BLM21PG220BH1D

Spec. No. JENF243A-9131B-01 Reference Only P.1/9 Chip Ferrite Bead BLM21□□□□□BH1□ Murata Standard Reference Specification[AEC-Q200] 1. Scope This reference specification applies to Chip Ferrite Bead for Automotive Electronics BLM21_BH Series based on AEC-Q200. 2. Part Numbering (ex.) BL M 21 AG 121 B H 1 D (1) (2) (3) (4) (5) (6) (7) (8) (9) (1)Product ID (7)Category (for Automotive Electronics) (2)Type (8)Numbers of Circuit (3)Dimension (L×W) (9)Packaging (4)Characteristics (5)Typical Impedance at 100MHz (6)Performance 3. Rating Customer Part Number MURATA Part Number DC Resistance (Ω) max. (refer to below comment) Initial Values Values After at at at Typical Testing 85℃ 125℃ 150℃ 22 3300 10 0.009 0.018 30 2300 10 0.014 0.028 60 1900 10 0.02 0.04 120 1550 10 0.03 0.06 220 1250 10 0.045 0.09 330 1000 10 0.07 0.14 70 6000 4000 10 0.009 0.012 110 5000 3300 10 0.013 0.016 180 4000 2600 10 0.020 0.025 330 2800 1900 10 0.040 0.051 470 2500 1700 10 0.050 0.063 600 2300 1500 10 0.060 0.074 1000 1600 1100 10 0.120 0.144 120 1000 10 0.09 0.19 150 1000 10 0.09 0.19 220 900 10 0.12 0.22 330 800 10 0.15 0.25 470 700 10 0.18 0.28 600 700 10 0.2 0.3 1000 600 10 0.27 0.37 • Storage Temperature : -55°C to +150°C Impedance (Ω) (at 100MHz) (refer to below comment) BLM21PG220BH1D 22±25% BLM21PG300BH1D 20 min. BLM21PG600BH1D 60±25% BLM21PG121BH1D 120±25％ BLM21PG221BH1D 220±25% BLM21PG331BH1D 330±25% BLM21SP700BH1D 70±25% BLM21SP111BH1D 110±25% BLM21SP181BH1D 180±25% BLM21SP331BH1D 330±25% BLM21SP471BH1D 470±25% BLM21SP601BH1D 600±25% BLM21SP102BH1D 1000±25% BLM21AG121BH1D 120±25% BLM21AG151BH1D 150±25% BLM21AG221BH1D 220±25% BLM21AG331BH1D 330±25% BLM21AG471BH1D 470±25% BLM21AG601BH1D 600±25% BLM21AG102BH1D 1000±25% • Operating Temperature : -55°C to +150°C Rated Current (mA) *1 ESD Rank 2:2kV 6:25kV 6 2 (Note) As for Rated currentmarked with *1, Rated Current is derated as below figure depending on the operating temperature. *BLM21SP Rated current at 125℃ 85°C Rated current at 150℃ 125°C 0 85 125 15℃ 125 150 150 Rated Current (A) R a te d C u rre n t ( A ) *BLM21AG/PG Rated Current at 85℃ Rated Current at 125℃ Rated Current Operating Temperature (°C) Keep the temperature (ambient temperature plus self-generation of heat) under 155℃. MURATA MFG.CO., LTD. at 150℃ 0 85 125 Operating Temperature(℃) 150 Spec. No. JENF243A-9131B-01 Reference Only P.2/9 4. Style and Dimensions L W ■ Equivalent Circuit T E ( :Electrode ) Resistance element becomes dominant at high frequencies. ■ Unit Mass (Typical value) 0.010g L 2.0±0.2 W 1.25±0.2 T 0.85±0.2 E 0.5±0.2 (in mm) 5. Marking No marking. 6.Standard Testing Conditions < Unless otherwise specified > Temperature : Ordinary Temp. (15 °C to 35 °C ) Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) < In case of doubt > Temperature : 20°C±2 °C Humidity : 60%(RH) to 70%(RH) Atmospheric pressure : 86kPa to 106kPa 7. Specifications 7-1. Electrical Performance No. Item 7-1-1 Impedance Specification Meet item 3. 7-1-2 DC Resistance Meet item 3. Test Method Measuring Frequency : 100MHz±1MHz Measuring Equipment : KEYSIGHT 4991A or the equivalent Test Fixture :KEYSIGHT 16197A or the equivalent Measuring Equipment : Digital multi meter *Except resistance of the Substrate and Wire 7-2. Mechanical Performance (based on Table 13 for FILTER EMI SUPPRESSORS/FILTERS) AEC-Q200 Rev.D issued June. 1 2010 AEC-Q200 No Stress Test Method 3 High 1000hours at 150 deg C Temperature Set for 24hours at room Exposure temperature, then measured. 4 Temperature Cycling 5 Destructive Physical Analysis 1000cycles -55 deg C to +150 deg C Set for 24hours at room temperature, then measured. Per EIA469 No electrical tests Murata Specification / Deviation Meet Table A after testing. Table A Appearance Impedance Change (at 100MHz) DC Resistance Meet Table B after testing. Table B Appearance Impedance Change (at 100MHz) DC Resistance No defects MURATA MFG.CO., LTD. No damage Within ±30% Meet item 3. No damage Within ±50% Meet item 3. Spec. No. JENF243A-9131B-01 Reference Only AEC-Q200 No Stress 7 Biased Humidity Test Method 1000hours at 85 deg C, 85%RH Apply max rated current. P.3/9 Murata Specification / Deviation Meet Table B after testing. 