LRB501V-40T1G

LESHAN RADIO COMPANY, LTD. Surface Mount Schottky Diode LRB501V-40T1G S-LRB501V-40T1G z Applications Low current rectification z Features 1) Small surface mounting type. 2) High reliability. 1 We declare that the material of product compliance with RoHS requirements. 2 S- Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable. SOD-323 z Construction Silicon epitaxial planar 1 CATHODE zDevice marking and ordering information Device Marking Shipping 4 3000/Tape&Reel 4 10000/Tape&Reel LRB501V-40T1G S-LRB501V-40T1G LRB501V-40T3G S-LRB501V-40T3G 2 ANODE zAbsolute maximum ratings (Ta = 25°C) Symbol Limits Unit Peak reverse voltage Parameter VRM 45 V DC reverse voltage VR 40 V Mean rectifying current IO 0.1 A IFSM 1 A Peak forward surge current∗ Junction temperature Tj 125 °C Storage temperature Tstg −40~+125 °C PD 200 mW Power Dissipation ∗ 60 Hz for 1 zElectrical characteristics (Ta = 25°C) Symbol Min. Typ. Max. Unit Forward voltage Parameter VF1 − − 0.55 V Conditions Forward voltage VF2 − − 0.34 V IF=10mA Reverse current IR − − 30 µA VR=10V Capacitance between terminals CT − 6.0 − pF VR=10V, f=1MHz IF=100mA Note) ESD sensitive product handling required. Rev.O 1/3 LESHAN RADIO COMPANY, LTD. LRB501V-40T1G , S-LRB501V-40T1G 1000 10m 1 0 0.1 0.2 REVERSE CURRENT : R (A) −25 °C 25° 10 C 100 12 5° C 75° C FORWARD CURRENT : IF (mA) 125°C 0.3 0.4 0.5 FORWARD VOLTAGE : VF (V) Fig. 1 Forward characteristics 0.6 1m 75°C 100µ 10µ 25°C 1µ 0.1 µ 0 10 20 30 40 REVERSE VOLTAGE : VR (V) Fig. 2 Reverse characteristics CAPACITANCE BETWEEN TERMINALS : CT (pF) zElectrical characteristic curves (Ta = 25°C) 100 10 1 0 5 10 15 20 25 30 35 REVERSE VOLTAGE : VR (V) Fig. 3 Capacitance between terminals characteristics Io CURRENT (%) 100 80 60 40 20 0 0 25 50 75 100 125 AMBIENT TEMPERATURE : Ta (°C) Fig. 4 Derating curve Rev.O 2/3 LESHAN RADIO COMPANY, LTD. LRB501V-40T1G , S-LRB501V-40T1G SOD-323 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. LEAD THICKNESS SPECIFIED PER L/F DRAWING WITH SOLDER PLATING. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 5. DIMENSION L IS MEASURED FROM END OF RADIUS. HE D b 1 2 E MILLIMETERS DIM MIN NOM MAX A 0.80 0.90 1.00 A1 0.00 0.05 0.10 A3 0.15 REF b 0.25 0.32 0.4 C 0.089 0.12 0.177 D 1.60 1.70 1.80 E 1.15 1.25 1.35 L 0.08 HE 2.30 2.50 2.70 A3 A C NOTE 3 L NOTE 5 A1 INCHES NOM MAX 0.035 0.040 0.002 0.004 0.006 REF 0.010 0.012 0.016 0.003 0.005 0.007 0.062 0.066 0.070 0.045 0.049 0.053 0.003 0.090 0.098 0.105 MIN 0.031 0.000 SOLDERING FOOTPRINT* 0.63 0.025 0.83 0.033 1.60 0.063 2.85 0.112 Rev.O 3/3