HMPSA13

HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6343 Issued Date : 1993.03.24 Revised Date : 2001.05.01 Page No. : 1/4 HMPSA13 NPN SILICON DARLINGTON TRANSISTOR Description The HMPSA13 is designed for applications requiring extremely high current gain at collector to 500mA. Features • High D.C. Current Gain • Complementary to HMPSA63 Absolute Maximum Ratings • Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 °C Junction Temperature ................................................................................... +150 °C Maximum • Maximum Power Dissipation Total Power Dissipation (Ta=25°C) ............................................................................... 600 mW • Maximum Voltages and Currents (Ta=25°C) VCBO Collector to Base Voltage ........................................................................................ 30 V VCES Collector to Emitter Voltage...................................................................................... 30 V VEBO Emitter to Base Voltage ........................................................................................... 10 V IC Collector Current ....................................................................................................... 500 mA Characteristics (Ta=25°C) Symbol BVCBO BVCES BVEBO ICBO IEBO *VCE(sat)1 *VCE(sat)2 *hFE1 *hFE2 *hFE3 fT Cob Min. 30 30 10 5 10 125 Typ. 1.0 50 Max. 100 100 1.5 6 Unit V V V nA nA V V K K K MHz pF Test Conditions IC=100uA, IE=0 IC=100uA, VBE=0 IE=10uA, IC=0 VCB=30V, IE=0 VEB=10V, IC=0 IC=100mA, IB=0.1mA IC=500mA, IB=0.5mA VCE=5V, IC=10mA VCE=5V, IC=100mA VCE=5V, IC=500mA VCE=5V, IC=10mA, f=100MHz VCB=10V, f=1MHz *Pulse Test : Pulse Width ≤380us, Duty Cycle≤2% Classification Of hFE3 Rank SUN N HMPSA13 VCE(sat)2 20K hFE3 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000k 10000 Spec. No. : HE6343 Issued Date : 1993.03.24 Revised Date : 2001.05.01 Page No. : 2/4 Saturation Voltage & Collector Current hFE @ VCE=5V 100k Saturation Voltage (mV) hFE 1000 VBE(sat) @ IC=1000IB VCE(sat) @ IC=1000IB 10k 0.1 1 10 100 1000 100 1 10 100 1000 Collector Current (mA) Collector Current (mA) On Voltage & Collector Current 10000 10 Capacitance & Reverse-Biased Voltage On Voltage (mV) 1000 VBE(on) @ VCE=5V Capacitance (pF) Cob 100 0.1 1 10 100 1000 1 1 10 100 Collector Current (mA) Reverse-Biased Voltage (V) Cutoff Frequency & Collector Current 1000 1000 Safe Operating Area PT=1s Collector Current-IC (mA) Cutoff Frequency (MHz) PT=100ms 100 PT=1ms VCE=5V 100 10 10 1 10 100 1000 1 1 10 100 Collector Current (mA) Forward Voltage-VCE (V) HMPSA13 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6343 Issued Date : 1993.03.24 Revised Date : 2001.05.01 Page No. : 3/4 PD-Ta 700 600 Power Dissipation-PD(mW) 500 400 300 200 100 0 0 20 40 60 80 100 o 120 140 160 Ambient Temperature-Ta( C) HMPSA13 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-92 Dimension A B 12 3 Spec. No. : HE6343 Issued Date : 1993.03.24 Revised Date : 2001.05.01 Page No. : 4/4 α2 Marking : HSMC Logo Part Number Date Code Product Series α3 Laser Mark HSMC Logo Product Series C D Part Number H I E F G Ink Mark Style : Pin 1.Emitter 2.Base 3.Collector α1 3-Lead TO-92 Plastic Package HSMC Package Code : A *:Typical DIM A B C D E F Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I α1 α2 α3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5° *2° *2° Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5° *2° *2° Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : • Lead : 42 Alloy ; solder plating • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : • Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 • Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 HMPSA13 HSMC Product Specification