8 Operational Life Apply 150 deg C 1000hours Meet Table B after testing. Set for 24hours at room If the rated current of parts exceed 10mA, temperature, then measured the operating temperature should be 85 deg C or 125 deg C. 9 External Visual Visual inspection No abnormalities 10 Physical Dimension Meet ITEM 4 （Style and Dimensions） No defects 12 Resistance to Solvents Per MIL-STD-202 Method Not Applicable 215 13 Mechanical Shock Per MIL-STD-202 Method Meet Table A after testing. 213 Condition F: 1500g’s(14.7N)/0.5ms/ Half sine 14 Vibration 5g's(0.049N) for 20 minutes, Meet Table A after testing. 12cycles each of 3 orientations Test from 10-2000Hz. 15 Resistance Solder temperature Pre-heating:150C +/-10 deg,60s to 90s to Soldering Heat 260C+/-5 deg C Meet Table B after testing. Immersion time 10s 17 ESD Per AEC-Q200-002 Meet Table B after testing. ESD Rank: Refer to Item 3. Rating 18 Solderability Per J-STD-002 Method b : Not Applicable 95% of the terminations is to be soldered. 19 Electrical Measured : Impedance No defects Characterization 20 Flammability Per UL-94 Not Applicable 21 Board Flex Epoxy-PCB(1.6mm) Deflection 2mm(min) 60s minimum holding time Per AEC-Q200-006 Meet Table A after testing. Per ISO-7637-2 Not Applicable 22 Terminal Strength 30 Electrical Transient Conduction No defects MURATA MFG.CO., LTD. 2.0±0.05 4.0±0.1 4.0±0.1 +0.1 2.25±0.1 1.85±0.1 3.5±0.05 φ 1.5 -0 8.0±0.3 8. Specification of Packaging 8-1. Appearance and Dimensions P.4/9 1.75±0.1 Reference Only Spec. No. JENF243A-9131B-01 1.05±0.1 1.45±0.1 1.1max. 1.1 max. (in mm) Direction of feed (1) Taping Products shall be packaged in the cavity of the basetape of 8mm-wide, 4mm-pitch continuously and sealed by top tape and bottom tape. (2) The sprocket holes are to the right as the tape is pulled towardthe user. (3) Spliced point:The base tape and top tape have no spliced point (4) Cavity:There shall not be burr in the cavity. (5) Missing components number Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 8-2. Tape Strength 165 to 180 degree (1) Pull Strength Top tape Bottom tape Top tape F 5N min. Bottom tape Base tape (2) Peeling off force of Top tape 0.1N to 0.6N (Minimum value is typical.) *Speed of Peeling off:300mm/min 8-3. Taping Condition (1)Standard quantity per reel Quantity per 180mm reel: 4000 pcs. / reel (2) There shall be leader-tape (cover tape/top tape and empty tape ) and trailer- tape(empty tape) as follows. (3) On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape for more than 5 pitch. (4) Marking for reel The following items shall be marked on a label and the label is stuck on the reel. (Customer part number, MURATA part number, Inspection number(∗1) , RoHS marking(∗2) , Quantity, etc) ∗1) « Expression of Inspection No. » □□ OOOO ××× (1) (1) Factory Code (2) Date (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digit : Day (3) Serial No. ∗2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number (5) Outside package These reels shall be packed in the corrugated cardboard package and the following items shall be marked on a label and the label is stuck on the box. (Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (∗2) ,Quantity, etc) MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-9131B-01 P.5/9 (6) Dimensions of reel and taping(leader-tape, trailer-tape) Trailer 160 min. 2.0±0.5 Leader Label 190 min. Empty tape 210 min. Top tape φ 13.0±0.2 +1 φ 60 -0 φ 21.0±0.8 9.0 +1 -0 Direction of feed 13.0±1.4 +0 φ 180 -3 (in mm) 8-4. Specification of Outer Case Label H D W Outer Case Dimensions Standard Reel Quantity in Outer Case (mm) (Reel) W D H 186 186 93 5 ∗ Above Outer Case size is typical. It depends on a quantity of an order. 9. ！ Caution 9-1. Rating Do not exceed maximum rated current of the product.Thermal stress may be transmitted to the product and short/open circuit of the product or falling off the product may be occurred. 9-2. Surge current Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise. Please contact us in advance in case of applying the surge current. 9-3. Fail Safe Be sure to provide anappropriate fail-safe function on your product to prevent from a second damage that may be caused by the abnormal function or the failure of our products. 9-4. Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1)Aircraft equipment (6)Disaster prevention / crime prevention equipment (2)Aerospace equipment (7)Traffic signal equipment (3)Undersea equipment (8)Transportation equipment (trains,ships,etc.) (4) Power plant control equipment (9) Data-processing equipment (5) Medical equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the above MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-9131B-01 P.6/9 10. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 10-1. Land pattern designing • Standard land dimensions < BLM21AG series> Chip Ferrite Bead Type BLM21AG c a Solder Resist b Pattern Soldering Flow Reflow a 1.1 1.2 b 3.5 2.4 c 0.95 1.25 (in mm) < BLM21PG/SP series > Chip Ferrite Bead Operating Current (A) ～2.0 BLM21PG ～4.0 BLM21SP Type c d Land pad thickness and dimension d 18µm 35µm 70µm 1.25 1.25 1.25 2.4 1.25 1.25 6.8 3.4 (in mm) a b Solder Resist Pattern Type BLM21PG /SP Soldering Flow Reflow a 1.1 1.2 b 3.5 2.4 c 0.95 1.25 (in mm) *The excessive heat by land pads may cause deterioration at joint of products with substrate. 10-2. Soldering Conditions Products can be applied to reflow and flow soldering. (1) Flux,Solder Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. ) Do not use water-soluble flux. Solder Use Sn-3.0Ag-0.5Cu solder Standard thickness of solder paste : 100 µm to 200 μm (2) Soldering conditions • Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100℃ max. Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. • Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-9131B-01 (3) soldering profile □Flow Temp. (℃) 265℃±3℃ 250℃ Limit Profile 150 Heating Time 60s min. Time. (s) Standard Profile 150℃、60s min. 250℃、4～6s 2 times Pre-heating Heating Cycle of flow Standard Profile Limit Profile 265℃±3℃、5s max. 2 times □Reflow soldering profile Temp. (℃) 260℃ 245℃±3℃ 220℃ 230℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Standard Profile 150～180°C 、90s±30s above 220°C、30s～60s 245±3°C 2 times Time. (s) Limit Profile above 230°C、60s max. 260°C,10s 2 times 10-3. Reworking with soldering iron • Pre-heating: 150°C, 1 min • Tip temperature: 350°C max. • Soldering time : 3(+1,-0) seconds. • Soldering iron output: 80W max. • Tip diameter:φ3mm max. • Times : 2times max. Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ferrite material due to the thermal shock. 10-4. Solder Volume Solder shall be used not to be exceed as shown below. Upper Limit Recommendable t 1/3T≦t≦T (T:Chip thickness) Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. MURATA MFG.CO., LTD. P.7/9 Reference Only Spec. No. JENF243A-9131B-01 P.8/9 10-5. Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. a b 〈 Poor example 〉 Products shall be located in the sideways direction (Length:a D *1 A > B A > C C B D A Slit *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended 10-6. Mounting density Add special attention to radiating heat of products when mounting the inductor near the products with heating. The excessive heat by other products may cause deterioration at joint of this product with substrate. 10-7. Operating Environment Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use. (1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.(the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. (3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew. MURATA MFG.CO., LTD. Spec. No. JENF243A-9131B-01 Reference Only P.9/9 10-8. Resin coating The impedance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 10-9. Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.) (2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon at the mounted products and P.C.B. Power:20W/ max. Frequency:28kHz to 40kHz Time:5 min max. (3) Cleaner 1.Alternative cleaner •Isopropyl alcohol (IPA) 2.Aqueous agent •PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 10-10. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 10-11.Storage Conditions (1) Storage period Use the products within 6 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions • Products should be stored in the warehouse on the following conditions. Temperature : -10°C to 40°C Humidity : 15% to 85% relative humidity No rapid change on temperature and humidity • Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. • Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. • Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. • Products should be stored under the airtight packaged condition. (3) Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 11 . ! Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the agreed specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD.