HMBT3906

HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6820 Issued Date : 1993.06.30 Revised Date : 2002.10.25 Page No. : 1/3 HMBT3906 PNP EPITAXIAL PLANAR TRANSISTOR Description The HMBT3906 is designed for general purpose switching and amplifier applications. Absolute Maximum Ratings SOT-23 • Maximum Temperatures Storage Temperature ........................................................................................... -55 ~ +150 °C Junction Temperature.................................................................................................... +150 °C • Maximum Power Dissipation Total Power Dissipation (Ta=25°C) ............................................................................... 225 mW • Maximum Voltages and Currents (Ta=25°C) VCBO Collector to Base Voltage ........................................................................................ -40 V VCEO Collector to Emitter Voltage..................................................................................... -40 V VEBO Emitter to Base Voltage............................................................................................. -5 V IC Collector Current....................................................................................................... -200 mA Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICEX *VCE(sat)1 *VCE(sat)2 *VBE(sat)1 *VBE(sat)2 *hFE1 *hFE2 *hFE3 *hFE4 *hFE5 fT Cob Min. -40 -40 -5 -0.65 60 80 100 60 30 250 Typ. -0.2 -0.84 Max. -50 -0.25 -0.4 -0.85 -0.95 300 4.5 Unit V V V nA V V V V Test Conditions IC=-10uA IC=-1mA IC=-10uA VCE=-30V, VBE=-3V IC=-10mA, IB=-1mA IC=-50mA, IB=-5mA IC=-10mA, IB=-1mA IC=-50mA, IB=-5mA VCE=-1V, IC=-0.1mA VCE=-1V, IC=-1mA VCE=-1V, IC=-10mA VCE=-1V, IC=-50mA VCE=-1V, IC=-100mA VCE=-20V, IC=-10mA, f=100MHz VCB=-5V, f=1MHz *Pulse Test: Pulse Width ≤380us, Duty Cycle≤2% MHz pF HMBT3906 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 1000 Spec. No. : HE6820 Issued Date : 1993.06.30 Revised Date : 2002.10.25 Page No. : 2/3 Saturation Voltage & Collector Current 125 C o Saturation Voltage (mV) 125 C o o 25 C o hFE 100 75 C o 75 C 100 hFE @ VCE=1V 25 C o VCE(sat) @ IC=10IB 10 1 10 100 1000 10 1 10 100 1000 Collector Current-IC (mA) Collector Current-IC (mA) Saturation Voltage & Collector Current 10000 Cutoff Frequency & Collector Current 1000 Cutoff Frequency (MHz).. . Saturation Voltage (mV) 75 C 1000 25 C o o fT @ VCE=20V 100 125 C VBE(sat) @ IC=10IB o 100 1 10 100 1000 10 1 10 100 1000 Collector Current-IC (mA) Collector Current (mA) Capacitance & Reverse-Biased Voltage 100 10000 Safe Operating Area PT=1ms 1000 Collector Current (A) PT =1s 100 PT=100ms 10 Capacitance (Pf) Cob 10 1 0.1 1 0.1 1 10 100 0.01 1 10 100 Reverse Biased Voltage (V) Forward Voltage (V) HMBT3906 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. SOT-23 Dimension Spec. No. : HE6820 Issued Date : 1993.06.30 Revised Date : 2002.10.25 Page No. : 3/3 A L Marking: 3 BS 1 V G 2 2A Rank Code Control Code 3-Lead SOT-23 Plastic Surface Mounted Package HSMC Package Code: N C D H K J Style: Pin 1.Base 2.Emitter 3.Collector *: Typical DIM A B C D G H Inches Min. Max. 0.1102 0.1204 0.0472 0.0630 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0005 0.0040 Millimeters Min. Max. 2.80 3.04 1.20 1.60 0.89 1.30 0.30 0.50 1.70 2.30 0.013 0.10 DIM J K L S V Inches Min. Max. 0.0034 0.0070 0.0128 0.0266 0.0335 0.0453 0.0830 0.1083 0.0098 0.0256 Millimeters Min. Max. 0.085 0.177 0.32 0.67 0.85 1.15 2.10 2.75 0.25 0.65 Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: • Lead: 42 Alloy; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: • Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 • Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HMBT3906 HSMC Product Specification