TB62777FNG

TENTATIVE TOSHIBA Bi-CMOS Integrated Circuit Silicon Monolithic TB62777FNG TB62777FNG 8-Channel Constant-Current LED Driver of the 3.3-V and 5-V Power Supply Voltage Operation The TB62777FNG is comprised of constant-current drivers designed for LEDs and LED panel displays. The regulated current sources are designed to provide a constant current, which is adjustable through one external resistor. The TB62777FNG incorporates eight channels of shift registers, latches, AND gates and constant-current outputs. Fabricated using the Bi-CMOS process, the TB62777FNG satisfies the system requirement of high-speed data transmission. The TB62777FNG is RoHS. Weight: 0.07 g (typ.) Features • • • • • • • • • • • • • Power supply voltages: VDD = 3.3 V/5 V Output drive capability and output count: 50 mA × 8 channels Constant-current output range: 5 to 40 mA Voltage applied to constant-current output terminals: 0.4 V (IOUT = 5 to 40 mA) Designed for common-anode LEDs Thermal shutdown (TSD)（MIN:150℃） Power on reset (POR) Input signal voltage level: 3.3-V and 5-V CMOS interfaces (Schmitt trigger input) Maximum output voltage: 25V Serial data transfer rate: 25 MHz (max) @cascade connection Operating temperature range: Topr = −40 to 85°C Package: SSOP-P-225-0.65B Constant-current accuracy Output Voltage 0.4 V to 4 V Current accuracy Between Channels ±3% Current Accuracy Between ICs ±6% Output Current 15 mA 1 (Ver.0.2) 2008-1-23 TENTATIVE Pin Assignment (top view) GND SERIAL-IN CLOCK LATCH OUT0 OUT1 OUT2 OUT3 VDD R-EXT SERIAL-OUT ENABLE OUT7 OUT6 OUT5 OUT4 TB62777FNG Block Diagram OUT0 OUT1 OUT7 R-EXT I-REG TSD VDD POR ENABLE Q ST R D LATCH Q ST R D Q ST R D GND SERIAL-IN D0 Q0 Q1 Q7 8-bit shift register D0 to D7 R CLOCK SERIAL-OUT D Q CK R Truth Table CLOCK LATCH ENABLE SERIAL-IN OUT0 … OUT5 … OUT7 Dn … Dn − 5 … Dn − 7 No Change Dn + 2 … Dn − 3 … Dn − 5 OFF OFF SERIAL-OUT No change No change No change No change Dn −4 H L H X X L L L H H Dn Dn + 1 Dn + 2 Dn + 3 Dn + 3 Note 1: OUT0 to OUT7 = On when Dn = H; OUT0 to OUT7 = Off when Dn = L. 2 (Ver.0.2) 2008-1-23 TENTATIVE Timing Diagram n=0 CLOCK 1 2 3 4 5 6 7 TB62777FNG H L H SERIAL-IN L H LATCH L H ENABLE L ON OUT0 OFF ON OUT1 OFF ON OUT2 OFF ON OUT7 OFF H SERIAL-OUT Data applied when n = 0 L Note 1: Latches are level-sensitive, not edge-triggered. Note 2: The TB62777FNG can be used at 3.3 V or 5.0 V. However, the VDD supply voltage must be equal to the input voltage. Note 3: Serial data is shifted out of SERIAL-OUT on the falling edge of CLOCK. Note 4: The latches hold data while the LATCH terminal is held Low. When the LATCH terminal is High, the latches do not hold data and pass it transparently. When the ENABLE terminal is Low, OUT0 to OUT7 toggle between ON and OFF according to the data. When the ENABLE terminal is High, OUT0 to OUT7 are forced OFF. 3 (Ver.0.2) 2008-1-23 TENTATIVE Terminal Description Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Pin Name GND SERIAL-IN CLOCK LATCH TB62777FNG Function GND terminal Serial data input terminal Serial clock input terminal