HMPSA27

HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6332 Issued Date : 1995.05.18 Revised Date : 2002.04.11 Page No. : 1/3 HMPSA27 NPN SILICON TRANSISTOR Description The HMPSA27 is designed for darlington amplifier high current gain collector current to 500mA. Absolute Maximum Ratings TO-92 • Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 °C Junction Temperature .................................................................................... +150 °C Maximum • Maximum Power Dissipation Total Power Dissipation (Ta=25°C) ................................................................................ 625 mW • Maximum Voltages and Currents (Ta=25°C) VCBO Collector to Base Voltage ......................................................................................... 60 V VCES Collector to Emitter Voltage ...................................................................................... 60 V VEBO Collector to Emitter Voltage ...................................................................................... 10 V IC Collector Current........................................................................................................ 500 mA Characteristics (Ta=25°C) Symbol BVCBO BVCES BVEBO ICBO IEBO ICES *VCE(sat) VBE(on) *hFE1 *hFE2 Min. 60 60 10 10K 10K Typ. Max. 100 100 500 1.5 2 Unit V V V nA nA nA V V Test Conditions IC=100uA, IE=0 IC=100uA, VBE=0 IE=10uA, IC=0 VCB=50V, IE=0 VEB=10V, IC=0 VCE=50V IC=100mA, IB=0.1mA VCE=5V, IC=100mA VCE=5V, IC=10mA VCE=5V, IC=100mA *Pulse Test: Pulse Width ≤380us, Duty Cycle≤2% HMPSA27 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 100000 125 C o Spec. No. : HE6332 Issued Date : 1995.05.18 Revised Date : 2002.04.11 Page No. : 2/3 Saturation Voltage & Collector Current 10000 Saturation Voltage (mV) 75 C 1000 25 C o o hFE 25 C o 75 C o 125 C hFE @ VCE=5V 10000 10 100 1000 100 1 10 100 1000 VCE(sat) @ IC=1000IB o Collector Current-IC (mA) Collector Current-IC (mA) ON Voltage & Collector Current 10000 Capacitance & Reverse-Biased Voltage 10 Capacitance (pF) ON Voltage (mV) Cob 25 C 1000 125 C 75 C VBE(ON) @ VCE=5V o o o 100 1 10 100 1000 1 0.1 1 10 100 Collector Current-IC (mA) Reverse-Biased Voltage (V) Safe Operating Area 10000 PT=1ms PD-Ta 700 600 Collector Current-IC (mA) 1000 PT=1s 100 Power Dissipation-PD (mW) 10 100 PT=100ms 500 400 300 200 100 10 1 1 0 0 50 100 o 150 200 Forward Voltage-VCE (V) Ambient Temperature-Ta ( C) HMPSA27 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-92 Dimension A B 1 2 3 Date Code Spec. No. : HE6332 Issued Date : 1995.05.18 Revised Date : 2002.04.11 Page No. : 3/3 α2 Marking: H MP S A27 Control Code α3 C Style: Pin 1.Emitter 2.Base 3.Collector D H I E F G α1 3-Lead TO-92 Plastic Package HSMC Package Code: A *: Typical DIM A B C D E F Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I α1 α2 α3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5° *2° *2° Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5° *2° *2° Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: • Lead: 42 Alloy; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: • Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 • Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HMPSA27 HSMC Product Specification