.2 Gap Width 1mm 1mm 1mm 1mm 1mm Discharge (Gap / Air )(Point Discharge) Yes Yes Yes Yes Yes The ground path has the shortest loop and largest area in the primary side. (The PCB layout trace is the good loop.) Use the AC inlet’s mechanic component (ground clip and heat sink) to reduce the ground impedance and lead the surge energy to ground path in the building. © 2009 Fairchild Semiconductor Corporation Rev. 1.0.0 • 5/13/09 www.fairchildsemi.com 9 AN-6753 APPLICATION NOTE Design Example, 19V/3.42A for NB Adaptor Following is the specification of the design example: VIN min = 100 VDC (bulk valley in low-line conditions) VIN max = 375 VDC VOUT = 19V IOUT = 3.42A Operating mode is CCM η= 0.8 fSW = 65 kHz Follow below steps to design a transformer: 1. Turn Ratio. The MOSFET BVdss dictates the amount of reflected voltage needed. Considering a 600V MOSFET and a 15% de-rating factor, limit the maximum drain voltage to: VDS _ max = 600 • 0.85 = 510V In this equation, the CCM duty-cycle does not exceed 50%. The design should therefore be free of sub-harmonic oscillations in steady-state conditions. 3. To obtain the primary inductance, use the following equation, which expresses the inductance in relationship to a ripple factor KRF. This coefficient dictates the depth of the CCM operation. L = VIN _ min • d max 2 / (fSW • K RF • Pin ) ( ) (11) (6) Knowing a maximum bulk voltage of 375V, the clamp voltage must be set to: Vclamp = 510 − 375 = 135V where KRF = △IL/I1 and defines the amount of ripple desired in CCM (see Figure 15). Small KRF: deep CCM, implying a large primary inductance, a low bandwidth, and a large leakage inductance. Large KRF: approaching BCM, where the RMS losses are the worse, but smaller inductance, leading to a better leakage inductance. Selecting a KRF factor of 0.8 (40% ripple) ensures good operation over universal mains. It leads to an inductance of: L = (100 • 0.43 )2 / (65 k • 0.8 • 82 ) = 433 µH ΔIL = (VIN _ min • dmax ) / (fSW • L ) = (100 • 0.43 ) / (65k • 433 µH ) = 1.53 A peak - to - peak (7) Based on the above level, adopt a headroom between the reflected voltage and the RCD clamp level of 50V. If this headroom is too small, a high dissipation can occur on the RCD clamp network and efficiency suffers. A leakage inductance of around 1% of the magnetizing value should give good results with this choice (kc = 1.6). The turn ratio between primary and secondary is: (12) (13) The peak current can be evaluated as: IIN _ avg = POUT / η • VIN _ min = (19 • 3.42 ) / (0.8 • 100 ) = 812 mA ( ) (VOUT + Vf ) / n = Vclamp / kc (14) (8) Solving for n gives: 1.6 • (19 + 0.8 ). / 135 = 0.234 n = N S / N P = kc • (VOUT + Vf ) / Vclamp = IPEAK = IIN _ avg / dmax + ΔIL / 2 = 0.813 / 0.43 + 1.53 / 2 = 2.66 A (15) (9) Based on Figure 15, I1 can also be calculated as: I1 = I peak - ΔIL / 2 = 2.66 - (1.53 / 2) = 1.9A (16) Round it to 0.25 or 1/n = 4. The valley current is found to be: Ivalley = I peak - ΔIL = 2.66 - 1.53 = 1.13A (17) 4. Based on the above, evaluate the RMS current circulating in the MOSFET and the sense resistor: Id_rms = I1 • d • (1 + 1/3 • (ΔIL ) / (2 • I1 ))2 ) = 1.9 × 0.66 • ( 1 + 1/3 • (1.53 / (2 • 1.9)) 2 ) = 1.29A (18) 5. The current peaks to 2.66A. If the desired OCP is 120% of Ipeak and FAN6753’s Vlimit_L clamps 0.9V drop across the sense resistor, compute its value as: Rsense = 0.9V / (2.66A • 120%) = 0.282 Ω (19) Figure 15. Primary Inductance Current Evolution in CCM 2. Calculate the maximum operating duty-cycle for this flyback converter operated in CCM: d max = (VOUT / n ) / VOUT / n + VIN _ max = (19 • 4 ) / (19 • 4 + 100 ) = 0.43 Using Equation 18, the power dissipated in the sense element reaches: Psense = R sense • I d_rms 2 = 0.282 • 1.29 2 = 470mW ( ) (20) (10) www.fairchildsemi.com 10 © 2009 Fairchild Semiconductor Corporation Rev. 1.0.0 • 5/13/09 AN-6753 APPLICATION NOTE Related Datasheets FAN6753 — Highly Integrated Green-Mode PWM Controller DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. © 2009 Fairchild Semiconductor Corporation Rev. 1.0.0 • 5/13/09 www.fairchildsemi.com 11
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