BLM21PG331SZ1D

Spec. No. JENF243A-9114E-01 Reference Only P.1/11 Chip Ferrite Bead BLM21□□□□□□Z1□ Murata Standard Reference Specification[AEC-Q200] 1. Scope This reference specification applies to Chip Ferrite Bead for Automotive Electronics BLM21_SZ Series based on AEC-Q200 except for Power train and Safety. 2. Part Numbering (ex.) BL M 21 AG 121 S Z 1 D (1) (2) (3) (4) (5) (6) (7) (8) (9) (1)Product ID (7)Category (for Automotive Electronics) (2)Type (8)Numbers of Circuit (9)Packaging (3)Dimension (L×Ｗ) (4)Characteristics D:Taping(φ180mm Reel, Paper Tape) (5)Typical Impedance at 100MHz L:Taping(φ180mm Reel, Plastic Tape) (6)Performance 3. Rating Customer Part Number MURATA Part Number BLM21PG220SZ1D BLM21PG300SZ1D BLM21PG600SZ1D BLM21PG121SZ1D BLM21PG221SZ1D BLM21PG331SZ1D BLM21SN300SZ1D BLM21SP700SZ1D BLM21SP111SZ1D BLM21SP181SZ1D BLM21SP331SZ1D BLM21SP471SZ1D BLM21SP601SZ1D BLM21SP102SZ1D DC Resistance (Ω) max. (*1) Rated Current (refer to below ESD Rank (mA)( *2) comment) 2:2kV 6:25kV Initial Values Values After at at Typical Testing 85℃ 125℃ *2 *2 22 0.009 0.018 6000 3300 *2 *2 30 0.014 0.028 4000 2300 *2 *2 60 0.02 0.04 3500 1900 *2 *2 120 0.03 0.06 3000 1550 *2 *2 220 0.045 0.09 2000 1250 *2 *2 330 0.07 0.14 1500 1000 *2 *2 30 0.004 0.005 8500 6000 2 *2 *2 70 0.009 0.012 6000 4000 *2 *2 110 0.013 0.016 5000 3300 *2 *2 180 0.020 0.025 4000 2600 *2 *2 330 0.040 0.051 2800 1900 *2 *2 470 0.050 0.063 2500 1700 *2 *2 600 0.060 0.074 2300 1500 *2 *2 1000 0.120 0.144 1600 1100 Impedance (Ω) (at 100MHz) (*1) (refer to below comment) 22±25% 20 min. 60±25% 120±25％ 220±25% 330±25% 30±10Ω 70±25% 110±25% 180±25% 330±25% 470±25% 600±25% 1000±25% MURATA MFG.CO., LTD. Spec. No. JENF243A-9114E-01 Customer Part Number MURATA Part Number Reference Only Impedance (Ω) (at 100MHz) (*1) (refer to below comment) Rated Current (mA)( *2) DC Resistance (Ω) max. (*1) (refer to below comment) Initial Typical BLM21BB050SZ1D BLM21BB600SZ1D BLM21BB750SZ1D BLM21BB121SZ1D BLM21BD121SZ1D BLM21BB151SZ1D BLM21BD151SZ1D BLM21BB201SZ1D BLM21BB221SZ1D BLM21BD221SZ1D BLM21BB331SZ1D BLM21BD331SZ1D BLM21BD421SZ1D BLM21BB471SZ1D BLM21BD471SZ1D BLM21BD601SZ1D BLM21BD751SZ1D BLM21BD102SZ1D BLM21BD152SZ1D BLM21BD182SZ1D BLM21BD222SZ1L BLM21BD222TZ1D BLM21BD272SZ1L BLM21AG121SZ1D BLM21AG151SZ1D BLM21AG221SZ1D BLM21AG331SZ1D BLM21AG471SZ1D BLM21AG601SZ1D BLM21AG102SZ1D • Operating Temperature : -55°C to +125°C Values at at 85℃ 125℃ Values After Testing 5±25% 5 1000 0.02 0.04 60±25% 60 800 0.13 0.23 75±25% 75 700 0.16 0.26 120±25% 120 600 0.19 0.29 120±25% 120 350 0.25 0.35 150±25% 150 600 0.21 0.31 150±25% 150 350 0.25 0.35 200±25% 200 500 0.26 0.36 220±25% 220 500 0.26 0.36 220±25% 220 350 0.25 0.35 330±25% 330 400 0.33 0.43 330±25% 330 300 0.3 0.4 420±25% 420 300 0.3 0.4 470±25% 470 400 0.4 0.5 470±25% 470 300 0.35 0.45 600±25% 600 300 0.35 0.45 750±25% 750 250 0.4 0.5 1000±25% 1000 250 0.4 0.5 1500±25% 1500 250 0.45 0.55 1800±25% 1800 250 0.5 0.6 1600 min. 2250 250 0.6 0.7 2200±25% 2200 200 0.6 0.7 2700±25% 2700 200 0.8 0.9 120±25% 120 1000 0.09 0.19 150±25% 150 1000 0.09 0.19 220±25% 220 900 0.12 0.22 330±25% 330 800 0.15 0.25 470±25% 470 700 0.18 0.28 600±25% 600 700 0.2 0.3 1000±25% 1000 600 0.27 0.37 • Storage Temperature : -55°C to +125°C P.2/11 ESD Rank 2:2kV 6:25kV 2 (*1) Standard Testing Conditions (Note)As for Rated currentmarked with *2, Rated Current is derated as right figure depending on the operating temperature. < In case of doubt > Temperature : 20°C±2 °C Humidity : 60%(RH) to 70%(RH) Atmospheric pressure : 86kPa to 106kPa R a te d C u rr e n t ( A ) < Unless otherwise specified > Temperature : Ordinary Temp. (15 °C to 35 °C ) Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) 85℃ x Describe the Rated current as x[A] in case of more than 1A. 1 125℃ 0 85 125 Operating Temperature (°C) MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-9114E-01 P.3/11 4. Style and Dimensions L W ■ Equivalent Circuit T E :Electrode ( ) Resistance element becomes dominant at high frequencies. ■ Unit Mass (Typical value) 0.010g 0.014g ( for 21BD222SZ1□/21BD272SZ1 □) L 2.0±0.2 W T E 0.85±0.2 0.5±0.2 1.25±0.2 for 21BD222SZ1□ 21BD272SZ1□ for 21BD272SZ1□ 1.25±0.2 0.3±0.2 (in mm) 5. Marking No marking. 