LTC2209IUP-PBF

LTC2209 16-Bit, 160Msps ADC FEATURES n n n n n n n n n n n n n DESCRIPTION The LTC®2209 is a 160Msps 16-bit A/D converter designed for digitizing high frequency, wide dynamic range signals with input frequencies up to 700MHz. The input range of the ADC can be optimized with the PGA front end. The LTC2209 is perfect for demanding communications applications, with AC performance that includes 77.3dBFS Noise Floor and 100dB spurious free dynamic range (SFDR). Ultra low jitter of 70fsRMS allows undersampling of high input frequencies with excellent noise performance. Maximum DC specs include ±5LSB INL, ±1LSB DNL (no missing codes). The digital output can be either differential LVDS or single-ended CMOS. There are two format options for the CMOS outputs: a single bus running at the full data rate or demultiplexed busses running at half data rate. A separate output power supply allows the CMOS output swing to range from 0.5V to 3.6V. The ENC+ and ENC– inputs may be driven differentially or single-ended with a sine wave, PECL, LVDS, TTL or CMOS inputs. An optional clock duty cycle stabilizer allows high performance at full speed with a wide range of clock duty cycles. L, LT, LTC and LTM are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. n Sample Rate: 160Msps 77.3dBFS Noise Floor 100dB SFDR SFDR >84dB at 250MHz (1.5VP-P Input Range) PGA Front End (2.25VP-P or 1.5VP-P Input Range) 700MHz Full Power Bandwidth S/H Optional Internal Dither Optional Data Output Randomizer LVDS or CMOS Outputs Single 3.3V Supply Power Dissipation: 1.45W Clock Duty Cycle Stabilizer Pin-Compatible Family: 130Msps: LTC2208 (16-Bit), LTC2208-14 (14-Bit) 105Msps: LTC2217 (16-Bit) 64-Pin (9mm × 9mm) QFN Package APPLICATIONS n n n n n n Telecommunications Receivers Cellular Base Stations Spectrum Analysis Imaging Systems ATE TYPICAL APPLICATION 3.3V SENSE VCM 2.2μF 1.25V COMMON MODE BIAS VOLTAGE INTERNAL ADC REFERENCE GENERATOR OVDD 0.5V TO 3.6V 1μF OF CLKOUT D15 • • • D0 OGND CLOCK/DUTY CYCLE CONTROL VDD GND ENC + ENC – PGA SHDN DITH MODE LVDS RAND 1μF 1μF 3.3V 1μF 2209 TA01 64k Point FFT, fIN = 15.1MHz, –1dBFS, PGA = 0 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 0 10 20 30 40 50 60 FREQUENCY (MHz) 70 80 2209 TA01b ANALOG INPUT AIN– S/H AMP – 16-BIT PIPELINED ADC CORE CORRECTION LOGIC AND SHIFT REGISTER OUTPUT DRIVERS CMOS OR LVDS ADC CONTROL INPUTS 2209fa AMPLITUDE (dBFS) AIN+ + 1 LTC2209 ABSOLUTE MAXIMUM RATINGS OVDD = VDD (Notes 1 and 2) TOP VIEW PIN CONFIGURATION 64 PGA 63 RAND 62 MODE 61 LVDS 60 OF+/OFA 59 OF–/DA15 58 D15+/DA14 57 D15–/DA13 56 D14+/DA12 55 D14–/DA11 54 D13+/DA10 53 D13–/DA9 52 D12+/DA8 51 D12–/DA7 50 OGND 49 OVDD SENSE 1 GND 2 VCM 3 GND 4 VDD 5 VDD 6 GND 7 AIN+ 8 AIN– 9 GND 10 GND 11 ENC+ 12 ENC– 13 GND 14 VDD 15 VDD 16 65 48 D11+/DA6 47 D11–/DA5 46 D10+/DA4 45 D10–/DA3 44 D9+/DA2 43 D9–/DA1 42 D8+/DA0 41 D8–/CLKOUTA 40 CLKOUT+/CLKOUTB 39 CLKOUT –/OFB 38 D7+/DB15 37 D7–/DB14 36 D6+/DB13 35 D6–/DB12 34 D5+/DB11 33 D5–/DB10 EXPOSED PAD IS GND (PIN 65) MUST BE SOLDERED TO PCB BOARD TJMAX = 150°C, θJA = 20°C/W ORDER INFORMATION LEAD FREE FINISH LTC2209CUP#PBF LTC2209IUP#PBF LEAD BASED FINISH LTC2209CUP LTC2209IUP TAPE AND REEL LTC2209CUP#TRPBF LTC2209IUP#TRPBF TAPE AND REEL LTC2209CUP#TR LTC2209IUP#TR PART MARKING* LTC2209UP LTC2209UP PART MARKING* LTC2209UP LTC2209UP PACKAGE DESCRIPTION 64-Lead (9mm × 9mm) Plastic QFN 64-Lead (9mm × 9mm) Plastic QFN PACKAGE DESCRIPTION 64-Lead (9mm × 9mm) Plastic QFN 64-Lead (9mm × 9mm) Plastic QFN TEMPERATURE RANGE 0°C to 70°C –40°C to 85°C TEMPERATURE RANGE 0°C to 70°C –40°C to 85°C Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container. For more information on lead free part marking, go to: http://www.linear.com/leadfree/ For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/ The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4) PARAMETER Integral Linearity Error Integral Linearity Error Differential Linearity Error Offset Error Offset Drift Gain Error Full-Scale Drift Transition Noise External Reference Internal Reference External Reference External Reference l CONVERTER CHARACTERISTICS CONDITIONS VDD 17 GND 18 SHDN 19 DITH 20 D0–/DB0 21 DO+/DB1 22 D1–/DB2 23 D1+/DB3 24 D2–/DB4 25 D2+/DB5 26 D3–/DB6 27 D3+/DB7 28 D4–/DB8 29 D4+/DB9 30 OGND 31 OVDD 32 Supply Voltage (VDD) ................................... –0.3V to 4V Digital Output Ground Voltage (OGND) ........ –0.3V to 1V Analog Input Voltage (Note 3) ...... –0.3V to (VDD + 0.3V) Digital Input Voltage..................... –0.3V to (VDD + 0.3V) Digital Output Voltage ................–0.3V to (OVDD + 0.3V) Power Dissipation .............................................2500mW Operating Temperature Range LTC2209C ................................................ 0°C to 70°C LTC2209I..............................................–40°C to 85°C Storage Temperature Range...................–65°C to 150°C Digital Output Supply Voltage (OVDD) .......... –0.3V to 4V MIN l l l TYP ±1.5 ±1.5 ±0.3 ±2 ±10 ±0.2 ±30 ±15 3 MAX ±5 ±5.5 ±1 ±10 ±2 UNITS LSB LSB LSB mV μV/°C %FS ppm/°C ppm/°C Differential Analog Input (Note 5) TA = 25°C Differential Analog Input (Note 5) Differential Analog Input (Note 6) LSBRMS 2209fa 2 LTC2209 The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4) SYMBOL VIN VIN, CM IIN ISENSE IMODE ILVDS CIN tAP tJITTER CMRR BW-3dB PARAMETER Analog Input Range (AIN+ – AIN–) Analog Input Common Mode Analog Input Leakage Current SENSE Input Leakage Current MODE Pin Pull-Down Current to GND LVDS Pin Pull-Down Current to GND Analog Input Capacitance Sample-and-Hold Aperture Delay Time Sample-and-Hold Acquisition Delay Time Jitter Analog Input Common Mode Rejection Ratio Full Power Bandwidth 1V < (AIN+ = AIN–) ENC– CONDITIONS 3.135V ≤ VDD ≤ 3.465V Differential Input (Note 7) 0V ≤ AIN+, AIN– ≤ VDD 0V ≤ SENSE ≤ VDD l l l ANALOG INPUT MIN 1 –1 –3 TYP 1.5 or 2.25 1.25 MAX 1.5 1 3 UNITS VP-P V μA μA μA μA pF pF ns fs RMS dB MHz 10 10 6.6 1.8 1.0 70 80 700 DYNAMIC ACCURACY SYMBOL SNR PARAMETER Signal-to-Noise Ratio The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. AIN = – 1dBFS. (Note 4) CONDITIONS 5MHz Input (2.25V Range, PGA = 0) 5MHz Input (1.5V Range, PGA = 1) 30MHz Input (2.25V Range, PGA = 0) TA = 25°C 30MHz Input (2.25V Range, PGA = 0) 30MHz Input (1.5V Range, PGA = 1) 70MHz Input (2.25V Range, PGA = 0) 70MHz Input (1.5V Range, PGA = 1) 140MHz Input (2.25V Range, PGA = 0) 140MHz Input (1.5V Range, PGA = 1) TA = 25°C 140MHz Input (1.5V Range, PGA = 1) 250MHz Input (2.25V Range, PGA = 0) 250MHz Input (1.5V Range, PGA =1 ) 73.4 72.9 l MIN TYP 77.1 75 MAX UNITS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc 76 75.6 77 76.8 74.9 76.9 74.7 76.6 74.4 73.9 75 73.5 100 100 l SFDR Spurious Free Dynamic Range 2nd or 3rd Harmonic 5MHz Input (2.25V Range, PGA = 0) 5MHz Input (1.5V Range, PGA = 1) 30MHz Input (2.25V Range, PGA = 0) TA = 25°C 30MHz Input (2.25V Range, PGA = 0) 30MHz Input (1.5V Range, PGA = 1) 70MHz Input (2.25V Range, PGA = 0) 70MHz Input (1.5V Range, PGA = 1) 140MHz Input (2.25V Range, PGA = 0) 140MHz Input (1.5V Range, PGA = 1) TA = 25°C 140MHz Input (1.5V Range, PGA = 1) 250MHz Input (2.25V Range, PGA = 0) 250MHz Input (1.5V Range, PGA = 1) 84 82 l 86 85 95 94 100 88 88 84 88 88 75 84 l 2209fa 3 LTC2209 DYNAMIC ACCURACY SYMBOL SFDR PARAMETER Spurious Free Dynamic Range 4th Harmonic or Higher The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. AIN = –1dBFS unless otherwise noted. (Note 4) CONDITIONS 5MHz Input (2.25V Range, PGA = 0) 5MHz Input (1.5V Range, PGA = 1) 30MHz Input (2.25V Range, PGA = 0) 30MHz Input (1.5V Range, PGA = 1) 70MHz Input (2.25V Range, PGA = 0) 70MHz Input (1.5V Range, PGA = 1) 140MHz Input (2.25V Range, PGA = 0) 140MHz Input (1.5V Range, PGA = 1) 250MHz Input (2.25V Range, PGA = 0) 250MHz Input (1.5V Range, PGA = 1) S/(N+D) Signal-to-Noise Plus Distortion Ratio 5MHz Input (2.25V Range, PGA = 0) 5MHz Input (1.5V Range, PGA = 1) 30MHz Input (2.25V Range, PGA = 0) TA = 25°C 30MHz Input (2.25V Range, PGA = 0) 30MHz Input (1.5V Range, PGA = 1) 70MHz