HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6806 Issued Date : 1996.04.10 Revised Date : 2002.11.29 Page No. : 1/3
HMBT6520
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HMBT6520 is designed for general purpose applications requiring high breakdown voltages.
Features
• High Collector-Emitter Breakdown Voltage • Low Collector-Emitter Saturation Voltage • The HMBT6520 is complementary to HMBT6517
SOT-23
Absolute Maximum Ratings
• Maximum Temperatures Storage Temperature........................................................................................................ -55 ~ +150 °C Junction Temperature................................................................................................ +150 °C Maximum • Maximum Power Dissipation Total Power Dissipation (Ta=25°C)............................................................................................ 225 mW • Maximum Voltages and Currents (Ta=25°C) VCBO Collector to Base Voltage ................................................................................................. -350 V VCEO Collector to Emitter Voltage .............................................................................................. -350 V VEBO Emitter to Base Voltage ........................................................................................................ -5 V IC Collector Current ................................................................................................................. -500 mA IB Base Current ....................................................................................................................... -250 mA
Characteristics (Ta=25°C)
Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat)1 *VCE(sat)2 *VCE(sat)3 *VCE(sat)4 VBE(on) *VBE(sat)1 *VBE(sat)2 *VBE(sat)3 *hFE1 *hFE2 *hFE3 *hFE4 *HFE5 fT Cob
HMBT6520
Min. -350 -350 -5 20 30 30 20 15 40 -
Typ. -
Max. -50 -50 -300 -350 -500 -1 -2 -750 -850 -900 200 200 200 6
Unit V V V nA nA mV mV mV V V mV mV mV
Test Conditions IC=-100uA IC=-1mA IE=-10uA VCB=-250V VEB=-4V IC=-10mA, IB=-1mA IC=-20mA, IB=-2mA IC=-30mA, IB=-3mA IC=-50mA, IB=-5mA VCE=-10V, IC=-100mA IB=-1mA, IC=-10mA IB=-2mA, IC=-20mA IB=-3mA, IC=-30mA VCE=-10V, IC=-1mA VCE=-10V, IC=-10mA VCE=-10V, IC=-30mA VCE=-10V, IC=-50mA VCE=-10V, IC=-100mA VCE=-20V ,IC=-10mA, f=20MHz VCB=-20V, f=1MHz
*Pulse Test: Pulse Width ≤380us, Duty Cycle≤2%
HSMC Product Specification
MHz pF
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
100 VCE=10V 10000 100000
Spec. No. : HE6806 Issued Date : 1996.04.10 Revised Date : 2002.11.29 Page No. : 2/3
Saturation Voltage & Collector Current
Saturation Voltage (mV)
hFE
1000
VBE(sat) @ IC=10IB
10
100
VCE(sat) @ IC=10IB
10
1 0.01
0.1
1 10 Collector Current (mA)
100
1000
1 0.001
0.01
0.1
1
10
100
1000
Collector Current (mA)
On Voltage & Collector Current
10000 100
Cutoff Frequency & Collector Current
Cutoff Frequency (MHz)
VCE=20V
On Voltage (mV)
1000
VBE(ON) @ VCE=10V
100 0.01
10 0.1 1 10 100 1000 1 10 100
Collector Current (mA)
Collector Current (mA)
Capacitance & Reverse-Biased Voltage
100
Capacitance (pF)
10 Cob
1 0.1 1 10 100
Reverse-Biased Voltage (V)
HMBT6520
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-23 Dimension
Spec. No. : HE6806 Issued Date : 1996.04.10 Revised Date : 2002.11.29 Page No. : 3/3
A L
Marking:
3 BS 1 V G 2
2Z
Control Code
3-Lead SOT-23 Plastic Surface Mounted Package HSMC Package Code: N
C
D
H
K
J
Style: Pin 1.Base 2.Emitter 3.Collector *: Typical
DIM A B C D G H
Inches Min. Max. 0.1102 0.1204 0.0472 0.0630 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0005 0.0040
Millimeters Min. Max. 2.80 3.04 1.20 1.60 0.89 1.30 0.30 0.50 1.70 2.30 0.013 0.10
DIM J K L S V
Inches Min. Max. 0.0034 0.0070 0.0128 0.0266 0.0335 0.0453 0.0830 0.1083 0.0098 0.0256
Millimeters Min. Max. 0.085 0.177 0.32 0.67 0.85 1.15 2.10 2.75 0.25 0.65
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 • Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMBT6520
HSMC Product Specification
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