JIANGSU CHANGJING ELECTRONICS TECHNOLOGY CO., LTD
PDFN
DFN
WB3×3-8L Plastic-Encapsulate MOSFETS
CJAB20SN06
N-Channel Power MOSFET
V(BR)DSS
RDS(on)TYP
8mΩ@10V
60V
ID
DFNWB3×3-8L
20A
9.7mΩ@4.5V
DESCRIPTION
The CJAB20SN06 uses advanced trench technology and design
to provide excellent RDS(ON) with low gate charge. It can be used in a
wide variety of applications
FEATURES
Battery switch
Good stability and uniformity with high EAS
Load switch
Excellent package for good heat dissipation
High density cell design for ultra low RDS(ON)
Special process technology for high ESD
Fully characterized avalanche voltage and
capability
current
APPLICATIONS
SMPS and general purpose applications
Uninterruptible Power Supply
Hard switched and high frequency circuits
MARKING
EQUIVALENT CIRCUIT
AB20SN06 = Part No.
8
D
7
D
6
D
D
5
Solid dot=Pin1 indicator
XX=Date Code
2
1
S
3
S
4
S
G
MAXIMUM RATINGS ( Ta=25℃ unless otherwise noted )
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
VDS
60
V
Gate-Source Voltage
VGS
±20
V
Continuous Drain Current
ID
20
A
Pulsed Drain Current
IDM
50
A
70
mJ
PD
3.1
W
RθJA
46
℃/W
Junction Temperature
TJ
150
℃
Storage Temperature Range
Tstg
-55 ~+150
℃
Lead Temperature for Soldering Purposes(1/8’’ from case for 10s)
TL
260
℃
Single Pulsed Avalanche Energy
EAS
Power Dissipation
Thermal Resistance from Junction to Ambient
(1)
(1).EAS condition: VDD=30V, L=0.3 mH, RG=25Ω, Starting TJ = 25°C
(2).Mounted on a glass epoxy board of 25.4 mm x 25.4 mm x 0.8 mmt
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1
Rev. - 1.0
MOSFET ELECTRICAL CHARACTERISTICS
Ta =25 ℃ unless otherwise specified
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
V(BR) DSS
VGS = 0V, ID =250µA
Zero gate voltage drain current
IDSS
VDS =60V, VGS =0V
0.3
µA
Gate-body leakage current
IGSS
VDS =0V, VGS =±20V
±100
nA
Gate-threshold voltage
VGS(th)
VDS =VGS, ID =250µA
1.7
2.5
V
Static drain-source on-sate resistance
RDS(on)
VGS =10V, ID =12A
8.0
9.0
mΩ
VGS =4.5V, ID =12A
9.7
13.0
mΩ
VDS =5V, ID =12A
70
Off characteristics
Drain-source breakdown voltage
60
V
On characteristics (note1)
Forward transconductance
gFS
1.1
S
Dynamic characteristics (note 2)
Input capacitance
Ciss
Output capacitance
Coss
Reverse transfer capacitance
Crss
VDS =30V,VGS =0V,
f =1MHz
1691
pF
395
9
Switching characteristics (note 2)
Total gate charge
Qg
Gate-source charge
Qgs
Gate-drain charge
Qgd
6.5
Turn-on delay time
td(on)
6
Turn-on rise time
Turn-off delay time
Turn-off fall time
VDS=30V, VGS=10V,
ID=12A
30
nC
3.5
tr
VDS=30V,VGS=10V,
5
td(off)
RG=10Ω,ID=12A
29
tf
45
ns
7
Drain-Source Diode Characteristics
Drain-source diode forward voltage(note1)
Continuous drain-source diode forward
current
Pulsed drain-source diode forward current
VSD
VGS =0V, IS=12A
1.2
V
IS
12
A
ISM
36
A
Reverse Recovery Time
trr
VR=30V,IF=12A,
Reverse Recovery Charge
Qrr
dI/dt=300A/μs(Note1)
0.9
50
ns
120
nC
Notes:
1.
Pulse Test : Pulse Width≤300µs, duty cycle ≤2%.
2.
Guaranteed by design, not subject to production.
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2
Rev. - 1.0
Typical Characteristics
Output Characteristics
24
Transfer Characteristics
30
VDS=5V
Pulsed
20
Pulsed
25
(A)
16
ID
VGS=4.5V
DRAIN CURRENT
DRAIN CURRENT
ID
(A)
VGS=10V
12
8
4
20
15
Ta=25℃
10
5
VGS=2.5V
0
0
1
2
3
DRAIN TO SOURCE VOLTAGE
4
VDS
0
5
0
1
(V)
2
Pulsed
(m)
16
RDS(ON)
14
12
VGS= 4.5V
10
ON-RESISTANCE
(m)
RDS(ON)
ON-RESISTANCE
Pulsed
ID=10A
18
16
8
VGS=10V
6
4
2
0
14
12
Ta=100℃
10
8
Ta=25℃
6
4
2
5
3
10
15
DRAIN CURRENT
20
ID
0
25
3
(A)
4
5
8
VGS
9
10
(V)
2.5
Pulsed
2.0
VTH
(V)
10
1
Ta=25℃
Ta=100℃
THRESHOLD VOLTAGE
IS (A)
7
Threshold Voltage
IS —— VSD
SOURCE CURRENT
6
GATE TO SOURCE VOLTAGE
25
0.1
0.01
1E-3
4
(V)
20
Ta=25℃
18
VGS
RDS(ON)—— VGS
RDS(ON) —— ID
20
3
GATE TO SOURCE VOLTAGE
0
200
400
600
SOURCE TO DRAIN VOLTAGE
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800
1000
ID=250uA
1.5
1.0
0.5
0.0
25
1200
VSD (mV)
50
75
JUNCTION TEMPERATURE
3
100
TJ
125
(℃ )
Rev. - 1.0
DFNWB3×3-8 L
NOTICE
JSCJ reserves the right to make modifications,enhancements,improvements,corrections or other
changes without further notice to any product herein. JSCJ does not assume any liability arising
out of the application or use of any product described herein.
www.jscj-elec.com
4
Rev. - 1.0
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