6. Specifications 6-1. Electrical Performance No. Item 6-1-1 Impedance Specification Meet item 3. 6-1-2 DC Resistance Meet item 3. Test Method Measuring Frequency : 100MHz±1MHz Measuring Equipment : KEYSIGHT4291A or the equivalent Test Fixture : KEYSIGHT16192A or the equivalent Measuring Equipment : Digital multi meter *Except resistance of the Substrate and Wire 6-2. Mechanical Performance (based on Table 13 for FILTER EMI SUPPRESSORS/FILTERS) AEC-Q200 Rev.D issued June. 1 2010 AEC-Q200 No. Stress Test Method 3 High 1000hours at 125 deg C Temperature Set for 24hours at room Exposure temperature, then measured. 4 Temperature Cycling 5 Destructive Physical Analysis 7 Biased Humidity Murata Specification / Deviation Meet Table A after testing. Table A Appearance No damage Impedance Within ±30% Change (for BLM21SN within±50%) (at 100MHz) DC Meet item 3. Resistance 1000cycles -55 deg C to +125 deg C Set for 24hours at room temperature, then measured. Per EIA469 No electrical tests Meet Table A after testing. 1000hours at 85 deg C, 85%RH Apply max rated current. Meet Table A after testing. No defects MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-9114E-01 AEC-Q200 Stress No. P.4/11 Murata Specification / Deviation Test Method 8 Operational Life Apply 125 deg C 1000hours Set for 24hours at room temperature, then measured Meet Table A after testing. If the rated current of parts exceed 1A, the operating temperature should be 85 deg C. 9 External Visual Visual inspection No abnormalities 10 Physical Dimension Meet ITEM 4 No defects （Style and Dimensions） 12 Resistance to Solvents Per MIL-STD-202 Method Not Applicable 215 13 Mechanical Shock Per MIL-STD-202 Method Meet Table B after testing. 213 Table B Condition F: Appearance 1500g’s(14.7N)/0.5ms/ Impedance Half sine Change (at 100MHz) DC Resistance 14 Vibration 5g's(0.049N) for 20 Meet Table B after testing. minutes, 12cycles each of 3 orientations Test from 10-2000Hz. 15 Resistance to Soldering Heat 17 ESD Solder temperature 260C+/-5 deg C Immersion time 10s Per AEC-Q200-002 18 Solderability Per J-STD-002 19 Electrical Characterization Measured : Impedance 20 21 Flammability Board Flex 22 Terminal Strength Per UL-94 Not Applicable Epoxy-PCB(1.6mm) Meet Table B after testing. Deflection 2mm(min) 60s minimum holding time Per AEC-Q200-006 No defects 30 Electrical Transient Conduction Per ISO-7637-2 No damage Within ±30% Meet item 3. Pre-heating:150C +/-10 deg,60s to 90s Meet Table A after testing. Meet Table A after testing. ESD Rank: Refer to Item 3. Rating Method b : Not Applicable 95% of the terminations is to be soldered. No defects Not Applicable MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-9114E-01 P.5/11 7. Specification of Packaging 7-1. Appearance and Dimensions Appearance and Dimensions a 2.0±0.05 4.0±0.1 +0.1 4.0±0.1 8mmBLM21BD222SZ1L wide BLM21BD272SZ1L Plastic tape 1.1 max. 3.5±0.05 8mmwide Paper tape 2.25±0.1 BLM21 except 21BD222SZ1L 21BD272SZ1L φ 1.5 -0 Plastic Tape a Paper Tape 0.2±0.1 8.0±0.3 Type 1.75±0.1 Part Number 1.45±0.1 1.3 ±0.1 There are holes in the cavity of the Plastic tape φ 1.0 +0.3 -0 Direction of feed a *Dimension of the Cavity is measured at the bottom side. (in mm) Paper tape Plastic tape Products shall be packaged in the cavity of the base Products shall be packaged in the each embossed tape of 8mm-wide, 4mm-pitch continuously and cavity of 8mm-wide, 4mm-pitch plastic tape sealed by top tape and bottom tape. continuously and sealed by cover tape. Sprocket hole Sprocket hole shall be located on the left hand side toward the direction of feed. Spliced point The base tape and top tape have no spliced point. The cover tape has no spliced point. Cavity There shall not be burr in the cavity. － Missing Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, components and are not continuous. The specified quantity per reel is kept. number Taping 7-2. Tape Strength (1) Pull Strength Paper tape Plastic tape Top tape Bottom tape Plastic tape Cover tape 5N min. 5N min. 10N min. (2) Peeling off force of Top tape･Cover tape Speed of Peeling off Paper tape Peeling off force * Plastic tape * Minimum value is typical. • Case of Paper tape 165 to 180 degree Bottom tape Top tape F 300mm/min 0.1N to 0.6N 0.2N to 0.7N • Case of Plastic tape 165 to 180 degree Base tape MURATA MFG.CO., LTD. F Cover tape Plastic tape Reference Only Spec. No. JENF243A-9114E-01 P.6/11 7-3. Taping Condition (1) Standard quantity per reel Type BLM21(except 21BD222SZ1L/21BD272SZ1L) BLM21BD222SZ1L/BLM21BD272SZ1L Quantity per 180mm reel 4000 pcs. / reel 3000 pcs. / reel (2) There shall be leader-tape (cover tape/top tape and empty tape ) and trailer- tape(empty tape) as follows. (3) On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape for more than 5 pitch. (4) Marking for reel The following items shall be marked on a label and the label is stuck on the reel. (Customer part number, MURATA part number, Inspection number(∗1) , RoHS marking(∗2) , Quantity, etc) ∗1) « Expression of Inspection No. » □□ OOOO ××× (1) Factory Code (2) Date (3) Serial No. (1) (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digit : Day ∗2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number (5) Outside package These reels shall be packed in the corrugated cardboard package and the following items shall be marked on a label and the label is stuck on the box. (Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (∗2) ,Quantity, etc) (6) Dimensions of reel and taping(leader-tape, trailer-tape) Trailer 160 min. 2.0±0.5 Leader Label 190 min. Empty tape 210 min. Top tape ･･･Paper tape Cover tape･･･Plastic tape φ 13.0±0.2 φ 60 +1 -0 φ 21.0±0.8 9.0 +1 -0 Direction of feed 13.0±1.4 φ 180 +0 -3 (in mm) 7-4. Specification of Outer Case Label H D W Outer Case Dimensions Standard Reel Quantity in Outer Case (mm) (Reel) W D H 186 186 93 5 ∗ Above Outer Case size is typical. It depends on a quantity of an order. MURATA MFG.CO., LTD. Spec. No. JENF243A-9114E-01 Reference Only P.7/11 8. ！ Caution 8-1. Rating Do not use products beyond the Operating Temperature Range and Rated Current. 8-2. Surge current Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise. Please contact us in advance in case of applying the surge current. 8-3. Fail Safe Be sure to provide an appropriate fail-safe function on your product to prevent from a second damage that may be caused by the abnormal function or the failure of our products. 8-4. Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Disaster prevention / crime prevention equipment (2) Aerospace equipment (7) Traffic signal equipment (3) Undersea equipment (8) Transportation equipment (trains,ships,etc.) (4) Power plant control equipment (9) Data-processing equipment (5) Medical equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the above 9. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 9-1. Land pattern designing • Standard land dimensions < BLM21 series(except BLM21PG/BLM21S type) > Chip Ferrite Bead c a Solder Resist b Pattern Soldering Flow Reflow a 1.1 1.2 b 3.5 2.4 c 0.95 1.25 (in mm) < For BLM21PG/S type > Chip Ferrite Bead Rated Current (A) 1.5 2 BLM21PG 3~4 6 BLM21S 1~8.5 Type c d a b Land pad thickness and dimension d 18µm 35µm 70µm 1.25 1.25 1.25 1.25 1.25 1.25 2.4 1.25 1.25 6.4 3.3 1.65 6.8 3.4 (in mm) Solder Resist Pattern Soldering Flow Reflow a 1.1 1.2 b 3.5 2.4 c 0.95 1.25 (in mm) *The excessive heat by land pads may cause deterioration at joint of products with substrate. MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-9114E-01 P.8/11 9-2. Soldering Conditions Products can be applied to reflow and flow soldering. (1) Flux,Solder Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. ) Do not use water-soluble flux. Solder Use Sn-3.0Ag-0.5Cu solder Standard thickness of solder paste : 100 µm to 200 μm (2) Soldering conditions • Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100℃ max. Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. • Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. (3) soldering profile □Flow Temp. (℃) 265℃±3℃ 250℃ Limit Profile 150 Heating Time 60s min. Time. (s) Standard Profile 150℃、60s min. 250℃、4～6s 2 times Pre-heating Heating Cycle of flow Standard Profile Limit Profile 265℃±3℃、5s max. 2 times □Reflow soldering profile Temp. (℃) 260℃ 245℃±3℃ 220℃ 230℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Standard Profile 150～180°C 、90s±30s above 220°C、30s～60s 245±3°C 2 times Time. (s) Limit Profile above 230°C、60s max. 260°C,10s 2 times MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-9114E-01 P.9/11 9-3. Reworking with soldering iron • Pre-heating: 150°C, 1 min • Tip temperature: 350°C max. • Soldering time : 3(+1,-0) seconds. • Soldering iron output: 80W max. • Tip diameter:φ3mm max. • Times : 2times max. Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ferrite material due to the thermal shock. 9-4. Solder Volume Solder shall be used not to be exceed as shown below. Upper Limit Recommendable 1/3T≦t≦T (T:Chip thickness) t Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. 9-5. Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. a b 〈 Poor example 〉 Products shall be located in the sideways direction (Length:a D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. MURATA MFG.CO., LTD. Stress Level A > D *1 A > B A > C Spec. No. JENF243A-9114E-01 Reference Only P.10/11 (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended 9-6. Mounting density Add special attention to radiating heat of products when mounting the inductor near the products with heating. The excessive heat by other products may cause deterioration at joint of this product with substrate. 9-7. Operating Environment Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use. (1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. (3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew. 9-8. Resin coating The impedance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 9-9. Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.) (2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon at the mounted products and P.C.B. Power:20W/ max. Frequency:28kHz to 40kHz Time:5 min max. (3) Cleaner 1.Alternative cleaner •Isopropyl alcohol (IPA) 2.Aqueous agent •PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 9-10. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting MURATA MFG.CO., LTD. Spec. No. JENF243A-9114E-01 Reference Only P.11/11 9-11.Storage Conditions (1) Storage period Use the products within 6 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions • Products should be stored in the warehouse on the following conditions. Temperature : -10°C to 40°C Humidity : 15% to 85% relative humidity No rapid change on temperature and humidity • Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. • Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. • Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. • Products should be stored under the airtight packaged condition. (3) Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 10. ! Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the agreed specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD.