BLM21PG220SN1D

Spec. No. JENF243A-0005Y-01 Reference Only Total page 2/16 P.1/11 Chip Ferrite Bead BLM21□□□□□□N1□ Reference Specification 1. Scope This reference specification applies to Chip Ferrite Bead BLM21_□N Series. 2. Part Numbering (ex.) BL (1) M (2) 21 (3) AG (4) (1)Product ID (2)Type (3)Dimension (L×Ｗ) (4)Characteristics (5)Typical Impedance at 100MHz (6)Performance 121 (5) S (6) N (7) 1 (8) D (9) (7)Category (8)Numbers of Circuit (9)Packaging D:Taping(φ180mm Reel, Paper Tape) L:Taping(φ180mm Reel, Plastic Tape) B:Bulk 3. Rating Customer Part Number Impedance (Ω) DC Resistance Rated Current (at 100MHz,Under Standard (Ω) max. (mA)(＊1) MURATA Testing Condition) Initial Values Part Number Values After at at Typical Testing 85°C 125°C BLM21PG220SN1D *1 *1 22±25％ 22 0.009 0.018 6000 3300 BLM21PG220SN1B BLM21PG300SN1D *1 *1 20 min. 30 0.014 0.028 4000 2300 BLM21PG300SN1B BLM21PG600SN1D *1 *1 60±25％ 60 0.02 0.04 3500 1900 BLM21PG600SN1B BLM21PG121SN1D *1 *1 120±25％ 120 0.03 0.06 3000 1550 BLM21PG121SN1B BLM21PG221SN1D *1 *1 220±25％ 220 0.045 0.09 2000 1250 BLM21PG221SN1B BLM21PG331SN1D *1 *1 330±25％ 330 0.07 0.14 1500 1000 BLM21PG331SN1B BLM21SN300SN1D *1 *1 30±10Ω 30 0.004 0.005 8500 6000 BLM21SN300SN1B BLM21SP700SN1D *1 *1 70±25% 70 0.009 0.012 6000 4000 BLM21SP700SN1B BLM21SP111SN1D *1 *1 110±25% 110 0.013 0.016 5000 3300 BLM21SP111SN1B BLM21SP181SN1D *1 *1 180±25% 180 0.020 0.025 4000 2600 BLM21SP181SN1B BLM21RK121SN1D 120±25% 120 200 0.15 0.25 BLM21RK121SN1B BLM21RK221SN1D 220±25% 220 200 0.20 0.30 BLM21RK221SN1B BLM21RK471SN1D 470±25% 470 200 0.25 0.35 BLM21RK471SN1B BLM21RK601SN1D 600±25% 600 200 0.30 0.40 BLM21RK601SN1B BLM21RK102SN1D 1000±25% 1000 200 0.50 0.60 BLM21RK102SN1B MURATA MFG.CO., LTD. Remark For DC power line For Digital Interface Spec. No. JENF243A-0005Y-01 Customer Part Number Reference Only MURATA Part Number BLM21BB050SN1D BLM21BB050SN1B BLM21BB600SN1D BLM21BB600SN1B BLM21BB750SN1D BLM21BB750SN1B BLM21BB121SN1D BLM21BB121SN1B BLM21BD121SN1D BLM21BD121SN1B BLM21BB151SZ1D BLM21BB151SZ1B BLM21BD151SN1D BLM21BD151SN1B BLM21BB201SN1D BLM21BB201SN1B BLM21BB221SN1D BLM21BB221SN1B BLM21BD221SN1D BLM21BD221SN1B BLM21BB331SN1D BLM21BB331SN1B BLM21BD331SN1D BLM21BD331SN1B BLM21BD421SN1D BLM21BD421SN1B BLM21BB471SN1D BLM21BB471SN1B BLM21BD471SN1D BLM21BD471SN1B BLM21BD601SN1D BLM21BD601SN1B BLM21BD751SN1D BLM21BD751SN1B BLM21BD102SN1D BLM21BD102SN1B BLM21BD152SN1D BLM21BD152SN1B BLM21BD182SN1D BLM21BD182SN1B BLM21BD222SN1L BLM21BD222SN1B BLM21BD222TN1D BLM21BD222TN1B BLM21BD272SN1L BLM21BD272SN1B Total page 3/16 P.2/11 DC Resistance Impedance (Ω) (Ω) max. (at 100MHz,Under Standard Rated Current Testing Condition) Initial Values (mA) Values After Typical Testing 5±25％ 5 1000 0.02 0.04 60±25％ 60 800 0.13 0.23 75±25％ 75 700 0.16 0.26 120±25％ 120 600 0.19 0.29 120±25％ 120 350 0.25 0.35 150±25％ 150 600 0.21 0.31 150±25％ 150 350 0.25 0.35 200±25％ 200 500 0.26 0.36 220±25％ 220 500 0.26 0.36 220±25% 220 350 0.25 0.35 330±25％ 330 400 0.33 0.43 330±25% 330 300 0.3 0.4 420±25% 420 300 0.3 0.4 470±25％ 470 400 0.40 0.50 470±25% 470 300 0.35 0.45 600±25% 600 300 0.35 0.45 750±25% 750 250 0.4 0.5 1000±25% 1000 250 0.4 0.5 1500±25% 1500 250 0.45 0.55 1800±25% 1800 250 0.5 0.6 1600 min. 2250 250 0.6 0.7 2200±25% 2200 200 0.6 0.7 2700±25% 2700 200 0.8 0.9 MURATA MFG.CO., LTD. Remark For high speed signal line Spec. No. JENF243A-0005Y-01 Customer Part Number Reference Only MURATA Part Number Total page 3/16 P.3/11 DC Resistance Impedance (Ω) (Ω) max. (at 100MHz,Under Standard Rated Current Testing Condition) Initial Values (mA) Values After Typical Testing BLM21AG121SN1D BLM21AG121SN1B BLM21AG151SN1D BLM21AG151SN1B BLM21AG221SN1D BLM21AG221SN1B BLM21AG331SN1D BLM21AG331SN1B BLM21AG471SN1D BLM21AG471SN1B BLM21AG601SN1D BLM21AG601SN1B BLM21AG102SN1D BLM21AG102SN1B 120±25％ 120 1000 0.09 0.19 150±25％ 150 1000 0.09 0.19 220±25％ 220 900 0.12 0.22 330±25％ 330 800 0.15 0.25 470±25％ 470 700 0.18 0.28 600±25％ 600 700 0.2 0.3 1000±25％ 1000 600 0.27 0.37 For general use • Storage Temperature : -55°C to +125°C R a te d C u rr e n t ( A ) • Operating Temperature : -55°C to +125°C Remark (Note)As for Rated current marked with *1, Rated Current is derated as right figure depending on the operating temperature. 85℃ x Describe the Rated current as x[A] in case of more than 1A. 1 125℃ 0 85 125 Operating Temperature (°C) 4. Style and Dimensions L W ■ Equivalent Circuit T E :Electrode ( ) Resistance element becomes dominant at high frequencies. ■ Unit Mass (Typical value) 0.010g 0.014g ( for 21BD222SN1□/21BD272SN1 □) L 2.0±0.2 W T E 0.85±0.2 0.5±0.2 1.25±0.2 for 21BD222SN1□ 21BD272SN1□ for 21BD272SN1□ 1.25±0.2 0.3±0.2 (in mm) 5. Marking No marking. 6.Standard Testing Conditions < Unless otherwise specified > Temperature : Ordinary Temp. (15 °C to 35 °C ) Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) < In case of doubt > Temperature : 20°C±2 °C Humidity : 60%(RH) to 70%(RH) Atmospheric pressure : 86kPa to 106kPa MURATA MFG.CO., LTD. Spec. No. JENF243A-0005Y-01 Reference Only P.4/11 7. Specifications 7-1.Electrical Performance No. Item 7-1-1 Impedance Specification Meet item 3. 7-1-2 DC Resistance Meet item 3. Test Method Measuring Frequency : 100MHz±1MHz Measuring Equipment : KEYSIGHT4291A or the equivalent Test Fixture : KEYSIGHT16192A or the equivalent Measuring Equipment : Digital multi meter * Except resistance of the Substrate and Wire 7-2. Mechanical Performance No. Item 7-2-1 Appearance and Dimensions 7-2-2 Bonding Strength Specification Meet item 4. Test Method Visual Inspection and measured with Slide Calipers. Meet Table 1. It shall be soldered on the substrate. Applying Force(F) : 9.8N Applying Time : 5s±1s Applied direction:Parallel to substrate Table 1 Appearance Impedance Change (at 100MHz) DC Resistance No damage Side view Ｆ Within ±30% Ｆ R0.5 Meet item 3. Substrate 7-2-3 Bending Strength It shall be soldered on the substrate. Substrate: Glass-epoxy 100mm×40mm×1.6mm Deflection: 1.0mm Speed of Applying Force : 0.5mm/s Pressure jig Keeping Time : 30s R340 F Deflection 45mm 7-2-4 Vibration 7-2-5 Resistance to Soldering Heat 7-2-6 Drop 7-2-7 Solderability Meet Table 2. Table 2 Appearance No damage Impedance Within ±30% Change (for BLM21SN (at 100MHz) Within ±50%) DC Meet item 3. Resistance Products shall be no failure after tested. The electrodes shall be at least 95% covered with new solder coating. 45mm Product It shall be soldered on the substrate. Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min Total Amplitude : 1.5mm Testing Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 h) Pre-Heating : 150°C±10°C, 60s～90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 270°C±5°C Immersion Time : 10s±0.5s Immersion and emersion rates : 25mm/s Then measured after exposure in the room condition for 48h±4h. It shall be dropped on concrete or steel board. Method : free fall Height : 75cm Attitude from which the product is dropped : 3 direction The number of times : 3 times for each direction(Total 9 times) Flux : Ethanol solution of rosin,25(wt)% Pre-Heating : 150°C±10°C, 60s～90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 240°C±5°C Immersion Time : 4s±1s Immersion and emersion rates : 25mm/s MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-0005Y-01 P.5/11 7-3. Environmental Performance It shall be soldered on the substrate. No. Item Specification 7-3-1 Temperature Meet Table 2. Cycle Test Method 1 cycle :1 step : -55 °C(+0 °C,-3 °C) / 30min±3min 2 step : Ordinary temp. / 10min to 15min 3 step : +125 °C(+3 °C,-0 °C) / 30min±3min 4 step : Ordinary temp. / 10min to 15min Total of 100 cycles Then measured after exposure in the room condition for 48h±4h. Temperature : 40°C±2°C Humidity : 90%(RH) to 95%(RH) Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 48h±4h. Temperature : 125°C±3°C (in case of Rated current is more than 1A, do the test at : +85 °C±3°C) Applying Current : Rated Current Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 48h±4h. Temperature : -55°C±2°C Total page 6/16 Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 48h±4h. 7-3-2 Humidity 7-3-3 Heat Life 7-3-4 Cold Resistance 8. Specification of Packaging 8-1. Appearance and Dimensions Appearance and Dimensions Part Number Type BLM21 except 21BD222SN1L 21BD272SN1L 8mmwide Paper tape 1.1 max. 8mmBLM21BD222SN1L wide BLM21BD272SN1L Plastic tape 1.3 ±0.1 +0.1 2.25±0.1 3.5±0.05 φ 1.5 -0 Plastic Tape a 0.2±0.1 Paper Tape 8.0±0.3 2.0±0.05 4.0±0.1 4.0±0.1 1.75±0.1 a 1.45±0.1 There are holes in the cavity of the Plastic tape φ 1.0 +0.3 -0 Direction of feed a *Dimension of the Cavity is measured at the bottom side. (in mm) Paper tape Plastic tape Products shall be packaged in the cavity of the base Products shall be packaged in the each embossed cavity of 8mm-wide, 4mm-pitch plastic tape tape of 8mm-wide, 4mm-pitch continuously and continuously and sealed by cover tape. sealed by top tape and bottom tape. Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. Spliced point The base tape and top tape have no spliced point. The cover tape has no spliced point. － Cavity There shall not be burr in the cavity. Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, Missing components and are not continuous. The specified quantity per reel is kept. number Taping MURATA MFG.CO., LTD. Spec. No. JENF243A-0005Y-01 Reference Only P.6/11 8-2. Tape Strength (1)Pull Strength Top tape Bottom tape Plastic tape Cover tape Paper tape Plastic tape 5N min. 5N min. 10N min. (2) Peeling off force of Top tape･Cover tape Speed of Peeling off 300mm/min 0.1N to 0.6N 0.2N to 0.7N Paper tape Plastic tape * Minimum value is typical. • Case of Paper tape Peeling off force * 165 to 180 degree • Case of Plastic tape Top tape 165 to 180 degree F Bottom tape F Base tape Cover tape Plastic tape 8-3. Taping Condition (1) Standard quantity per reel Type BLM21(except 21BD222SN1L/21BD272SN1L) BLM21BD222SN1L/BLM21BD272SN1L Quantity per 180mm reel 4000 pcs. / reel 3000 pcs. / reel (2) There shall be leader-tape (cover tape/top tape and empty tape ) and trailer- tape(empty tape) as follows. (3) On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape for more than 5 pitch. (4) Marking for reel The following items shall be marked on a label and the label is stuck on the reel. (Customer part number, MURATA part number, Inspection number(∗1) , RoHS marking(∗2), Quantity, etc) ∗1) « Expression of Inspection No. » □□ OOOO ××× (1) Factory Code (2) Date (3) Serial No. (1) (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digit : Day ∗2) « Expression of RoHS marking » ROHS – Y (△) (1) RoHS regulation conformity parts. (2) MURATA classification number (1) (2) (5) Outside package These reels shall be packed in the corrugated cardboard package and the following items shall be marked on a label and the label is stuck on the box. (Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (∗2) ,Quantity, etc) (6) Dimensions of reel and taping(leader-tape, trailer-tape) Trailer 2.0±0.5 160 min. Leader Label 190 min. Empty tape 210 min. Top tape ･･･Paper tape Cover tape･･･Plastic tape φ 13.0±0.2 φ 60 +1 -0 φ 21.0±0.8 9.0 +1 -0 Direction of feed 13.0±1.4 φ 180 +0 -3 (in mm) MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-0005Y-01 P.7/11 8-4. Specification of Outer Case Label H D W Outer Case Dimensions Standard Reel Quantity in Outer Case (mm) (Reel) W D H 186 186 93 5 ∗ Above Outer Case size is typical. It depends on a quantity of an order. 9. ！ Caution 9-1. Surge current Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise. Please contact us in advance in case of applying the surge current. 9-2. Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Disaster prevention / crime prevention equipment (2) Aerospace equipment (7) Traffic signal equipment (3) Undersea equipment (8) Transportation equipment (trains,ships,etc.) (4) Power plant control equipment (9) Data-processing equipment (5) Medical equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the above 10. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 10-1. Land pattern designing • Standard land dimensions < BLM21 series(except BLM21PG/BLM21S type) > Chip Ferrite Bead 1.0 1.2 Total page 8/16 Solder Resist 3.0 to 4.0 Pattern (in mm) < For BLM21PG/BLM21S type > Chip Ferrite Bead Land pad thickness and dimension a 18µm 35µm 70µm 1.0 1.0 1.0 1.2 1.0 1.0 2.4 1.2 1.0 6.4 3.3 1.65 6.8 3.4 (in mm) *The excessive heat by land pads may cause deterioration at joint of products with substrate. Rated Current (A) 1.5 2 BLM21PG 3～4 6 BLM21S 6～8.5 Type a 1.0 1.2 3.0 to 4.0 Solder Resist Pattern MURATA MFG.CO., LTD. Spec. No. JENF243A-0005Y-01 Reference Only P.8/11 10-2. Soldering Conditions Products can be applied to reflow and flow soldering. (1) Flux, Solder Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. ) Do not use water-soluble flux. Solder Use Sn-3.0Ag-0.5Cu solder Standard thickness of solder paste : 100 µm to 200 μm (2) Soldering conditions • Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100℃ max. Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. • Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. (3) soldering profile □Flow soldering profile Temp. (℃) 265℃±3℃ 250℃ Limit Profile 150 Heating Time 60s min. Pre-heating Heating Cycle of flow Standard Profile Time. (s) Standard Profile 150℃、60s min. 250℃、4～6s 2 times Limit Profile 265℃±3℃、5s max. 2 times □Reflow soldering profile Temp. (℃) 260℃ 245℃±3℃ 220℃ 230℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Standard Profile 150～180°C 、90s±30s above 220°C、30s～60s 245±3°C 2 times Time. (s) Limit Profile above 230°C、60s max. 260°C,10s 2 times MURATA MFG.CO., LTD. Spec. No. JENF243A-0005Y-01 Reference Only P.9/11 10-3. Reworking with soldering iron • Pre-heating: 150°C, 1 min • Tip temperature: 350°C max. • Soldering time : 3(+1,-0) seconds. • Soldering iron output: 80W max. • Tip diameter:φ3mm max. • Times : 2times max. Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ferrite material due to the thermal shock. 10-4. Solder Volume Solder shall be used not to be exceed as shown below. Upper Limit Recommendable 1/3T≦t≦T (T:Chip thickness) Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. t Total page 10-5. Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subjected to the mechanical stress for board warpage. a b 〈 Poor example 〉 Products shall be located in the sideways direction (Length:a D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. MURATA MFG.CO., LTD. Stress Level A > D *1 A > B A > C Reference Only Spec. No. JENF243A-0005Y-01 P.10/11 (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended 10-6. Mounting density Add special attention to radiating heat of products when mounting the inductor near the products with heating. The excessive heat by other products may cause deterioration at joint of this product with substrate. 10-7. Operating Environment Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use. (1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. (3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew. 10-8. Resin coating The impedance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 10-9. Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.) (2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon at the mounted products and P.C.B. Power:20W/ max. Frequency:28kHz to 40kHz Time:5 min max. (3) Cleaner 1.Alternative cleaner •Isopropyl alcohol (IPA) 2.Aqueous agent •PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 10-10. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting MURATA MFG.CO., LTD. Spec. No. JENF243A-0005Y-01 Reference Only P.11/11 10-11 Storage Conditions (1) Storage period Use the products within 6 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions • Products should be stored in the warehouse on the following conditions. Temperature : -10°C to 40°C Humidity : 15% to 85% relative humidity No rapid change on temperature and humidity • Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. • Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. • Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. • Products should be stored under the airtight packaged condition. (3) Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 11. ! Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the agreed specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD.