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BLM21PG331BH1D

BLM21PG331BH1D

  • 厂商:

    MURATA-PS(村田)

  • 封装:

    0805

  • 描述:

    BLM21PG331BH1D

  • 数据手册
  • 价格&库存
BLM21PG331BH1D 数据手册
Spec No.: JENF243A 9131E-01 P6/10 10.2 Precautions on rating Avoid using in exceeded the rated temperature range, rated voltage, or rated current. Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault. 10.3 Fail-safe Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the abnormal function or the failure of our product. 10.4 Inrush current If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product, overheating could occur, resulting in wire breakage, burning, or other serious fault. 10.5 Corrosive gas Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments. 11. Precautions for Use This product is designed to be mounted by soldering. If you want to use other mounting method, for example, using a conductive adhesive, please consult us beforehand. Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack. The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed. 11.1 Land dimensions The following diagram shows the recommended land dimensions for flow and reflow soldering: Flow Reflow a 1.1 1.2 b 3.5 2.4 c 0.95 1.25 (in mm) a Flow Reflow 1.1 1.2 b 3.5 2.4 c 0.95 1.25 (in mm) Pattern thickness and dimension d Type Rated current (A) 18 μm 35 μm 70 μm BLM21PG to 2 1.25 1.25 1.25 BLM21PG to 4 2.4 1.25 1.25 BLM21SP - - 6.8 3.4 If heat generation from patterns is large, please pay attention since the joint of products with substrates may deteriorate. (in mm) MURATA MFG CO., LTD Spec No.: JENF243A 9131E-01 P10/10 11.8 Cleaning Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken solder joints. Before starting your production process, test your cleaning equipment / process to insure it does not degrade this product. 11.9 Storage and transportation Storage period Use the product within 6 months after delivery. If you do not use the product for more than 6 months, check solderability before using it. Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and humidity. The recommended temperature range is -10°C to +40°C. The recommended relative humidity range is 15% to 85%. Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the poor solderability. • Do not place the products directly on the floor; they should be placed on a palette so that they are not affected by humidity or dust. • Avoid keeping the products in a place exposed to direct sunlight, heat or vibration. • Do not keep products in bulk packaging. Bulk storage could result in collisions between the products or between the products and other parts, resulting in chipping or wire breakage. • Avoid storing the product by itself bare (i.e. exposed directly to air). Transportation Excessive vibration and impact reduces the reliability of the products. Exercise caution when handling the products. 11.10 Resin coating (including moisture-proof coating) When the product is coated/molded with resin, its electrical characteristics may change. A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resins contain impurities or hydrolyzable chlorine, which could result in corrosion of the conducting materials, leading to wire breakage. So, please pay your careful attention when you select resin in case of coating/molding the products with the resin. Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. 11.11 Mounting conditions Check the mounting condition before using. Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products may lead to pick up errors, misalignment, or damage to the product. 11.12 Operating environment Do not use this product under the following environmental conditions as it may cause deterioration of product quality. (1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2, etc) (2) In the atmosphere where liquid such as organic solvent, may splash on the products. (3) In the atmosphere where the temperature/humidity changes rapidly and it is easy to dew. 11.13 Mounting density If this product is placed near heat-generating products, be sure to implement sufficient heat-dissipating measures. If this product is subjected to a significant amount of heat from other products, this could adversely affect product quality, resulting in a circuit malfunction or failure of the mounted section. Also, be sure that the product is used in a manner so that the heat that the product is subjected to from other products does not exceed the upper limit of the rated operating temperature for the product. 12. Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG CO., LTD
BLM21PG331BH1D 价格&库存

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BLM21PG331BH1D
  •  国内价格
  • 500+0.37594
  • 1000+0.36657
  • 2000+0.35720

库存:0

BLM21PG331BH1D
  •  国内价格
  • 4000+0.25618
  • 20000+0.24889

库存:0

BLM21PG331BH1D
  •  国内价格
  • 100+0.38532
  • 500+0.37594
  • 1000+0.36657
  • 2000+0.35720

库存:0