Latch input terminal Constant-current output terminal Constant-current output terminal Constant-current output terminal Constant-current output terminal Constant-current output terminal Constant-current output terminal Constant-current output terminal Constant-current output terminal Output enable input terminal OUT0 OUT1 OUT2 OUT3 OUT4 OUT5 OUT6 OUT7 ENABLE SERIAL-OUT R-EXT VDD All outputs ( OUT0 to OUT7 ) are disabled when the ENABLE terminal is driven High, and enabled when it is driven Low. Serial data output terminal. Serial data is clocked out on the falling edge of CLOCK. An external resistor is connected between this terminal and ground. OUT0 to OUT7 are adjusted to the same current value. Power supply terminal Equivalent Circuits for Inputs and Outputs CLOCK, SERIAL-IN， ENABLE ， LATCH 端子 VDD CLOCK SERIAL-IN ENABLE LATCH GND GND VDD SERIAL-OUT 端子 SERIAL-OUT OUT0 ~ OUT7 定電流出力端子 OUT0 ~ OUT7 GND 4 (Ver.0.2) 2008-1-23 TENTATIVE Absolute Maximum Ratings (Ta = 25°C) Characteristics Supply voltage Input voltage Output current Output voltage Power dissipation Thermal resistance Operating temperature range Storage temperature range Maximum junction temperature Symbol VDD VIN IOUT VOUT Pd Rth (j-a) Topr Tstg Tj Rating 6.0 −0.3 to VDD + 0.3 (Note 1) TB62777FNG Unit V V mA/ch V W °C/W °C °C °C 55 0.3 to 25 1.02 (Notes 2 and 3) 122 −40 to 85 −55 to 150 (Note 2) 150 Note 1: However, do not exceed 6.0 V. Note 2: When mounted on a PCB (76.2 × 114.3 × 1.6 mm; Cu = 30%; 35-µm-thick; SEMI-compliant) Note 3: Power dissipation is reduced by 1/Rth (j-a) for each °C above 25°C ambient. Operating Ranges (unless otherwise specified, Ta = −40°C to 85°C) Characteristics Supply voltage Output voltage Symbol VDD VOUT IOUT Output current IOH IOL VIH Input voltage VIL Clock frequency LATCH pulse width Test Condition ⎯ Min 3 0.4 5 ⎯ ⎯ Typ. ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ Max 5.5 4 40 −5 Unit V V mA/ch mA OUT0 to OUT 7 OUT0 to OUT 7 SERIAL-OUT SERIAL-OUT SERIAL-IN/CLOCK/ LATCH / ENABLE Cascade connection (Note 2) (Note 2) IOUT ≥ 20 mA 5 mA ≤ IOUT ≤ 20 mA (Note 2) (Note 2) 5 VDD 0.3 × VDD 25 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ 0.7 × VDD GND ⎯ V fCLK twLAT twCLK twENA tSETUP1 tSETUP2 MHz ns 20 20 2 3 5 5 CLOCK pulse width ENABLE pulse width µs Setup time (Note 2) 5 5 ⎯ ns Hold time Maximum clock rise time Maximum clock fall time tHOLD1 tHOLD2 tr tf Single operation (Notes 1 and 2) 5 5 ⎯ µs Note 1: For cascade operation, the CLOCK waveform might become ambiguous, causing the tr and tf values to be large. Then it may not be possible to meet the timing requirement for data transfer. Please consider the timing carefully. Note 2: Please see the timing waveform on page 10. 