Input (2.25V Range, PGA = 0) 70MHz Input (1.5V Range, PGA = 1) 140MHz Input (2.25V Range, PGA = 0) 140MHz Input (1.5V Range, PGA = 1) TA = 25°C 140MHz Input (1.5V Range, PGA = 1) 250MHz Input (2.25V Range, PGA = 0) 250MHz Input (1.5V Range, PGA = 1) SFDR Spurious Free Dynamic Range at –25dBFS Dither “OFF” 5MHz Input (2.25V Range, PGA = 0) 5MHz Input (1.5V Range, PGA = 1) 30MHz Input (2.25V Range, PGA = 0) 30MHz Input (1.5V Range, PGA = 1) 70MHz Input (2.25V Range, PGA = 0) 70MHz Input (1.5V Range, PGA = 1) 140MHz Input (2.25V Range, PGA = 0) 140MHz Input (1.5V Range, PGA = 1) 250MHz Input (2.25V Range, PGA = 0) 250MHz Input (1.5V Range, PGA = 1) SFDR Spurious Free Dynamic Range at –25dBFS Dither “ON” 5MHz Input (2.25V Range, PGA = 0) 5MHz Input (1.5V Range, PGA = 1) 30MHz Input (2.25V Range, PGA = 0) 30MHz Input (1.5V Range, PGA = 1) 70MHz Input (2.25V Range, PGA = 0) 70MHz Input (1.5V Range, PGA = 1) 140MHz Input (2.25V Range, PGA = 0) 140MHz Input (1.5V Range, PGA = 1) 250MHz Input (2.25V Range, PGA = 0) 250MHz Input (1.5V Range, PGA = 1) l l l l MIN TYP 100 100 MAX UNITS dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS 88 100 100 100 100 87 95 95 90 90 77.1 75 75.9 75.5 77 76.7 74.9 76.8 74.7 l 73 72.7 75.7 74.2 74.2 73.3 72.6 105 105 105 105 105 105 100 100 100 100 115 115 100 115 115 115 115 110 110 105 105 2209fa 4 LTC2209 COMMON MODE BIAS CHARACTERISTICS PARAMETER VCM Output Voltage VCM Output Tempco VCM Line Regulation VCM Output Resistance CONDITIONS IOUT = 0 IOUT = 0 3.135V ≤ VDD ≤ 3.465V 1mA ≤ | IOUT | ≤ 1mA The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4) MIN 1.15 TYP 1.25 +40 1 2 MAX 1.35 UNITS V ppm/°C mV/ V Ω DIGITAL INPUTS AND DIGITAL OUTPUTS SYMBOL VID VICM RIN CIN VIH VIL IIN CIN OVDD = 3.3V VOH High Level Output Voltage VDD = 3.3V IO = –10μA IO = – 200μA VDD = 3.3V IO = 160μA IO = 1.6mA VOUT = 0V VOUT = 3.3V PARAMETER Differential Input Voltage Common Mode Input Voltage Input Resistance Input Capacitance High Level Input Voltage Low Level Input Voltage Digital Input Current Digital Input Capacitance CONDITIONS (Note 7) Internally Set Externally Set (Note 7) (See Figure 2) (Note 7) VDD = 3.3V VDD = 3.3V VIN = 0V to VDD (Note 7) ENCODE INPUTS (ENC+, ENC–) The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4) MIN l TYP MAX UNITS V 0.2 1.6 1.2 6 3 3.0 V V kΩ pF V LOGIC INPUTS (DITH, PGA, SHDN, RAND) l l l 2 0.8 ±10 1.5 V μA pF LOGIC OUTPUTS (CMOS MODE) l 3.1 3.299 3.29 0.01 0.10 –50 50 2.49 0.1 1.79 0.1 V V V V mA mA V V V V VOL Low Level Output Voltage l 0.4 ISOURCE ISINK OVDD = 2.5V VOH VOL OVDD = 1.8V VOH VOL STANDARD LVDS VOD VOS LOW POWER LVDS VOD VOS Output Source Current Output Sink Current High Level Output Voltage Low Level Output Voltage High Level Output Voltage Low Level Output Voltage VDD = 3.3V, IO = – 200μA VDD = 3.3V, IO = 1.60mA VDD = 3.3V, IO = – 200μA VDD = 3.3V, IO = 1.60mA LOGIC OUTPUTS (LVDS MODE) Differential Output Voltage Output Common Mode Voltage Differential Output Voltage Output Common Mode Voltage 100Ω Differential Load 100Ω Differential Load 100Ω Differential Load 100Ω Differential Load l l l l 247 1.125 125 1.125 350 1.2 175 1.2 454 1.375 250 1.375 mV V mV V 2209fa 5 LTC2209 POWER REQUIREMENTS SYMBOL VDD PSHDN OVDD IVDD IOVDD PDIS OVDD IVDD IOVDD PDIS OVDD IVDD PDIS PARAMETER Analog Supply Voltage Shutdown Power Output Supply Voltage Analog Supply Current Output Supply Current Power Dissipation Output Supply Voltage Analog Supply Current Output Supply Current Power Dissipation Output Supply Voltage Analog Supply Current Power Dissipation (Note 8) (Note 8) The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. AIN = –1dBFS. (Note 4) CONDITIONS (Note 8) SHDN = VDD (Note 8) l l l l l l l l l l l l MIN 3.135 TYP 3.3 0.2 MAX 3.465 UNITS V mW STANDARD LVDS OUTPUT MODE 3 3.3 440 74 1647 3 3.3 440 31 1505 0.5 440 1450 3.6 500 90 1950 3.6 500 50 1752 3.6 500 1650 V mA mA mW V mA mA mW V mA mW LOW POWER LVDS OUTPUT MODE CMOS OUTPUT MODE The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4) SYMBOL fS tL tH tAP tD tC tSKEW tRISE tFALL Data Latency tD tC tSKEW Data Latency PARAMETER Sampling Frequency ENC Low Time ENC High Time Sample-and-Hold Aperture Delay ENC to DATA Delay ENC to CLKOUT Delay DATA to CLKOUT Skew Output Rise Time Output Fall Time Data Latency ENC to DATA Delay ENC to CLKOUT Delay DATA to CLKOUT Skew Data Latency (Note 7) (Note 7) (tC-tD) (Note 7) Full Rate CMOS Demuxed l l l TIMING CHARACTERISTICS CONDITIONS (Note 8) Duty Cycle Stabilizer Off (Note 7) Duty Cycle Stabilizer On (Note 7) Duty Cycle Stabilizer Off (Note 7) Duty Cycle Stabilizer On (Note 7) l l l l l MIN 1 2.97 2.1 2.97 2.1 TYP 3.125 3.125 3.125 3.125 1 MAX 160 1000 1000 1000 1000 UNITS MHz ns ns ns ns ns LVDS OUTPUT MODE (STANDARD and LOW POWER) (Note 7) (Note 7) (tC-tD) (Note 7) l l l 1.3 1.3 –0.6 2.5 2.5 0 0.5 0.5 7 3.8 3.8 0.6 ns ns ns ns ns Cycles CMOS OUTPUT MODE 1.3 1.3 –0.6 2.7 2.7 0 7 7 4.0 4.0 0.6 ns ns ns Cycles Cycles 2209fa 6 LTC2209 ELECTRICAL CHARACTERISTICS Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: All voltage values are with respect to GND, with GND and OGND shorted (unless otherwise noted). Note 3: When these pin voltages are taken below GND or above VDD, they will be clamped by internal diodes. This product can handle input currents of greater than 100mA below GND or above VDD without latchup. Note 4: VDD = 3.3V, fSAMPLE = 160MHz, LVDS outputs, differential ENC+/ ENC– = 2VP-P sine wave with 1.6V common mode, input range = 2.25VP-P with differential drive (PGA = 0), unless otherwise specified. Note 5: Integral nonlinearity is defined as the deviation of a code from a “best fit straight line” to the transfer curve. The deviation is measured from the center of the quantization band. Note 6: Offset error is the offset voltage measured from –1/2LSB when the output code flickers between 0000 0000 0000 0000 and 1111 1111 1111 1111 in 2’s complement output mode. Note 7: Guaranteed by design, not subject to test. Note 8: Recommended operating conditions. TIMING DIAGRAM LVDS Output Mode Timing All Outputs are Differential and Have LVDS Levels tAP ANALOG INPUT N+1 N+2 tH tL ENC– ENC+ tD D0-D15, OF tC N–7 N–6 N–5 N–4 N–3 N+3 N+4 N CLKOUT+ CLKOUT – 2209 TD01 2209fa 7 LTC2209 TIMING DIAGRAMS Full-Rate CMOS Output Mode Timing All Outputs are Single-Ended and Have CMOS Levels tAP ANALOG INPUT N+1 N+2 tH tL ENC– ENC+ tD DA0-DA15, OFA tC CLKOUTA CLKOUTB N–7 N–6 N–5 N–4 N–3 N+3 N+4 N DB0-DB15, OFB HIGH IMPEDANCE 2209 TD02 Demultiplexed CMOS Output Mode Timing All Outputs are Single-Ended and Have CMOS Levels tAP ANALOG INPUT N+1 N+2 N+3 N+4 N tH tL ENC – ENC+ tD DA0-DA15, OFA tD DB0-DB15, OFB tC CLKOUTA CLKOUTB 2209 TD03 N–8 N–6 N–4 N–7 N–5 N–3 2209fa 8 LTC2209 TYPICAL PERFORMANCE CHARACTERISTICS Integral Nonlinearity (INL) vs Output Code 2.0 1.5 1.0 INL ERROR (LSB) 0.5 0 –0.5 –1.0 –1.5 –2.0 0 16384 32768 OUTPUT CODE 49152 65536 2209 G01 Differential Nonlinearity (DNL) vs Output Code 1.0 0.8 0.6 DNL ERROR (LSB) 0.4 COUNT 0.2 0 –0.2 –0.4 –0.6 –0.8 –1.0 0 16384 49152 32768 OUTPUT CODE 65536 2209 G02 AC Grounded Input Histogram 35000 28000 21000 14000 7000 0 32797 32807 32817 OUTPUT CODE 32827 2209 G03 128k Point FFT, fIN = 4.9MHz, –1dBFS, PGA = 0 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 0 10 20 30 40 50 60 FREQUENCY (MHz) 70 80 2209 G04 64k Point FFT, fIN = 15.1MHz, –1dBFS, PGA = 0 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 0 10 20 30 40 50 60 FREQUENCY (MHz) 70 80 2209 G05 64k Point FFT, fIN = 15.1MHz, –20dBFS, PGA = 0, Dither “Off” 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 0 10 20 30 40 50 60 FREQUENCY (MHz) 70 80 2209 G06 AMPLITUDE (dBFS) AMPLITUDE (dBFS) 64k Point FFT, fIN = 15.1MHz, –20dBFS, PGA = 0, Dither “On” 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 0 10 20 30 40 50 60 FREQUENCY (MHz) 70 80 2209 G07 64k Point 2-Tone FFT, fIN = 21.14MHz and 14.25MHz, –7dBFS, PGA = 0 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 0 10 20 30 40 50 60 FREQUENCY (MHz) 70 80 2209 G08 AMPLITUDE (dBFS) 64k Point 2-Tone