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HMPSA26

HMPSA26

  • 厂商:

    HSMC

  • 封装:

  • 描述:

    HMPSA26 - NPN SILICON TRANSISTOR - Hi-Sincerity Mocroelectronics

  • 数据手册
  • 价格&库存
HMPSA26 数据手册
HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6308-B Issued Date : 1992.09.09 Revised Date : 2000.10.01 Page No. : 1/3 HMPSA26 NPN SILICON TRANSISTOR Description The HMPSA26 is designed for using in darligton transistor. Absolute Maximum Ratings • Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 °C Junction Temperature ................................................................................... +150 °C Maximum • Maximum Power Dissipation Total Power Dissipation (Ta=25°C) ............................................................................... 625 mW • Maximum Voltages and Currents (Ta=25°C) VCBO Collector to Base Voltage ........................................................................................ 50 V VCES Collector to Emitter Voltage...................................................................................... 50 V VEBO Emitter to BASE Voltage .......................................................................................... 10 V IC Collector Current ....................................................................................................... 500 mA Characteristics (Ta=25°C) Symbol BVCBO BVCES BVEBO ICBO ICES IEBO *VCE(sat) VBE(on) *hFE1 *hFE2 Min. 50 50 10 10K 10K Typ. 0.6 Max. 100 500 100 1.5 2 Unit V V V nA nA nA V V Test Conditions IC=100uA, IE=0 IC=100uA, VBE=0 IE=10uA, IC=0 VCB=40V, IE=0 VCE=40V, VBE=0 VEB=10V, IC=0 IC=100mA, IB=100uA VCE=5V, IC=100mA VCE=5V, IC=10mA VCE=5V, IC=100mA *Pulse Test : Pulse Width ≤380us, Duty Cycle≤2% HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 100000 10 Spec. No. : HE6308-B Issued Date : 1992.09.09 Revised Date : 2000.10.01 Page No. : 2/3 Saturation Voltage & Collector Current 10000 VCE=5V 1000 Saturation Voltage (V) hFE 1 VCE(sat) @ IC=1000IB 100 10 1 1 10 100 1000 0.1 1 10 100 1000 Collector Current (mA) Collector Current (mA) On Voltage & Collector Current 10 10 Capacitance & Reverse-Biased Voltage Capacitance (pF) On Voltage (mV) Cob 1 VBE(ON) @ VCE=5V 0.1 0.01 0.1 1 10 100 1000 1 0.1 1 10 100 Collector Current (mA) Reverse-Biased Voltage (V) Safe Operating Area 10000 PT=1ms 600 700 PD-Ta Collector Current-IC (mA) 1000 PT=1s 100 Power Dissipation-PD(mW) PT=100ms 500 400 300 200 100 10 1 1 10 100 0 0 20 40 60 80 100 o 120 140 160 Forward Voltage-V CE (V) Ambient Temperature-Ta( C) HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-92 Dimension A B 12 3 Spec. No. : HE6308-B Issued Date : 1992.09.09 Revised Date : 2000.10.01 Page No. : 3/3 α2 Marking : HSMC Logo Part Number Date Code Rank Product Series α3 Laser Mark HSMC Logo Product Series C D Part Number H I E F G Ink Mark Style : Pin 1.Emitter 2.Base 3.Collector α1 3-Lead TO-92 Plastic Package HSMC Package Code : A *:Typical DIM A B C D E F Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I α1 α2 α3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5° *2° *2° Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5° *2° *2° Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : • Lead : 42 Alloy ; solder plating • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : • Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 • Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 • Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220 HSMC Product Specification
HMPSA26 价格&库存

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