5 (Ver.0.2) 2008-1-23 TENTATIVE TB62777FNG Electrical Characteristics (Unless otherwise specified, Ta = 25°C, VDD = 4.5 to 5.5 V) Characteristics Output current Output current error between ICs Output current error between channels Output leakage current Symbol IOUT1 ∆IOUT1 ∆IOUT2 Test Circuit 5 5 5 5 ⎯ ⎯ Test Condition VOUT = 0.4 V, R-EXT = 1.2 kΩ VDD = 5 V, VOUT = 0.4 V, R-EXT = 1.2 kΩ All channels ON VDD = 5 V, VOUT = 0.4 V, R-EXT = 1.2 kΩ All channels ON VDD = 5 V, VOUT = 25 V SERIAL-IN/CLOCK/ LATCH / ENABLE SERIAL-IN/CLOCK/ LATCH / ENABLE VIN = VDD CLOCK/SERIAL-IN / LATCH / ENABLE VIN = GND CLOCK/SERIAL-IN/ LATCH / ENABLE Min ― ― ⎯ ⎯ Typ. 15 ±3 ±1 ⎯ ⎯ ⎯ ― Max ― ±6 ±3 Unit mA ％ % µA IOZ VIH 1 VDD 0.7 × VDD GND ― Input voltage VIL IIH Input current IIL 3 0.3 × VDD 1 V 2 µA ― ― −1 VOL SERIAL-OUT output voltage VOH Changes in constant output current dependent on VDD %/VDD IDD (OFF) 1 Supply current IDD (OFF) 2 IDD (ON) 1 1 5 4 4 4 IOL = 5.0 mA, VDD = 5 V IOH = −5.0 mA, VDD = 5 V VDD = 3 V to 5.5 V R-EXT = OPEN, VOUT = 25.0 V R-EXT = 1.2 kΩ, VOUT = 25.0 V, All channels OFF R-EXT = 1.2 kΩ, VOUT = 0.4 V, All channels ON ⎯ ⎯ ⎯ 0.3 V ⎯ 4.7 ⎯ ⎯ ⎯ ⎯ 1 ⎯ ⎯ ⎯ 2 1 5 9 % mA Switching Characteristics (Unless otherwise specified, Ta = 25°C, VDD = 4.5 to 5.5V) Characteristics Symbol tpLH1 tpLH2 tpLH3 tpLH tpHL1 tpHL2 tpHL3 tpHL Output rise time Output fall time tor tof Test Circuit 6 Test Condition (Note 1) Min ⎯ ⎯ ⎯ Typ. 20 Max 300 Unit CLK- OUTn , LATCH = “H”, ENABLE = “L” LATCH − OUTn , ENABLE = “L” ENABLE − OUTn , LATCH = “H” CLK-SERIAL OUT CLK- OUTn , LATCH = “H”, ENABLE = “L” LATCH − OUTn , ENABLE = “L” ENABLE − OUTn , LATCH = “H” CLK-SERIAL OUT 10% to 90% points of OUT0 to OUT7 voltage waveforms 90% to 10% points of OUT0 to OUT7 voltage waveforms 6 20 300 6 6 6 20 10 30 300 14 340 ns Propagation delay time 2 ⎯ ⎯ ⎯ 6 70 340 6 6 6 6 70 10 20 125. 340 14 150 300 2 ― ― Note 1: Topr = 25°C, VDD = VIH = 5 V, VIL = 0 V, REXT = 1.2 kΩ, IOUT = 15mA, VL = 5.0 V, CL = 10.5pF (see test circuit 6.) 6 (Ver.0.2) 2008-1-23 TENTATIVE TB62777FNG Electrical Characteristics (Unless otherwise specified, Ta = 25°C, VDD = 3 to 3.6 V) Characteristics Output current Output current error between ICs Output current error between channels Output leakage current Symbol IOUT1 ∆IOUT1 ∆IOUT2 Test Circuit Test Condition VOUT = 0.4 V, R-EXT = 1.2 kΩ VDD = 3.3 V, VOUT = 0.4 V, R-EXT = 1.2 kΩ All channels ON VDD = 3.3 V, VOUT = 0.4 V, R-EXT = 1.2 kΩ All channels ON VDD = 3.3 V, VOUT = 25 V SERIAL-IN/CLOCK/ LATCH / ENABLE SERIAL-IN/CLOCK/ LATCH / ENABLE VIN = VDD CLOCK/SERIAL-IN/ LATCH / ENABLE VIN = GND CLOCK/SERIAL-IN/ LATCH / ENABLE Min ― ― ⎯ ⎯ Typ. 15 ±3 ±1 ⎯ ⎯ ⎯ Max ― ±6 ±3 Unit mA % % µA 5 5 5 5 ⎯ ⎯ 2 IOZ VIH 1 VDD 0.7 × VDD GND Input voltage VIL 0.3 × VDD 1 V IIH Input current IIL ― ― µA ― ― −1 3 1 1 5 4 4 4 VOL SERIAL-OUT output voltage VOH Changes in constant output current dependent on VDD %/VDD IDD (OFF) 1 Supply current IDD (OFF) 2 IDD (ON) IOL = 5.0 mA, VDD = 3.3 V IOH = −5.0 mA, VDD = 3.3 V VDD = 3 V to 5.5 V R-EXT = OPEN, VOUT = 25.0 V R-EXT = 1.2 kΩ, VOUT = 25.0 V, All channels OFF R-EXT = 1.2 kΩ, VOUT = 0.4 V, All channels ON ⎯ ⎯ ⎯ 0.3 V ⎯ 3.0 ⎯ ⎯ ⎯ ⎯ 1 ⎯ ⎯ ⎯ 2 1 5 9 % mA Switching Characteristics (Unless otherwise specified, Ta = 25°C, VDD = 3 to 3.6 V) Characteristics Symbol tpLH1 tpLH2 tpLH3 tpLH tpHL1 tpHL2 tpHL3 tpHL Output rise time Output fall time tor tof Test Circuit Test Condition (Note 1) Min ⎯ ⎯ ⎯ Typ. ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ Max 300 Unit 6 6 6 6 6 6 6 6 6 6 CLK- OUTn , LATCH = “H”, ENABLE = “L” LATCH - OUTn , ENABLE = “L” ENABLE - OUTn , LATCH = “H” CLK-SERIAL OUT CLK- OUTn , LATCH = “H”, ENABLE = “L” LATCH - OUTn , ENABLE = “L” ENABLE - OUTn , LATCH = “H” CLK-SERIAL OUT 10% to 90% points of OUT0 to OUT7 voltage waveforms 90% to 10% points of OUT0 to OUT7 voltage waveforms 300 300 14 340 ns Propagation delay time 2 ⎯ ⎯ ⎯ 340 340 14 150 300 2 ⎯ ⎯ Note 1: Topr = 25°C, VDD = VIH = 3.3 V, VIL = 0 V, REXT = 1.2 kΩ, IOUT = 15mA, VL = 5.0 V, CL = 10.5pF (see test circuit 6.) 7 (Ver.0.2) 2008-1-23 TENTATIVE Test Circuits Test Circuit 1: SERIAL-OUT output voltage (VOH/VOL) VDD TB62777FNG ENABLE F.G CLOCK LATCH OUT0 SERIAL-IN OUT7 IO = −5 mA to 5 mA CL = 10.5 pF V Test Circuit 2: Input Current (IIH) VIN = VDD VDD A A A ENABLE CLOCK LATCH OUT0 A SERIAL-IN OUT7 VDD = 4.5 to 5.5 V、3 to 3.6V R-EXT GND SERIAL-OUT CL = 10.5 pF Test Circuit 3: Input Current (IIL) A A A A ENABLE CLOCK LATCH SERIAL-IN VDD REXT OUT0 OUT7 VDD = 4.5 to 5.5 V、3 to 3.6V R-EXT GND SERIAL-OUT CL = 10.5 pF REXT 8 (Ver.0.2) 2008-1-23 VDD = 5 V、3.3V REXT VIH = VDD VIL = 0 V tr = tf = 10 ns (10 to 90%) R-EXT GND SERIAL-OUT TENTATIVE Test Circuit 4: Supply Current TB62777FNG ENABLE F.G CLOCK LATCH OUT0 SERIAL-IN OUT7 VDD = 4.5 to 5.5 V、3 to 3.6V REXT = 1.2 kΩ Test Circuit 5: Output Current (IOUT1), Output Leakage Current (IOZ) Output Current Error Margin (∆IOUT1/∆IOUT2), Current Variation with VDD (%/VDD) ENABLE CLOCK F.G LATCH VDD CL = 10.5 pF VIH = VDD VIL = 0 V tr = tf = 10 ns (10 to 90%) A R-EXT GND SERIAL-OUT OUT0 A SERIAL-IN OUT7 A VDD = 4.5 to 5.5 V、3 to 3.6V VDD = 4.5 to 5.5 V、3 to 3.6V A VOUT = 0.4 V, 25 V REXT = 1.2 kΩ Theoretical output current = 1.13 V/REXT × 16 Test Circuit 6: Switching Characteristics ENABLE CLOCK F.G LATCH SERIAL-IN OUT7 CL = 10.5 pF VIH = VDD VIL = 0 V tr = tf = 10 ns (10 to 90%) R-EXT REXT = 12 kΩ CL = 10.5 pF VIH = VDD VIL = 0 V tr = tf = 10 ns (10 to 90%) R-EXT GND SERIAL-OUT VDD RL=300Ω OUT0 CL IOUT GND SERIAL-OUT CL = 10.5 pF VL = 5 V 9 (Ver.0.2) 2008-1-23 TENTATIVE Timing Waveforms 1. CLOCK, SERIAL-IN, SERIAL-OUT twCLK CLOCK 50% tSETUP1 SERIAL-IN 50% tHOLD1 SERIAL-OUT 50% tpLH/tpHL 50% 50% 90% 10% tr tf 90% 10% TB62777FNG 2. CLOCK, SERIAL-IN, LATCH , ENABLE , OUTn CLOCK 50% 50% SERIAL-IN tHOLD2 LATCH 50% twLAT ENABLE 50% tSETUP2 50% twENA twENA 50% 50% OUTn tpHL1/LH1 tpHL2/LH2 50% 50% tpHL3/LH3 3. OUTn 90% 90% OFF OUTn 10% tof 10% tor ON 10 (Ver.0.2) 2008-1-23 TENTATIVE TB62777FNG PCB Conditions: 76.2 × 114.3 × 1.6 mm, Cu = 30%, 35-µm Thick, SEMI-Compliant IOUT − Duty ON PCB 100 90 80 70 IOUT (mA) Pd-Ta 1.4 1.2 1.0 Pd(W) 60 50 40 30 20 10 0 0 20 40 60 80 100 Duty − Turn-ON rate (%) ON PCB All outputs ON Ta = 85°C VDD = 5.0 V VOUT = 1.0 V 0.8 0.6 0.4 0.2 0.0 0 50 Ta (°C) 100 150 Output Current vs. External Resistor (typ.) 50 45 40 35 IOUT (mA) IOUT − REXT IOUT - REXT IOUT (mA) 30 25 20 15 10 5 0 100 1000 REXT (Ω ) 10000 All outputs ON Ta = 25°C VOUT = 0.7 V The above graphs are presented merely as a guide and does not constitute any guarantee as to the performance or characteristics of the device. Each product design should be fully evaluated in the real-world environment. 