S1A-S1M
S1A - S1M
Features • •
Low profile package. Glass passivated junction.
SMA/DO-214AC
COLOR BAND DENOTES CATHODE
General Purpose Rectifiers
Absolute Maximum Ratings*
Symbol
VRRM IF(AV) IFSM Tstg TJ
TA = 25°C unless otherwise noted
Parameter
1A Maximum Repetitive Reverse Voltage Average Rectified Forward Current, @ TA = 100°C Non-repetitive Peak Forward Surge Current 8.3 ms Single Half-Sine-Wave Storage Temperature Range Operating Junction Temperature 50 1B 100 1D 200
Value
1G 400 1.0 40 -55 to +150 -55 to +150 1J 600 1K 1M 800 1000
Units
V A A °C °C
*These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
Thermal Characteristics
Symbol
PD RθJA
Parameter
Power Dissipation Thermal Resistance, Junction to Ambient*
Value
1.4 85
Units
W °C/W
*Device mounted on FR-4 PCB 0.013 mm.
Electrical Characteristics
Symbol
VF trr IR CT
TA = 25°C unless otherwise noted
Parameter
1A Forward Voltage @ 1.0 A Reverse Recovery Time IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A Reverse Current @ rated VR TA = 25°C TA = 125°C Total Capacitance VR = 4.0 V, f = 1.0 MHz 1B 1D
Device
1G 1.1 1.8 1.0 50 12 1J 1K 1M
Units
V µs µA µA pF
2001 Fairchild Semiconductor Corporation
S 1A-S1M, Rev. C1. Aug 2006
S1A-S1M
General Purpose Rectifiers
(continued)
Typical Characteristics
Average Rectified Forward Current, IF [A]
2
Forward Current, IF [A]
1
SINGLE PHASE HALF WAVE 60HZ RESISTIVE OR INDUCTIVE LOAD P.C.B. MOUNTED ON 0.315x0.315" (8.0x8.0mm) COPPER PAD AREAS
100
10
1
0.1
0
0
25
50 75 100 125 Lead Temperature [ºC]
150
175
0.01 0.6
0.8
Figure 1. Forward Current Derating Curve
1 1.2 1.4 Forward Voltage, VF [V]
1.6
1.8
Figure 2. Forward Voltage Characteristics
Peak Forward Surge Current, IFSM [A]
30 25 20 15 10 5 0 Reverse Current, IR [uA]
8.3ms Single Half Sine-Wave JEDEC Method
100
10
T J = 125ºC
1
T J = 75ºC
0.1
T J = 25ºC
0.01
1
2
5 10 20 Number of Cycles at 60Hz
50
100
0.001
0
20
40 60 80 100 Reverse Voltage, VR[V]
120
140
Figure 3. Non-Repetitive Surge Current
Figure 4. Reverse Current vs Reverse Voltage
Transient Thermal Impedance [ºC/W]
100 Total Capacitance, CT [pF] 50
T J = 25º C f = 1.0 MHz Vsig = 50mV p-p
100
Units Mounted On 20"x 20"(5.4mm 2 )+0.5mil Thick Copper Land Areas
50 inches(0.013mm)
10 5
10 5
1 0.01
0.1 1 10 Reverse Voltage, VR [V]
100
1 0.01
0.1
1 10 Pulse Duration [s]
100
Figure 5. Total Capacitance
Figure 6. Thermal Impedance Characteristics
2001 Fairchild Semiconductor Corporation
S 1A-S1M, Rev. C1. Aug 2006
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. FACT Quiet Series™ GlobalOptoisolator™ GTO™ HiSeC™ I2C™ i-Lo™ ImpliedDisconnect™ IntelliMAX™ ISOPLANAR™ LittleFET™ MICROCOUPLER™ MicroFET™ MicroPak™ MICROWIRE™ MSX™ MSXPro™ Across the board. Around the world.™ The Power Franchise® Programmable Active Droop™ ACEx™ ActiveArray™ Bottomless™ Build it Now™ CoolFET™ CROSSVOLT™ DOME™ EcoSPARK™ E2CMOS™ EnSigna™ FACT™ FAST® FASTr™ FPS™ FRFET™ DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
OCX™ OCXPro™ OPTOLOGIC® OPTOPLANAR™ PACMAN™ POP™ Power247™ PowerEdge™ PowerSaver™ PowerTrench® QFET® QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ RapidConnect™ μSerDes™ ScalarPump™
SILENT SWITCHER® SMART START™ SPM™ Stealth™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TCM™ TinyBoost™ TinyBuck™ TinyPWM™ TinyPower™ TinyLogic® TINYOPTO™ TruTranslation™ UHC™
UniFET™ UltraFET® VCX™ Wire™
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS Definition of Terms
Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
Rev. I20
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