FFT, fIN = 20.2MHz and 25.3MHz, –25dBFS, PGA = 0 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 0 10 20 30 40 50 60 FREQUENCY (MHz) 70 80 2209 G09 AMPLITUDE (dBFS) AMPLITUDE (dBFS) AMPLITUDE (dBFS) 2209fa 9 LTC2209 TYPICAL PERFORMANCE CHARACTERISTICS SFDR vs Input Level, fIN = 15MHz, PGA = 0, Dither “Off” 130 120 110 100 90 80 70 60 50 40 30 20 10 0 –80 –70 –60 –50 –40 –30 –20 –10 0 INPUT LEVEL (dBFS) 2209 G10 SFDR vs Input Level, fIN = 15MHz, PGA = 0, Dither “On” 130 120 110 100 90 80 70 60 50 40 30 20 10 0 –80 –70 –60 –50 –40 –30 –20 –10 0 INPUT LEVEL (dBFS) 2209 G11 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 64k Point FFT, fIN = 30.1MHz, –1dBFS, PGA = 0 SFDR (dBc AND dBFS) SFDR (dBc AND dBFS) AMPLITUDE (dBFS) 0 10 20 30 40 50 60 FREQUENCY (MHz) 70 80 2209 G12 128k Point FFT, fIN = 30.1MHz, –25dBFS, PGA = 0, Dither “On” 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 64k Point FFT, fIN = 70.1MHz, –1dBFS, PGA = 0 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 64k Point FFT, fIN = 70.1MHz, –10dBFS, PGA = 0 AMPLITUDE (dBFS) AMPLITUDE (dBFS) 0 10 20 30 40 50 60 FREQUENCY (MHz) 70 80 0 10 20 30 40 50 60 FREQUENCY (MHz) 70 80 AMPLITUDE (dBFS) 0 10 20 2209 G14 30 40 50 60 FREQUENCY (MHz) 70 80 2209 G13 2209 G15 64k Point FFT, fIN = 70.1MHz, –20dBFS, PGA = 0 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 128k Point FFT, fIN = 70.1MHz, –25dBFS, PGA = 0, Dither “On” SFDR vs Input Level, fIN = 70.2MHz, PGA = 0, Dither “Off” 130 120 110 100 90 80 70 60 50 40 30 20 10 0 –80 –70 –60 –50 –40 –30 –20 –10 INPUT LEVEL (dBFS) 0 10 20 30 40 50 60 FREQUENCY (MHz) 70 80 0 10 20 30 40 50 60 FREQUENCY (MHz) 70 80 SFDR (dBc AND dBFS) AMPLITUDE (dBFS) AMPLITUDE (dBFS) 0 2209 G16 2209 G17 2209 G18 2209fa 10 LTC2209 TYPICAL PERFORMANCE CHARACTERISTICS SFDR vs Input Level, fIN = 70.2MHz, PGA = 0, Dither “On” 130 120 110 100 90 80 70 60 50 40 30 20 10 0 –80 –70 –60 –50 –40 –30 –20 –10 INPUT LEVEL (dBFS) 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 64k Point 2-Tone FFT, fIN = 70.25MHz and 74.3MHz, –7dBFS, PGA = 0 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 64k Point 2-Tone FFT, fIN = 70.25MHz and 74.3MHz, –15dBFS, PGA = 0 SFDR (dBc AND dBFS) AMPLITUDE (dBFS) 0 0 10 20 2209 G19 30 40 50 60 FREQUENCY (MHz) 70 80 AMPLITUDE (dBFS) 0 10 20 30 40 50 60 FREQUENCY (MHz) 70 80 2209 G20 2209 G21 64k Point 2-Tone FFT, fIN = 70.25MHz and 74.3MHz, –25dBFS, PGA = 0 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 64k Point FFT, fIN = 140.2 MHz, –1dBFS, PGA = 1 SFDR vs Input Level, fIN = 140.2MHz, PGA = 1, Dither “Off” 130 120 110 100 90 80 70 60 50 40 30 20 10 0 –80 –70 –60 –50 –40 –30 –20 –10 INPUT LEVEL (dBFS) SFDR (dBc AND dBFS) AMPLITUDE (dBFS) AMPLITUDE (dBFS) 0 10 20 30 40 50 60 FREQUENCY (MHz) 70 80 0 10 20 30 40 50 60 FREQUENCY (MHz) 70 80 0 2209 G22 2209 G23 2209 G24 SFDR vs Input Level, fIN = 140.2MHz, PGA = 1, Dither “On” 130 120 110 100 90 80 70 60 50 40 30 20 10 0 –80 –70 –60 –50 –40 –30 –20 –10 INPUT LEVEL (dBFS) 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 64k Point FFT, fIN = 170.1MHz, –1dBFS, PGA = 1 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 64k Point FFT, fIN = 250.1MHz, –1dBFS, PGA = 1 SFDR (dBc AND dBFS) AMPLITUDE (dBFS) 0 0 10 20 2209 G25 30 40 50 60 FREQUENCY (MHz) 70 80 AMPLITUDE (dBFS) 0 10 20 30 40 50 60 FREQUENCY (MHz) 70 80 2209 G26 2209 G27 2209fa 11 LTC2209 TYPICAL PERFORMANCE CHARACTERISTICS 64k Point FFT, fIN = 250.1MHz, –10dBFS, PGA = 1, Dither “On” 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 64k Point FFT, fIN = 250.1MHz, –20dBFS, PGA = 1 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 64k Point FFT, fIN = 380MHz, –1dBFS, PGA = 1 AMPLITUDE (dBFS) AMPLITUDE (dBFS) 0 10 20 30 40 50 60 FREQUENCY (MHz) 70 80 0 10 20 30 40 50 60 FREQUENCY (MHz) 70 80 AMPLITUDE (dBFS) 0 10 20 30 40 50 60 FREQUENCY (MHz) 70 80 2209 G28 2209 G29 2209 G30 64k Point FFT, fIN = 380MHz, –10dBFS, PGA = 1 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 105 100 95 SFDR (dBc) SFDR (HD2 and HD3) vs Input Frequency 78 77 76 PGA = 1 SNR (dBFS) 75 74 73 72 71 70 0 100 400 300 INPUT FREQUENCY (MHz) 200 500 2209 G32 SNR vs Input Frequency AMPLITUDE (dBFS) 90 85 80 PGA = 0 PGA = 1 PGA = 0 75 70 0 10 20 30 40 50 60 FREQUENCY (MHz) 70 80 65 0 100 2209 G31 200 400 300 INPUT FREQUENCY (MHz) 500 2209 G33 SNR and SFDR vs Sample Rate, fIN = 5.1MHz 115 110 SNR AND SFDR (dBFS) 105 100 95 90 85 80 75 70 0 40 120 160 SAMPLE RATE (Msps) 80 200 2209 G34 SNR and SFDR vs Supply Voltage (VDD), fIN = 5.1MHz 110 105 SNR AND SFDR (dBFS) 100 95 90 UPPER LIMIT 85 80 75 70 2.8 3.0 3.2 3.4 SUPPLY VOLTAGE (V) 3.6 2209 G35 IVDD vs Sample Rate, 5MHz Sine, –1dBFS 500 475 VDD = 3.3V SFDR LIMIT LOWER LIMIT SFDR IVDD (mA) 450 VDD = 3.47V 425 VDD = 3.13V 400 SNR SNR 375 350 0 50 100 150 SAMPLE RATE (Msps) 200 2209 G36 2209fa 12 LTC2209 TYPICAL PERFORMANCE CHARACTERISTICS SNR and SFDR vs Duty Cycle 110 1.005 1.004 NORMALIZED FULL SCALE 90 SFDR AND SNR (dBFS) 1.003 1.002 1.001 1.000 0.999 0.998 0.997 0.996 60 70 2209 G37 Normalized Full Scale vs Temperature, Internal Reference, 5 Units 5 4 3 OFFSET VOLTAGE (mV) –20 0 20 40 TEMPERATURE (°C) 60 80 2209 G38 Input Offset Voltage vs Temperature, 5 Units 2 1 0 –1 –2 –3 –4 –5 –40 –20 0 20 40 TEMPERATURE (°C) 60 80 2209 G39 70 50 SNR DCS OFF SNR DCS ON SFDR DCS OFF SFDR DCS ON 30 40 50 DUTY CYCLE (%) 30 10 0.995 –40 SFDR vs Analog Input Common Mode Voltage, 5MHz and 70MHz, –1dBFS, PGA = 0 110 105 100 95 SFDR (dBc) 90 85 80 75 70 65 60 0.50 0.75 1.00 1.25 1.50 1.75 2.00 ANALOG INPUT COMMON MODE VOLTAGE (V) 2209 G40 Mid-Scale Settling After Wake-Up from Shutdown or Starting Encode Clock 1.0 5 4 FULL-SCALE ERROR (%) 0 500 TIME AFTER WAKE-UP OR CLOCK START (μs) 2209 G41 Full-Scale Settling After Wake-Up from Shutdown or Starting Encode Clock 5MHz FULL-SCALE ERROR (%) 0.8 0.6 0.4 0.2 0 –0.2 –0.4 –0.6 –0.8 –1.0 250 3 2 1 0 –1 –2 –3 –4 –5 0 500 1000 TIME FROM WAKE-UP OR CLOCK START (μs) 2209 G42 70MHz 2209fa 13 LTC2209 PIN FUNCTIONS For CMOS Mode. Full Rate or Demultiplexed SENSE (Pin 1): Reference Mode Select and External Reference Input. Tie SENSE to VDD to select the internal 2.5V bandgap reference. An external reference of 2.5V or 1.25V may be used; both reference values will set a full scale ADC range of 2.25V (PGA = 0). GND (Pins 2, 4, 7, 10, 11, 14, 18): ADC Power Ground. VCM (Pin 3): 1.25V Output. Optimum voltage for input common mode. Must be bypassed to ground with a minimum of 2.2μF Ceramic chip capacitors are recommended. . VDD (Pins 5, 6, 15, 16, 17): 3.3V Analog Supply Pin. Bypass to GND with 1μF ceramic chip capacitors. AIN+ (Pin 8): Positive Differential Analog Input. AIN– (Pin 9): Negative Differential Analog Input. (Pin 12): Positive Differential Encode Input. The sampled analog input is held on the rising edge of ENC+. Internally biased to 1.6V through a 6.2kΩ resistor. Output data can be latched on the rising edge of ENC+. ENC– (Pin 13): Negative Differential Encode Input. The sampled analog input is held on the falling edge of ENC –. Internally biased to 1.6V through a 6.2kΩ resistor. Bypass to ground with a 0.1μF capacitor for a single-ended Encode signal. SHDN (Pin 19): Power Shutdown Pin. SHDN = low results in normal operation. SHDN = high results in powered down analog circuitry and the digital outputs are placed in a high impedance state. DITH (Pin 20): Internal Dither Enable Pin. DITH = low disables internal dither. DITH = high enables internal dither. Refer to Internal Dither section of this data sheet for details on dither operation. DB0-DB15 (Pins 21-30 and 33-38): Digital Outputs, B Bus. DB15 is the MSB. Active in demultiplexed mode. The B bus is in high impedance state in full rate CMOS. OGND (Pins 31 and 50): Output Driver Ground. OVDD (Pins 32 and 49): Positive Supply for the Output Drivers. Bypass to ground with 1μF capacitor. OFB (Pin 39): Over/Under Flow Digital Output for the B Bus. OFB is high when an over or under flow has occurred on the B bus. At high impedance state in full rate CMOS mode. ENC+ CLKOUTB (Pin 