HMPSA18

HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6306-B Issued Date : 1992.09.09 Revised Date : 2000.10.01 Page No. : 1/4 HMPSA18 NPN SILICON TRANSISTOR Description The HMPSA18 is designed for low noise stage of audio amplifiers. Features • Low Noise : 1.5 dB Max. Absolute Maximum Ratings • Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 °C Junction Temperature ................................................................................... +150 °C Maximum • Maximum Power Dissipation Total Power Dissipation (Ta=25°C) ............................................................................... 625 mW • Maximum Voltages and Currents (Ta=25°C) VCBO Collector to Base Voltage ........................................................................................ 45 V VCES Collector to Emitter Voltage...................................................................................... 45 V VEBO Emitter to Base Voltage .......................................................................................... 6.5 V IC Collector Current ...................................................................................................... 200 mA Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO *VCE(sat)1 *VCE(sat)2 VBE(on) *hFE1 *hFE2 *hFE3 fT Cob Min. 45 45 6.5 300 500 500 100 Typ. 0.6 1100 1150 160 1.7 Max. 50 0.2 0.3 0.7 1500 3 Unit V V V nA V V V Test Conditions IC=100uA, IE=0 IC=10mA, IB=0 IE=10uA, IC=0 VCB=30V, IE=0 IC=10mA, IB=0.5mA IC=50mA, IB=5mA VCE=5V, IC=1mA VCE=5V, IC=100uA VCE=5V, IC=1mA VCE=5V, IC=10mA VCE=5V, IC=1mA, f=100MHz VCB=5V, f=1MHz, IE=0 MHz pF *Pulse Test : Pulse Width ≤380us, Duty Cycle≤2% Classification Of hFE1 Rank hFE A >300 B >500 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 VCE=5V 1 Spec. No. : HE6306-B Issued Date : 1992.09.09 Revised Date : 2000.10.01 Page No. : 2/4 Saturation Voltage & Collector Current 100 Saturation Voltage (V) hFE 0.1 10 VCE(sat) @ IC=20IB 1 0.01 0.1 1 10 100 1000 0.01 0.01 0.1 1 10 100 1000 C ollector Current (mA) Collector Current (mA) On Voltage & Collector Current 10 1000 Cutoff Frequency & Collector Current VCE=5V Cutoff Frequency (MHz) 1000 On Voltage (mV) 100 1 VBE(ON) @ VCE=5V 10 0.1 0.01 0.1 1 10 100 1 1 10 100 Collector Current (mA) Collector Current (mA) Capacitance & Reverse-Biased Voltage 10 10000 Safe Operating Area PT=1m s PT=100ms PT=1s Cob Collector Current-IC (mA) 10 100 1000 Capacitance (pF) 100 10 1 0.1 1 1 1 10 100 Reverse-Biased Voltage (V) Forward Voltage-V CE (V) HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6306-B Issued Date : 1992.09.09 Revised Date : 2000.10.01 Page No. : 3/4 PD-Ta 700 600 Power Dissipation-PD(mW) 500 400 300 200 100 0 0 20 40 60 80 100 o 120 140 160 Ambient Temperature-Ta( C) HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-92 Dimension A B 12 3 Spec. No. : HE6306-B Issued Date : 1992.09.09 Revised Date : 2000.10.01 Page No. : 4/4 α2 Marking : HSMC Logo Part Number Date Code Rank Product Series α3 Laser Mark HSMC Logo Product Series C D Part Number H I E F G Ink Mark Style : Pin 1.Emitter 2.Base 3.Collector α1 3-Lead TO-92 Plastic Package HSMC Package Code : A *:Typical DIM A B C D E F Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I α1 α2 α3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5° *2° *2° Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5° *2° *2° Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : • Lead : 42 Alloy ; solder plating • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : • Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 • Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 • Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220 HSMC Product Specification