11 (Ver.0.2) 2008-1-23 TENTATIVE Application Circuit: General Composition for Static Lighting of LEDs In the following diagram, it is recommended that the LED supply voltage (VLED) be equal to or greater than the sum of Vf (max) of all LEDs plus 0.7 V. TB62777FNG VLED O0 SERIAL-IN C.U. ENABLE LATCH CLOCK O1 O2 O5 O6 O7 SERIAL-OUT SERIAL-IN ENABLE LATCH CLOCK O0 O1 O2 O5 O6 O7 SERIAL-OUT TB62777FNG R-EXT GND TB62777FNG R-EXT GND 12 (Ver.0.2) 2008-1-23 TENTATIVE Application Circuit: General Composition for Dynamic Lighting of LEDs In the following diagram, it is recommended that the LED supply voltage (VLED) be equal to or greater than the sum of Vf (max) of all LEDs plus 0.7 V. TB62777FNG Example) TD62M8600FG 8 bit multichip PNP transistor array. It is not necessary when lighting statically. VLED O0 SERIAL-IN C.U. ENABLE LATCH CLOCK O1 O6 O7 SERIAL-OUT SERIAL-IN ENABLE LATCH CLOCK O0 O1 O6 O7 SERIAL-OUT TB62777FNG R-EXT GND TB62777FNG R-EXT GND 13 (Ver.0.2) 2008-1-23 TENTATIVE Package Dimensions TB62777FNG Weight: 0.07 g (typ.) 14 (Ver.0.2) 2008-1-23 TENTATIVE Notes on Contents 1. Block Diagrams TB62777FNG Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. Timing Charts Timing charts may be simplified for explanatory purposes. 4. Application Circuits The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. IC Usage Considerations Notes on handling of ICs (1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. (2) (3) (4) 15 (Ver.0.2) 2008-1-23 TENTATIVE (5) TB62777FNG Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly. Points to remember on handling of ICs (1) Over current Protection Circuit Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all circumstances. If the Over current protection circuits operate against the over current, clear the over current status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the over current protection circuit to not operate properly or IC breakdown before operation. In addition, depending on the method of use and usage conditions, if over current continues to flow for a long time after operation, the IC may generate heat resulting in breakdown. Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. (2) 16 (Ver.0.2) 2008-1-23 TENTATIVE TB62777FNG About solderability, following conditions were confirmed • Solderability (1) Use of Sn-37Pb solder Bath · solder bath temperature = 230°C · dipping time = 5 seconds · the number of times = once · use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath · solder bath temperature = 245°C · dipping time = 5 seconds · the number of times = once · use of R-type flux RESTRICTIONS ON PRODUCT USE • The information contained herein is subject to change without notice. 20070701-EN • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. • Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 17 (Ver.0.2) 2008-1-23