40): Data Valid Output. CLKOUTB will toggle at the sample rate in full rate CMOS mode or at 1/2 the sample rate in demultiplexed mode. Latch the data on the falling edge of CLKOUTB. CLKOUTA (Pin 41): Inverted Data Valid Output. CLKOUTA will toggle at the sample rate in full rate CMOS mode or at 1/2 the sample rate in demultiplexed mode. Latch the data on the rising edge of CLKOUTA. DA0-DA15 (Pins 42-48 and 51-59): Digital Outputs, A Bus. DA15 is the MSB. Output bus for full rate CMOS mode and demultiplexed mode. OFA (Pin 60): Over/Under Flow Digital Output for the A Bus. OFA is high when an over or under flow has occurred on the A bus. LVDS (Pin 61): Data Output Mode Select Pin. Connecting LVDS to 0V selects full rate CMOS mode. Connecting LVDS to 1/3VDD selects demultiplexed CMOS mode. Connecting LVDS to 2/3VDD selects Low Power LVDS mode. Connecting LVDS to VDD selects Standard LVDS mode. MODE (Pin 62): Output Format and Clock Duty Cycle Stabilizer Selection Pin. Connecting MODE to 0V selects offset binary output format and disables the clock duty cycle stabilizer. Connecting MODE to 1/3VDD selects offset binary output format and enables the clock duty cycle stabilizer. Connecting MODE to 2/3VDD selects 2’s complement output format and enables the clock duty cycle stabilizer. Connecting MODE to VDD selects 2’s complement output format and disables the clock duty cycle stabilizer. RAND (Pin 63): Digital Output Randomization Selection Pin. RAND low results in normal operation. RAND high selects D1-D15 to be EXCLUSIVE-ORed with D0 (the LSB). The output can be decoded by again applying an XOR operation between the LSB and all other bits. This mode of operation reduces the effects of digital output interference. PGA (Pin 64): Programmable Gain Amplifier Control Pin. Low selects a front-end gain of 1, input range of 2.25VP-P High . selects a front-end gain of 1.5, input range of 1.5VP-P . GND (Exposed Pad): ADC Power Ground. The exposed pad on the bottom of the package must be soldered to ground. 2209fa 14 LTC2209 PIN FUNCTIONS For LVDS Mode. STANDARD or LOW POWER SENSE (Pin 1): Reference Mode Select and External Reference Input. Tie SENSE to VDD to select the internal 2.5V bandgap reference. An external reference of 2.5V or 1.25V may be used; both reference values will set a full scale ADC range of 2.25V (PGA = 0). GND (Pins 2, 4, 7, 10, 11, 14, 18): ADC Power Ground. VCM (Pin 3): 1.25V Output. Optimum voltage for input common mode. Must be bypassed to ground with a minimum of 2.2μF Ceramic chip capacitors are recommended. . VDD (Pins 5, 6, 15, 16, 17): 3.3V Analog Supply Pin. Bypass to GND with 1μF ceramic chip capacitors. AIN + (Pin 8): Positive Differential Analog Input. AIN – (Pin 9): Negative Differential Analog Input. ENC + (Pin 12): Positive Differential Encode Input. The sampled analog input is held on the rising edge of ENC+. Internally biased to 1.6V through a 6.2kΩ resistor. Output data can be latched on the rising edge of ENC+. ENC – (Pin 13): Negative Differential Encode Input. The sampled analog input is held on the falling edge of ENC –. Internally biased to 1.6V through a 6.2kΩ resistor. Bypass to ground with a 0.1μF capacitor for a single-ended Encode signal. SHDN (Pin 19): Power Shutdown Pin. SHDN = low results in normal operation. SHDN = high results in powered down analog circuitry and the digital outputs are set in high impedance state. DITH (Pin 20): Internal Dither Enable Pin. DITH = low disables internal dither. DITH = high enables internal dither. Refer to Internal Dither section of the data sheet for details on dither operation. D0–/D0+ to D15–/D15+ (Pins 21-30, 33-38, 41-48 and 51-58): LVDS Digital Outputs. All LVDS outputs require differential 100Ω termination resistors at the LVDS receiver. D15+/D15– is the MSB. OGND (Pins 31 and 50): Output Driver Ground. OVDD (Pins 32 and 49): Positive Supply for the Output Drivers. Bypass to ground with 0.1μF capacitor. CLKOUT–/CLKOUT + (Pins 39 and 40): LVDS Data Valid 0utput. Latch data on the rising edge of CLKOUT +, falling edge of CLKOUT –. OF–/OF+ (Pins 59 and 60): Over/Under Flow Digital Output OF is high when an over or under flow has occurred. LVDS (Pin 61): Data Output Mode Select Pin. Connecting LVDS to 0V selects full rate CMOS mode. Connecting LVDS to 1/3VDD selects demultiplexed CMOS mode. Connecting LVDS to 2/3VDD selects Low Power LVDS mode. Connecting LVDS to VDD selects Standard LVDS mode. MODE (Pin 62): Output Format and Clock Duty Cycle Stabilizer Selection Pin. Connecting MODE to 0V selects offset binary output format and disables the clock duty cycle stabilizer. Connecting MODE to 1/3VDD selects offset binary output format and enables the clock duty cycle stabilizer. Connecting MODE to 2/3VDD selects 2’s complement output format and enables the clock duty cycle stabilizer. Connecting MODE to VDD selects 2’s complement output format and disables the clock duty cycle stabilizer. RAND (Pin 63): Digital Output Randomization Selection Pin. RAND low results in normal operation. RAND high selects D1-D15 to be EXCLUSIVE-ORed with D0 (the LSB). The output can be decoded by again applying an XOR operation between the LSB and all other bits. The mode of operation reduces the effects of digital output interference. PGA (Pin 64): Programmable Gain Amplifier Control Pin. Low . selects a front-end gain of 1, input range of 2.25VP-P High selects a front-end gain of 1.5, input range of 1.5VP-P. GND (Exposed Pad Pin 65): ADC Power Ground. The exposed pad on the bottom of the package must be soldered to ground. 2209fa 15 LTC2209 BLOCK DIAGRAM AIN+ INPUT S/H FIRST PIPELINED ADC STAGE SECOND PIPELINED ADC STAGE THIRD PIPELINED ADC STAGE FOURTH PIPELINED ADC STAGE FIFTH PIPELINED ADC STAGE GND VDD AIN– DITHER SIGNAL GENERATOR CORRECTION LOGIC AND SHIFT REGISTER RANGE SELECT SENSE PGA VCM ADC REFERENCE ADC CLOCKS OVDD CLKOUT+ CLKOUT– OF+ OF– D15+ D15– D0+ D0– BUFFER VOLTAGE REFERENCE DIFFERENTIAL INPUT LOW JITTER CLOCK DRIVER CONTROL LOGIC OUTPUT DRIVERS • • • OGND ENC+ ENC– SHDN PGA RAND M0DE LVDS DITH 2209 F01 Figure 1. Functional Block Diagram 2209fa 16 LTC2209 DEFINITIONS DYNAMIC PERFORMANCE Signal-to-Noise Plus Distortion Ratio The signal-to-noise plus distortion ratio [S/(N+D)] is the ratio between the RMS amplitude of the fundamental input frequency and the RMS amplitude of all other frequency components at the ADC output. The output is band limited to frequencies above DC to below half the sampling frequency. Signal-to-Noise Ratio The signal-to-noise (SNR) is the ratio between the RMS amplitude of the fundamental input frequency and the RMS amplitude of all other frequency components, except the first five harmonics. Total Harmonic Distortion Total harmonic distortion is the ratio of the RMS sum of all harmonics of the input signal to the fundamental itself. The out-of-band harmonics alias into the frequency band between DC and half the sampling frequency. THD is expressed as: THD = 20Log If two pure sine waves of frequencies fa and fb are applied to the ADC input, nonlinearities in the ADC transfer function can create distortion products at the sum and difference frequencies of mfa ± nfb, where m and n = 0, 1, 2, 3, etc. For example, the 3rd order IMD terms include (2fa + fb), (fa + 2fb), (2fa - fb) and (fa - 2fb). The 3rd order IMD is defined as the ration of the RMS value of either input tone to the RMS value of the largest 3rd order IMD product. Spurious Free Dynamic Range (SFDR) The ratio of the RMS input signal amplitude to the RMS value of the peak spurious spectral component expressed in dBc. SFDR may also be calculated relative to full scale and expressed in dBFS. Full Power Bandwidth The Full Power bandwidth is that input frequency at which the amplitude of the reconstructed fundamental is reduced by 3dB for a full scale input signal. Aperture Delay Time The time from when a rising ENC + equals the ENC– voltage to the instant that the input signal is held by the sampleand-hold circuit. Aperture Delay Jitter The variation in the aperture delay time from conversion to conversion. This random variation will result in noise when sampling an AC input. The signal to noise ratio due to the jitter alone will be: SNRJITTER = – 20log (2π • fIN • tJITTER) (V 2 2 + V3 + V4 + ...VN 2 2 2 )/V 1 where V1 is the RMS amplitude of the fundamental frequency and V2 through VN are the amplitudes of the second through nth harmonics. Intermodulation Distortion If the ADC input signal consists of more than one spectral component, the ADC transfer function nonlinearity can produce intermodulation distortion (IMD) in addition to THD. IMD is the change in one sinusoidal input caused by the presence of another sinusoidal input at a different frequency. 2209fa 17 LTC2209 APPLICATIONS INFORMATION CONVERTER OPERATION The LTC2209 is a CMOS pipelined multistep converter with a front-end PGA. As shown in Figure 1, the converter has five pipelined ADC stages; a sampled analog input will result in a digitized value seven cycles later (see the Timing Diagram section). The analog input is differential for improved common mode noise immunity and to maximize the input range. Additionally, the differential input drive will reduce even order harmonics of the sample and hold circuit. The encode input is also differential for improved common mode noise immunity. The LTC2209 has two phases of operation, determined by the state of the differential ENC+/ENC – input pins. For brevity, the text will refer to ENC+ greater than ENC – as ENC high and ENC+ less than ENC – as ENC low. Each pipelined stage shown in Figure 1 contains an ADC, a reconstruction DAC and an interstage amplifier. In operation, the ADC quantizes the input to the stage and the quantized value is subtracted from the input by the DAC to produce a residue. The residue is amplified and output by the residue amplifier. Successive stages operate out of phase so that when odd stages are outputting their residue, the even stages are acquiring that residue and vice versa. When ENC is low, the analog input is sampled differentially directly onto the input sample-and-hold capacitors, inside the “input S/H” shown in the block diagram. At the instant that ENC transitions from low to high, the voltage on the sample capacitors is held. While ENC is high, the held input voltage is buffered by the S/H amplifier which drives the first pipelined ADC stage. The first stage acquires the output of the S/H amplifier during the high phase of ENC. When ENC goes back low, the first stage produces its residue which is acquired by the second stage. At the same time, the input S/H goes back to acquiring the analog input. When ENC goes high, the second stage produces its residue which is acquired by the third stage. An identical process is repeated for the third and fourth stages, resulting in a fourth stage residue that is sent to the fifth stage for final evaluation. Each ADC stage following the first has additional range to accommodate flash and amplifier offset errors. Results from all of the ADC stages are digitally delayed such that the results can be properly combined in the correction logic before being sent to the output buffer. SAMPLE/HOLD OPERATION AND INPUT DRIVE Sample/Hold Operation Figure 2 shows an equivalent circuit for the LTC2209 CMOS differential sample and hold. The differential analog inputs are sampled directly onto sampling capacitors (CSAMPLE) through NMOS transistors. The capacitors shown attached to each input (CPARASITIC) are the summation of all other capacitance associated with each input. During the sample phase when ENC is low, the NMOS transistors connect the analog inputs to the sampling capacitors and they charge to, and track the differential input voltage. When ENC transitions from low to high, the sampled input voltage is held on the sampling capacitors. During the hold phase when ENC is high, the sampling capacitors are disconnected from the input and the held voltage is passed to the ADC core for processing. As ENC transitions from high to low, the inputs are reconnected to the sampling capacitors to acquire a new sample. Since the sampling capacitors still hold the previous sample, a charging glitch proportional to the change in voltage between samples will be seen at this time. If the change between the last sample and the new sample is small, the charging glitch seen at the input will be small. If the LTC2209 VDD RPARASITIC 3Ω AIN+ VDD RPARASITIC 3Ω AIN– CPARASITIC 1.8pF VDD CPARASITIC 1.8pF RON 20Ω CSAMPLE 4.6pF RON 20Ω CSAMPLE 4.6pF 1.6V 6k ENC+ ENC– 6k 1.6V 2209 F02 Figure 2. Equivalent Input Circuit 2209fa 18 LTC2209 APPLICATIONS INFORMATION input change is large, such as the change seen with input frequencies near Nyquist, then a larger charging glitch will be seen. Common Mode Bias The ADC sample-and-hold circuit requires differential drive to achieve specified performance. Each input should swing ±0.5625V for the 2.25V range (PGA = 0) or ±0.375V for the 1.5V range (PGA = 1), around a common mode voltage of 1.25V. The VCM output pin (Pin 3) is designed to provide the common mode bias level. VCM can be tied directly to the center tap of a transformer to set the DC input level or as a reference level to an op amp differential driver circuit. The VCM pin must be bypassed to ground close to the ADC with 2.2μF or greater. Input Drive Impedance As with all high performance, high speed ADCs the dynamic performance of the LTC2209 can be influenced by the input drive circuitry, particularly the second and third harmonics. Source impedance and input reactance can influence SFDR. At the falling edge of ENC the sample and hold circuit will connect the 4.6pF sampling capacitor to the input pin and start the sampling period. The sampling period ends when ENC rises, holding the sampled input on the sampling capacitor. Ideally, the input circuitry should be fast enough to fully charge the sampling capacitor during the sampling period 1/(2F encode); however, this is not always possible and the incomplete settling may degrade the SFDR. The sampling glitch has been designed to be as linear as possible to minimize the effects of incomplete settling. INPUT DRIVE CIRCUITS Input Filtering A first order RC low pass filter at the input of the ADC can serve two functions: limit the noise from input circuitry and provide isolation from ADC S/H switching. The LTC2209 has a very broadband S/H circuit, DC to 700MHz; it can be used in a wide range of applications; therefore, it is not possible to provide a single recommended RC filter. Figures 3, 4a and 4b show three examples of input RC filtering at three ranges of input frequencies. In general it is desirable to make the capacitors as large as can be tolerated—this will help suppress random noise as well as noise coupled from the digital circuitry. The LTC2209 does not require any input filter to achieve data sheet specifications; however, no filtering will put more stringent noise requirements on the input drive circuitry. Transformer Coupled Circuits Figure 3 shows the LTC2209 being driven by an RF transformer with a center-tapped secondary. The secondary center tap is DC biased with VCM, setting the ADC input signal at its optimum DC level. Figure 3 shows a 1:1 turns ratio transformer. Other turns ratios can be used; however, as the turns ratio increases so does the impedance seen by the ADC. Source impedance greater than 50Ω can reduce the input bandwidth and increase high frequency distortion. A disadvantage of using a transformer is the loss of low frequency response. Most small RF transformers have poor performance at frequencies below 1MHz. Center-tapped transformers provide a convenient means of DC biasing the secondary; however, they often show poor balance at high input frequencies, resulting in large 2nd order harmonics. VCM 5Ω 10Ω T1 8.2pF 35Ω 8.2pF 0.1μF 10Ω T1 = MA/COM ETC1-1T RESISTORS, CAPACITORS ARE 0402 PACKAGE SIZE EXCEPT 2.2μF 35Ω 5Ω AIN– 8.2pF 2209 F03 2.2μF 5Ω AIN+ LTC2209 Figure 3. Single-Ended to Differential Conversion Using a Transformer. Recommended for Input Frequencies from 5MHz to 100MHz 2209fa 19 LTC2209 APPLICATIONS INFORMATION Figure 4a shows transformer coupling using a transmission line balun transformer. This type of transformer has much better high frequency response and balance than flux coupled center tap transformers. Coupling capacitors are added at the ground and input primary terminals to allow the secondary terminals to be biased at 1.25V. Figure 4b shows the same circuit with components suitable for higher input frequencies. VCM 2.2μF 0.1μF ANALOG INPUT 25Ω 0.1μF T1 1:1 10Ω 0.1μF 4.7pF 5Ω AIN+ 4.7pF LTC2209 AMPLIFIER = LTC6600-20, LTC1993, ETC. 12pF Reference Operation Figure 6 shows the LTC2209 reference circuitry consisting of a 2.5V bandgap reference, a programmable gain amplifier and control circuit. The LTC2209 has three modes of VCM HIGH SPEED DIFFERENTIAL AMPLIFIER ANALOG INPUT 2.2μF 25Ω 12pF AIN+ LTC2209 + CM + – 25Ω – AIN– 2209 F05 25Ω 10Ω 5Ω AIN– 4.7pF 2209 F04a Figure 5. DC Coupled Input with Differential Amplifier T1 = MA/COM ETC1-1-13 RESISTORS, CAPACITORS ARE 0402 PACKAGE SIZE EXCEPT 2.2μF Figure 4a. Using a Transmission Line Balun Transformer. Recommended for Input Frequencies from 100MHz to 250MHz VCM 2.2μF 0.1μF ANALOG INPUT 25Ω 0.1μF T1 1:1 0.1μF 5Ω 2.2pF AIN+ LTC2209 25Ω 5Ω 2.2pF AIN– 2209 F04b reference operation: Internal Reference, 1.25V external reference or 2.5V external reference. To use the internal reference, tie the SENSE pin to VDD. To use an external reference, simply apply either a 1.25V or 2.5V reference voltage to the SENSE input pin. Both 1.25V and 2.5V applied to SENSE will result in a full scale range of 2.25VP-P (PGA = 0). A 1.25V output, VCM is provided for a common mode bias for input drive circuitry. An external bypass capacitor is required for the VCM output. This provides a high frequency low impedance path to ground for internal and external circuitry. This is also the compensation capacitor for the reference; it will not be stable without this capacitor. The minimum value required for stability is 2.2μF . RANGE SELECT AND GAIN CONTROL SENSE PGA T1 = MA/COM ETC1-1-13 RESISTORS, CAPACITORS ARE 0402 PACKAGE SIZE EXCEPT 2.2μF Figure 4b. Using a Transmission Line Balun Transformer. Recommended for Input Frequencies from 250MHz to 500MHz Direct Coupled Circuits Figure 5 demonstrates the use of a differential amplifier to convert a single ended input signal into a differential input signal. The advantage of this method is that it provides low frequency input response; however, the limited gain bandwidth of any op amp or closed-loop amplifier will degrade the ADC SFDR at high input frequencies. Additionally, wideband op amps or differential amplifiers tend to have high noise. As a result, the SNR will be degraded unless the noise bandwidth is limited prior to the ADC input. TIE TO VDD TO USE INTERNAL 2.5V REFERENCE OR INPUT FOR EXTERNAL 2.5V REFERENCE OR INPUT FOR EXTERNAL 1.25V REFERENCE INTERNAL ADC REFERENCE 2.5V BANDGAP REFERENCE VCM 2.2μF BUFFER 1.25V 2209 F06 Figure 6. Reference Circuit 2209fa 20 LTC2209 APPLICATIONS INFORMATION The internal programmable gain amplifier provides the internal reference voltage for the ADC. This amplifier has very stringent settling requirements and is not accessible for external use. The SENSE pin can be driven ±5% around the nominal 2.5V or 1.25V external reference inputs. This adjustment range can be used to trim the ADC gain error or other system gain errors. When selecting the internal reference, the SENSE pin should be tied to VDD as close to the converter as possible. If the sense pin is driven externally it should be bypassed to ground as close to the device as possible with 1μF ceramic capacitor. 1.25V VCM 2.2μF 2 6 SENSE 2.2μF LTC2209 2209 F07 In applications where jitter is critical (high input frequencies), take the following into consideration: 1. Differential drive should be used. 2. Use as large an amplitude possible. If using transformer coupling, use a higher turns ratio to increase the amplitude. 3. If the ADC is clocked with a fixed frequency sinusoidal signal, filter the encode signal to reduce wideband noise. 4. Balance the capacitance and series resistance at both encode inputs such that any coupled noise will appear at both inputs as common mode noise. The encode inputs have a common mode range of 1.2V to VDD. Each input may be driven from ground to VDD for single-ended drive. VDD TO INTERNAL ADC CLOCK DRIVERS VDD 1.6V 6k ENC + LTC2209 3.3V 1μF LTC1461-2.5 4 Figure 7. A 2.25V Range ADC with an External 2.5V Reference PGA Pin The PGA pin selects between two gain settings for the ADC front-end. PGA = 0 selects an input range of 2.25VP-P; PGA = 1 selects an input range of 1.5VP-P. The 2.25V input range has the best SNR; however, the distortion will be higher for input frequencies above 100MHz. For applications with high input frequencies, the low input range will have improved distortion; however, the SNR will be 1.8dB worse. See the typical performance curves section. Driving the Encode Inputs The noise performance of the LTC2209 can depend on the encode signal quality as much as for the analog input. The encode inputs are intended to be driven differentially, primarily for noise immunity from common mode noise sources. Each input is biased through a 6k resistor to a 1.6V bias. The bias resistors set the DC operating point for transformer coupled drive circuits and can set the logic threshold for single-ended drive circuits. Any noise present on the encode signal will result in additional aperture jitter that will be RMS summed with the inherent ADC aperture jitter. VDD ENC– 1.6V 6k 2209 F08a Figure 8a. Equivalent Encode Input Circuit 0.1μF T1 50Ω ENC+ LTC2209 100Ω 8.2pF 0.1μF 5Ω ENC– 2209 F08b 0.1μF T1 = MA/COM ETC1-1-13 RESISTORS AND CAPACITORS ARE 0402 PACKAGE SIZE Figure 8b. Transformer Driven Encode 2209fa 21 LTC2209 APPLICATIONS INFORMATION VTHRESHOLD = 1.6V ENC+ 1.6V ENC– 0.1μF 2209 F09 LTC2209 The lower limit of the LTC2209 sample rate is determined by droop of the sample and hold circuits. The pipelined architecture of this ADC relies on storing analog signals on small valued capacitors. Junction leakage will discharge the capacitors. The specified minimum operating frequency for the LTC2209 is 1Msps. DIGITAL OUTPUTS Digital Output Modes Figure 9. Single-Ended ENC Drive, Not Recommended for Low Jitter 3.3V MC100LVELT22 3.3V 130Ω Q0 130Ω ENC+ LTC2209 ENC– D0 Q0 83Ω 83Ω 2209 F10 The LTC2209 can operate in four digital output modes: standard LVDS, low power LVDS, full rate CMOS, and demultiplexed CMOS. The LVDS pin selects the mode of operation. This pin has a four level logic input, centered at 0, 1/3VDD, 2/3VDD and VDD. An external resistor divider can be used to set the 1/3VDD and 2/3VDD logic levels. Table 1 shows the logic states for the LVDS pin. Table 1. LVDS Pin Function LVDS 0V(GND) 1/3VDD 2/3VDD VDD Digital Output Mode Full-Rate CMOS Demultiplexed CMOS Low Power LVDS LVDS Figure 10. ENC Drive Using a CMOS to PECL Translator Maximum and Minimum Encode Rates The maximum encode rate for the LTC2209 is 160Msps. For the ADC to operate properly the encode signal should have a 50% (±5%) duty cycle. Each half cycle must have at least 3.65ns for the ADC internal circuitry to have enough settling time for proper operation. Achieving a precise 50% duty cycle is easy with differential sinusoidal drive using a transformer or using symmetric differential logic such as PECL or LVDS. When using a single-ended ENCODE signal asymmetric rise and fall times can result in duty cycles that are far from 50%. An optional clock duty cycle stabilizer can be used if the input clock does not have a 50% duty cycle. This circuit uses the rising edge of ENC pin to sample the analog input. The falling edge of ENC is ignored and an internal falling edge is generated by a phase-locked loop. The input clock duty cycle can vary from 30% to 70% and the clock duty cycle stabilizer will maintain a constant 50% internal duty cycle. If the clock is turned off for a long period of time, the duty cycle stabilizer circuit will require one hundred clock cycles for the PLL to lock onto the input clock. To use the clock duty cycle stabilizer, the MODE pin must be connected to 1/3VDD or 2/3VDD using external resistors. Digital Output Buffers (CMOS Modes) Figure 11 shows an equivalent circuit for a single output buffer in CMOS Mode, Full-Rate or Demultiplexed. Each buffer is powered by OVDD and OGND, isolated from the ADC power and ground. The additional N-channel transistor in the output driver allows operation down to low voltages. The internal resistor in series with the output makes the output appear as 50Ω to external circuitry and eliminates the need for external damping resistors. As with all high speed/high resolution converters, the digital output loading can affect the performance. The digital outputs of the LTC2209 should drive a minimum capacitive load to avoid possible interaction between the digital outputs and sensitive input circuitry. The output should be buffered with a device such as a ALVCH16373 CMOS latch. For full speed operation the capacitive load should be kept under 10pF A resistor in series with the . output may be used but is not required since the ADC has a series resistor of 43Ω on chip. 2209fa 22 LTC2209 APPLICATIONS INFORMATION Lower OVDD voltages will also help reduce interference from the digital outputs. Digital Output Buffers (LVDS Modes) Figure 12 shows an equivalent circuit for an LVDS output LTC2209 OVDD VDD VDD 0.5V TO 3.6V 0.1μF OVDD DATA FROM LATCH PREDRIVER LOGIC 43Ω TYPICAL DATA OUTPUT OGND CLKOUT+/CLKOUT–). To minimize noise the PC board traces for each LVDS output pair should be routed close together. To minimize clock skew all LVDS PC board traces should have about the same length. In Low Power LVDS Mode 1.75mA is steered between the differential outputs, resulting in ±175mV at the LVDS receiver’s 100Ω termination resistor. The output common mode voltage is 1.20V, the same as standard LVDS Mode. Data Format The LTC2209 parallel digital output can be selected for offset binary or 2’s complement format. The format is selected with the MODE pin. This pin has a four level logic input, centered at 0, 1/3VDD, 2/3VDD and VDD. An external resistor divider can be user to set the 1/3VDD and 2/3VDD logic levels. Table 2 shows the logic states for the MODE pin. Table 2. MODE Pin Function MODE 0V(GND) 1/3VDD 2/3VDD VDD Output Format Offset Binary Offset Binary 2’s Complement 2’s Complement Clock Duty Cycle Stabilizer Off On On Off 2209 F11 Figure 11. Equivalent Circuit for a Digital Output Buffer pair. A 3.5mA current is steered from OUT+ to OUT– or vice versa, which creates a ±350mV differential voltage across the 100Ω termination resistor at the LVDS receiver. A feedback loop regulates the common mode output voltage to 1.20V. For proper operation each LVDS output pair must be terminated with an external 100Ω termination resistor, even if the signal is not used (such as OF+/OF– or LTC2209 3.5mA VDD VDD OVDD 43Ω DATA FROM LATCH PREDRIVER LOGIC 10k 10k OVDD 43Ω 100Ω OVDD 3.3V 0.1μF LVDS RECEIVER 1.20V + – 2209 F12 OGND Figure 12. Equivalent Output Buffer in LVDS Mode 2209fa 23 LTC2209 APPLICATIONS INFORMATION Overflow Bit An overflow output bit (OF) indicates when the converter is over-ranged or under-ranged. In CMOS mode, a logic high on the OFA pin indicates an overflow or underflow on the A data bus, while a logic high on the OFB pin indicates an overflow on the B data bus. In LVDS mode, a differential logic high on OF+/OF– pins indicates an overflow or underflow. Output Clock The ADC has a delayed version of the encode input available as a digital output, CLKOUT. The CLKOUT pin can be used to synchronize the converter data to the digital system. This is necessary when using a sinusoidal encode. In both CMOS modes, A bus data will be updated as CLKOUTA falls and CLKOUTB rises. In demultiplexed CMOS mode the B bus data will be updated as CLKOUTA falls and CLKOUTB rises. In Full Rate CMOS Mode, only the A data bus is active; data may be latched on the rising edge of CLKOUTA or the falling edge of CLKOUTB. In demultiplexed CMOS mode CLKOUTA and CLKOUTB will toggle at 1/2 the frequency of the encode signal. Both the A bus and the B bus may be latched on the rising edge of CLKOUTA or the falling edge of CLKOUTB. Digital Output Randomizer Interference from the ADC digital outputs is sometimes unavoidable. Interference from the digital outputs may be from capacitive or inductive coupling or coupling through the ground plane. Even a tiny coupling factor can result in discernible unwanted tones in the ADC output spectrum. By randomizing the digital output before it is transmitted off chip, these unwanted tones can be randomized, trading a slight increase in the noise floor for a large reduction in unwanted tone amplitude. The digital output is “Randomized” by applying an exclusive-OR logic operation between the LSB and all other data output bits. To decode, the reverse operation is applied; that is, an exclusive-OR operation is applied between the Output Driver Power Separate output power and ground pins allow the output drivers to be isolated from the analog circuitry. The power supply for the digital output buffers, OVDD, should be tied to the same power supply as for the logic being driven. For example, if the converter is driving a DSP powered by a 1.8V supply, then OVDD should be tied to that same 1.8V supply. In CMOS mode OVDD can be powered with any logic voltage up to the 3.6V. OGND can be powered with any voltage from ground up to 1V and must be less than OVDD. The logic outputs will swing between OGND and OVDD. In LVDS Mode, OVDD should be connected to a 3.3V supply and OGND should be connected to GND. D15 D15/D0 LSB and all other bits. The LSB, OF and CLKOUT output are not affected. The output Randomizer function is active when the RAND pin is high. CLKOUT CLKOUT OF OF D14 D14/D0 D2 • • • D2/D0 D1 D1/D0 RAND = HIGH, SCRAMBLE ENABLED RAND D0 2209 F13 D0 Figure 13. Functional Equivalent of Digital Output Randomizer 2209fa 24 LTC2209 APPLICATIONS INFORMATION PC BOARD FPGA CLKOUT Internal Dither The LTC2209 is a 16-bit ADC with a very linear transfer function; however, at low input levels even slight imperfections in the transfer function will result in unwanted tones. Small errors in the transfer function are usually a result of ADC element mismatches. An optional internal dither mode can be enabled to randomize the input location on the ADC transfer curve, resulting in improved SFDR for low signal levels. As shown in Figure 15, the output of the sample-and-hold amplifier is summed with the output of a dither DAC. The dither DAC is driven by a long sequence pseudo-random number generator; the random number fed to the dither DAC is also subtracted from the ADC result. If the dither DAC is precisely calibrated to the ADC, very little of the dither signal will be seen at the output. The dither signal that does leak through will appear as white noise. The dither DAC is calibrated to result in less than 0.5dB elevation in the noise floor of the ADC, as compared to the noise floor with dither off. OF D15/D0 D15 LTC2209 D14/D0 D14 D2/D0 • • • D2 D1/D0 D1 D0 D0 2209 F14 Figure 14. Descrambling a Scrambled Digital Output LTC2209 CLKOUT OF D15 • • • D0 AIN+ ANALOG INPUT AIN– S/H AMP 16-BIT PIPELINED ADC CORE DIGITAL SUMMATION OUTPUT DRIVERS CLOCK/DUTY CYCLE CONTROL PRECISION DAC MULTIBIT DEEP PSEUDO-RANDOM NUMBER GENERATOR 2209 F15 ENC + ENC – DITH DITHER ENABLE HIGH = DITHER ON LOW = DITHER OFF Figure 15. Functional Equivalent Block Diagram of Internal Dither Circuit 2209fa 25 LTC2209 APPLICATIONS INFORMATION Grounding and Bypassing The LTC2209 requires a printed circuit board with a clean unbroken ground plane; a multilayer board with an internal ground plane is recommended. The pinout of the LTC2209 has been optimized for a flowthrough layout so that the interaction between inputs and digital outputs is minimized. Layout for the printed circuit board should ensure that digital and analog signal lines are separated as much as possible. In particular, care should be taken not to run any digital track alongside an analog signal track or underneath the ADC. High quality ceramic bypass capacitors should be used at the VDD, VCM, and OVDD pins. Bypass capacitors must be located as close to the pins as possible. The traces connecting the pins and bypass capacitors must be kept short and should be made as wide as possible. The LTC2209 differential inputs should run parallel and close to each other. The input traces should be as short as possible to minimize capacitance and to minimize noise pickup. Heat Transfer Most of the heat generated by the LTC2209 is transferred from the die through the bottom-side exposed pad. For good electrical and thermal performance, the exposed pad must be soldered to a large grounded pad on the PC board. It is critical that the exposed pad and all ground pins are connected to a ground plane of sufficient area with as many vias as possible. 2209fa 26 LTC2209 APPLICATIONS INFORMATION Silkscreen Top Topside 2209fa 27 LTC2209 APPLICATIONS INFORMATION Inner Layer 2, GND Inner Layer 3, GND Inner Layer 4, GND Inner Layer 5, GND 2209fa 28 LTC2209 APPLICATIONS INFORMATION Bottomside Silkscreen Bottom 2209fa 29 3.3V 12 25 26 47 48 R16 100Ω R17 100Ω 4 5 I1N I1P I2N I2P I3N I3P I4N I4P I5N I5P I6N I6P I7N I7P I8N I8P VE1 VE2 VE3 VE4 VE5 O8N O8P 29 28 O7N O7P 31 30 O6N O6P 33 32 O5N O5P 35 34 O4N O4P 39 38 O3N U3 FIN1108 O3P 41 40 O2N O2P 43 42 6 7 8 9 10 11 14 15 16 17 18 19 20 21 O1N O1P 5 44 R18 100Ω R19 100Ω R20 100Ω R21 100Ω 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 R22 100Ω D11+ D11– D10+ D10– D9+ D9– 1 2 23 36 37 D8+ D8– CLKCOUT+ CLKOUT– D7– D8+ D8– D5+ D5– R31 100Ω 65 4 5 I1N I1P I2N I2P 8 9 10 11 R35 100Ω R38 100Ω R39 100Ω R40 100Ω 14 15 16 17 18 19 20 21 I3N I3P I4N I4P I5N I5P I6N I6P I7N I7P I8N I8P 6 7 R32 100Ω R33 100Ω R6 1000Ω 1 J2 MODE 3 VDD GND R8 1000Ω 6 4 R7 1000Ω 5 2 R34 100Ω 33 34 35 VC1 VC2 VC3 VC4 VC5 36 37 12 25 26 47 48 D7+ 38 39 3.3V 40 41 U2 LTC2209CUP 42 43 44 45 46 R30 100Ω 47 48 R23 100Ω 3 22 27 46 13 EN12 EN34 EN58 EN78 EN VC1 VC2 VC3 VC4 VC5 VCC J4 VDD GND R3 DNP OFF 6 ON 4 3 5 1 2 LTC2209 R36 R44 86.6Ω 86.6Ω R12 68.1Ω R10 10Ω OF+ D15+ PGA OF– D15– D14+ D14– D13+ D13– D12+ RAND MODE LVDS D12– OGND50 OVDD49 R27 10Ω •• APPLICATIONS INFORMATION VDD17 GND18 SHDN DITH D0– D0+ D1– D1+ D2– D2+ D3– D3+ D4– D4+ OGND31 3 17 18 19 20 21 22 23 24 25 26 27 27 29 30 31 32 5 RUN OFF 6 SHDN ON 4 VCC DITHER OVDD32 VE1 VE2 VE3 VE4 VE5 C20 0.1μF C22 0.1μF R41 100Ω 3.3V 1 2 23 36 37 30 R9 10Ω R28 10Ω C26 0.1μF C25 0.1μF C16 0.1μF C18 OPT C19 OPT R37 100Ω R11 68.1Ω C8 4.7pF 1 SENSE GND2 VCM GND VDD5 VDD6 GND7 AINP AINN GND10 GND11 ENCP ENCN GND14 VDD15 VDD16 R15 100Ω 3 C13 2.2μF 4 5 6 C17 2.2μF R14 1000Ω 8 9 R13 100Ω 11 12 13 14 15 16 J3 1 2 10 7 C12 0.1μF TP1 EXT REF R5 5.1Ω 2 MEC8-150-02-L-D-EDGE_CONNRE-DIM J1E J1O 2 1 4 3 6 5 8 7 10 9 12 11 14 13 16 15 18 17 20 19 22 21 24 23 26 25 28 27 30 29 32 31 34 33 36 35 38 37 40 39 42 41 44 43 46 45 48 47 50 49 52 51 54 53 3 22 27 46 13 EN12 EN34 EN58 EN78 EN O1N O1P O2N O2P U4 O3N FIN1108 O3P O4N O4P O5N O5P O6N O6P O7N O7P O8N O8P 45 44 43 42 41 40 39 38 35 34 33 32 31 30 29 28 R24 100k 3.3V R29 4990Ω 56 58 60 62 64 66 68 70 72 74 76 78 80 82 84 86 88 90 92 94 96 98 100 55 57 59 61 63 65 67 69 71 73 75 77 79 81 83 85 87 89 91 93 95 97 99 C27 0.1μF R25 4990Ω R43 FERRITE BEAD 8 VCC C14 4.7μF C24 4.7μF C38 4.7μF U1 24LC02ST 6 5 7 ARRAY EEPROM 3 2 1 GND 4 R26 4990Ω R42 FERRITE BEAD 1 2 3 4 GND DOUT– 5 EN DOUT+ 6 GND VCC 7 RIN– RIN+ 8 U5 FIN1101K8X C34 0.1μF C35 0.1μF C36 0.1μF C28 0.1μF C29 0.1μF C30 0.1μF C31 0.1μF C32 0.1μF 6CL 6DA WP A2 A1 A0 2209 F16 R45 86.6Ω R46 68.1Ω J5 AIN C6 0.01μF L1 56nH T1 MABA007159-000000 •• T2 R47 68.1Ω C8 8.2pF C10 8.2pF C7 0.01μF C5 0.01μF J7 ENCODE C2 T3 CLOCK 0.01μF ETC1-1-13 •• R2 49.9Ω C1 0.01μF C3 0.01μF R1 49.9Ω C4 8.2pF R4 5.1Ω VCC VCC TP5 3.3V 1 2 3 4 TP2 PWR GND 5 J9 AUX PWR CONNECTOR 6 C15 0.1μF *VERSION TABLE IF RANGE 1MHz-80MHz 80MHz-160MHz 1MHz-80MHz 80MHz-160MHz 1.8pF 3.9pF 4.7pF 8.2pF 1.8pF 3.9pF 4.7pF 8.2pF 56nH 18nH 56nH 18nH CB C9-10 L1 R36,44 86.6 43.2 86.6 43.2 R45 86.6 182 86.6 182 T2 MABAES0060 WBC1-1LB MABAES0060 WBC1-1LB ASSEMBLY U2 BITS Msps DC1281A-A LTC2209CUP 16 160 DC1281A-B LTC2209CUP 16 160 DC1281A-E LTC2209CUP#3BC 16 180 DC1281A-F LTC2209CUP#3BC 16 180 2209fa LTC2209 PACKAGE DESCRIPTION UP Package 64-Lead Plastic QFN (9mm × 9mm) (Reference LTC DWG # 05-08-1705) 0.70 ± 0.05 7.15 ± 0.05 7.50 REF 8.10 ± 0.05 9.50 ± 0.05 (4 SIDES) 7.15 ± 0.05 PACKAGE OUTLINE 0.25 ± 0.05 0.50 BSC RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 0.75 ± 0.05 R = 0.115 TYP 9 .00 ± 0.10 (4 SIDES) R = 0.10 TYP 63 64 0.40 ± 0.10 1 2 PIN 1 CHAMFER C = 0.35 PIN 1 TOP MARK (SEE NOTE 5) 7.15 ± 0.10 7.50 REF (4-SIDES) 7.15 ± 0.10 (UP64) QFN 0406 REV C 0.200 REF 0.00 – 0.05 NOTE: 1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION WNJR-5 2. ALL DIMENSIONS ARE IN MILLIMETERS 3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT 4. EXPOSED PAD SHALL BE SOLDER PLATED 5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 6. DRAWING NOT TO SCALE 0.25 ± 0.05 0.50 BSC BOTTOM VIEW—EXPOSED PAD 2209fa Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 31 LTC2209 RELATED PARTS PART NUMBER LTC2202 LTC2203 LTC2204 LTC2205 LTC2206 LTC2207 LTC2208 LTC2215 LTC2216 LTC2217 LTC2220 LTC2220-1 LTC2249 LTC2250 LTC2251 LTC2252 LTC2253 LTC2254 LTC2255 LTC2299 LT5512 LT5514 LT5522 LT5527 LT5572 LTC6400 LTC6401 DESCRIPTION 16-Bit, 10MSPS ADC 16-Bit, 25MSPS ADC 16-Bit, 40Msps ADC 16-Bit, 65Msps ADC 16-Bit, 80Msps ADC 16-Bit, 105Msps ADC 16-Bit, 130Msps ADC 16-Bit, 65Msps Low Noise ADC 16-Bit, 80Msps Low Noise ADC 16-Bit, 105Msps Low Noise ADC 12-Bit, 170Msps ADC 12-Bit, 185Msps ADC 14-Bit, 65Msps ADC 10-Bit, 105Msps ADC 10-Bit, 125Msps ADC 12-Bit, 105Msps ADC 12-Bit, 125Msps ADC 14-Bit, 105Msps ADC 14-Bit, 125Msps ADC Dual 14-Bit, 80Msps ADC DC-3GHz High Signal Level Downconverting Mixer Ultralow Distortion IF Amplifier/ADC Driver with Digitally Controlled Gain 600MHz to 2.7GHz High Linearity Downconverting Mixer 400mHz to 3.7GHz High Signal Level Downconverting Mixer COMMENTS 150mW, 81.6dB SNR, 100dB SFDR, 7mm × 7mm QFN Package 230mW, 81.6dB SNR, 100dB SFDR, 7mm × 7mm QFN Package 470mW, 79dB SNR, 100dB SFDR, 7mm × 7mm QFN Package 530mW, 79dB SNR, 100dB SFDR, 7mm × 7mm QFN Package 725mW, 77.9dB SNR, 100dB SFDR, 7mm × 7mm QFN Package 900mW, 77.9dB SNR, 100dB SFDR, 7mm × 7mm QFN Package 1250mW, 77.7dB SNR, 100dB SFDR, 9mm × 9mm QFN Package 700mW, 81.5dB SNR, 100dB SFDR, 9mm × 9mm QFN Package 970mW, 81.3dB SNR, 100dB SFDR, 9mm × 9mm QFN Package 1190mW, 81.2dB SNR, 100dB SFDR, 9mm × 9mm QFN Package 890mW, 67.5dB SNR, 9mm x 9mm QFN Package 910mW, 67.5dB SNR, 9mm x 9mm QFN Package 230mW, 73dB SNR, 5mm x 5mm QFN Package 320mW, 61.6dB SNR, 5mm x 5mm QFN Package 395mW, 61.6dB SNR, 5mm x 5mm QFN Package 320mW, 70.2dB SNR, 5mm x 5mm QFN Package 395mW, 70.2dB SNR, 5mm x 5mm QFN Package 320mW, 72.5dB SNR, 5mm x 5mm QFN Package 395mW, 72.4dB SNR, 5mm x 5mm QFN Package 445mW, 73dB SNR, 9mm x 9mm QFN Package DC to 3GHz, 21dBm IIP3, Integrated LO Buffer 450MHz 1dB BW, 47dB OIP3, Digital Gain Control 10.5dB to 33dB in 1.5dB/Step 4.5V to 5.25V Supply, 25dBm IIP3 at 900MHz, NF = 12.5dB, 50Ω Single-Ended RF and LO Ports High Input IP3 = 23.5dBm at 1900MHz Conversion Gain = 3.2dB at 1900MHz 1.5GHz to 2.5GHz High Linearity Direct Quadrature High Output: –2.5dB Conversion Gain OIP3 = 21.6dBm at 2GHz Modulator Low Noise, Low Distortion Differential ADC Driver for 300MHz IF Low Noise, Low Distortion Differential ADC Driver for 140MHz IF 1.8GHz-3dB Bandwidth, Fixed Gain Version up to 26dB, –94dBc IMD3 at 70MHz 1.3GHz-3dB Bandwidth, Fixed Gain Version up to 26dB, –93dBc IMD3 at 70MHz 2209fa 32 Linear Technology Corporation (408) 432-1900 ● LT 0208 REV A • PRINTED IN USA 1630 McCarthy Blvd., Milpitas, CA 95035-7417 FAX: (408) 434-0507 ● www.linear.com © LINEAR TECHNOLOGY CORPORATION 2007