CAT4004AHU2-GT3

DATA SHEET www.onsemi.com Constant Current LED Driver with 32 Dimming Levels and Rset UDFN−8 HU2G SUFFIX CASE 517AW CAT4002A, CAT4004A SC70−6 SD SUFFIX CASE 419AD Description The CAT4002A and CAT4004A provide respectively two and four matched low dropout current sources to drive LEDs. The CAT400XA uses an external resistor RSET to set the current in the LED channels. Each LED channel includes an individual control loop allowing the device to handle a wide range of LED forward voltages while still maintaining tight current matching. The EN/DIM logic inputs supports device enable and a digital dimming interface for setting the LED channel current with 32 linear dimming levels. LEDs can be powered directly from a Lithium−ion battery due to the low dropout (50 mV at 20 mA) current sinks. The device is available in the tiny 8−pad UDFN 2 mm x 2 mm package with a max height of 0.55 mm, as well as the 6−lead SC−70. 1 2 and 4 LED Current Sinks with Tight Matching 32 Dimming Levels Low Dropout Driver 50 mV at 20 mA No Switching Noise Shutdown Current less than 1 mA LED Current set by External Resistor Dimming via 1−wire EZDim Interface Thermal Shutdown Protection 6−lead SC−70, and 8−pad UDFN 2 mm x 2 mm Packages These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant Applications • LCD Display Backlight • Cellular Phones VIN RSET LED4 LED3 EN/DIM GND LED1 LED2 CAT4004A UDFN−8 EN/DIM Features • • • • • • • • • • PIN CONNECTIONS 1 LED1 RSET GND VIN LED2 CAT4002A SC70−6 (Top Views) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet. • Digital Still Cameras • Handheld Devices VIN 2.4 V to 5.5 V 20 mA CIN 1 mF LED1 LED2 LED3 LED4 VIN One wire programming EN/DIM CAT4004A RSET RSET 3.74 kW GND Figure 1. Typical Application Circuit © Semiconductor Components Industries, LLC, 2011 October, 2021 − Rev. 3 1 Publication Order Number: CAT4002A/D CAT4002A, CAT4004A MARKING DIAGRAMS BG A Y M BGA YM VJA UDFN8 (2 x 2 mm) SC70−6 = CAT4004A Device Code = Assembly Location Code = Production Year (last digit) = Production Month: 1 − 9, A, B, C VJ A = CAT4002A Device Code = Assembly Location Code Table 1. ABSOLUTE MAXIMUM RATINGS Parameter VIN, LEDx, RSET EN/DIM Voltage Rating Unit 6 V 6 V Storage Temperature Range −65 to +160 °C Junction Temperature Range −40 to +125 °C 300 °C Lead Temperature Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Table 2. ELECTRICAL OPERATING CHARACTERISTICS (Min and Max values are over recommended operating conditions unless specified otherwise. Typical values are at VIN = 4.0 V, EN/DIM = High, and TAMB = 25°C.) Name Symbol Conditions IQ Quiescent Current No load, RSET = Float No load, RSET = 4.8 kW IQSHDN Shutdown Current VEN/DIM = 0 V ILED LED Current Setting ILED−ACC LED Current Accuracy ILED−DEV LED Channel Matching (Note 1) Min Typ 0.2 0.5 25 RSET = 4.99 kW 15 1 mA ≤ ILED ≤ 40 mA ±1 Units mA 1 RSET = 3.0 kW I LED * I LEDAVG Max mA mA % −5 ±1 +5 0.57 0.6 0.63 % I LEDAVG VRSET RSET pin regulated voltage VDOUT Dropout Voltage (90% of nominal LED current) REN/DIM VHI VLO ILED = 20 mA ILED = 1 mA EN/DIM Pin − Internal pull−down resistor − Logic High Level − Logic Low Level V 50 25 mV 200 kW V V 1.3 0.4 TSD Thermal Shutdown 150 °C THYS Thermal Hysteresis 20 °C VUVLO Undervoltage lockout (UVLO) threshold 2.0 V 1. For CAT4004A, ILEDAVG = (ILED,CH1 + ILED,CH2 + ILED,CH3 + ILED,CH4) / 4 For CAT4002A, ILEDAVG = (ILED,CH1 + ILED,CH2) / 2 www.onsemi.com 2 CAT4002A, CAT4004A Table 3. RECOMMENDED OPERATING CONDITIONS Parameter Rating Unit VIN 2.4 to 5.5 V Ambient Temperature Range −40 to +85 °C 0 to 40 mA ILED per LED pin NOTE: Typical application circuit with external components is shown on page 1. Table 4. RECOMMENDED EN/DIM TIMING (For 2.4 V ≤ VIN ≤ 5.5 V, over full ambient temperature range −40°C to +85°C.) Symbol Name Conditions Min TLO EN/DIM program low time 0.2 THI EN/DIM program high time 0.2 TLED TPWRDWN Typ Max Units 100 ms ms LED current settling time 10 EN/DIM low time to shutdown 3 ms 5 THI EN/DIM TLO TPWRDWN TLED 100% LED Current 100% 97% 94% 32 Levels Shutdown 3% Shutdown 0% Figure 2. CAT400XA EN/DIM Dimming Timing Diagram LED Current Setting Table 5. RSET RESISTOR AND LED CURRENT On the CAT400XA, the full scale LED current is set by the external resistor connected between the RSET pin and ground. Table 5 lists standard resistor values for several LED current settings. When the EN/DIM is initially taken high, the CAT400XA becomes enabled and the LED channel current is set to the full scale current according to the resistor RSET. LED current ≅ 125 x VRSET / RSET Full Scale LED Current [mA] RSET [kW] 2 40.2 5 15.4 10 7.68 15 4.99 20 3.74 25 3.00 30 2.49 40 1.87 www.onsemi.com 3 ms CAT4002A, CAT4004A TYPICAL PERFORMANCE CHARACTERISTICS (CAT4002A, VIN = 4 V, VF = 3.3 V, IOUT = 50 mA (2 LEDs at 25 mA), CIN = 1 mF, TAMB = 25°C unless otherwise specified.) QUIESCENT CURRENT (mA) 1.6 1.2 0.8 0.4 0 LED CURRENT CHANGE (%) 1.4 0 20 40 1.0 0.8 3.5 4.0 4.5 5.0 5.5 Figure 3. Quiescent Current vs. RSET Input Voltage Figure 4. Quiescent Current vs. Input Voltage (Full Load) 1.0 10 8 0.6 0.4 0.2 0 −0.2 −0.4 −0.6 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6 4 2 0 −2 −4 −6 −8 −10 −40 0 40 80 INPUT VOLTAGE (V) TEMPERATURE (°C) Figure 5. LED Current Change vs. Input Voltage Figure 6. LED Current Change vs. Temperature 120 40 25°C 1.0 0.8 LED CURRENT (mA) 1.2 −40°C 80°C 0.6 0.4 3.0 INPUT VOLTAGE (V) 0.8 −0.8 −1.0 2.5 RSET (kW) 1.4 ENABLE HIGH THRESHOLD (V) 1.2 0.6 60 LED CURRENT CHANGE (%) QUIESCENT CURRENT (mA) 2.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 30 20 10 0 5.5 1 10 INPUT VOLTAGE (V) RSET (kW) Figure 7. EN/DIM High Threshold vs. Input Voltage Figure 8. LED Current vs. RSET Resistor www.onsemi.com 4 100 CAT4002A, CAT4004A TYPICAL PERFORMANCE CHARACTERISTICS (CAT4002A, VIN = 4 V, VF = 3.3 V, IOUT = 50 mA (2 LEDs at 25 mA), CIN = 1 mF, TAMB = 25°C unless otherwise specified.) 30 100 25 mA 90 EFFICIENCY (%) LED CURRENT (mA) 25 20 15 10 70 60 5 0 80 1 mA 0 50 100 150 200 250 50 300 5.5 5.0 4.5 4.0 3.5 3.0 2.5 LED PIN VOLTAGE (mV) INPUT VOLTAGE (V) Figure 9. Dropout Characteristics Figure 10. Efficiency vs. Input Voltage Figure 11. Power Up Waveform Figure 12. Power Down Waveform Figure 13. Line Transient Waveform Figure 14. Dimming Levels www.onsemi.com 5 2.0 CAT4002A, CAT4004A Table 6. PIN DESCRIPTIONS Name EN/DIM Function Device enable (active high) and dimming control GND Ground reference LED1 LED1 cathode terminal LED2 LED2 cathode terminal LED3 LED3 cathode terminal (CAT4004A only) LED4 LED4 cathode terminal (CAT4004A only) RSET Connect external RSET resistor to set the LED current VIN Device supply input, connect to battery or supply TAB Connect to GND on the PCB (CAT4004A only) Pin Function LED1 to LED4 provide the internal regulated current for each of the LED cathodes. There pins enter a high impedance zero current state whenver the device is placed in shutdown mode. RSET is connected to the resistor (RSET) to set the full scale current for the LEDs. The voltage at this pin is regulated to 0.6 V. The ground side of the external resistor should be star connected back to the GND of the PCB. In shutdown mode, the RSET input becomes high impedance. GND is the ground reference for the device. The pin must be connected to the ground plane on the PCB. TAB (CAT4004A only) is the exposed pad underneath the package. For best thermal performance, the tab should be soldered to the PCB and connected to the ground plane. VIN is the supply pin for the charge pump. A small 1 mF ceramic bypass capacitor is required between the VIN pin and ground near the device. The operating input voltage range is from 2.5 V to 5.5 V. Whenever the input supply falls below the under−voltage threshold (2.0 V), all the LED channels are disabled and the device enters shutdown mode. EN/DIM is the enable and one wire dimming input for all LED channels. Levels of logic high and logic low are set at 1.3 V and 0.4 V respectively. When EN/DIM is initially taken high, the CAT400XA becomes enabled and the LED channel current is set to the full scale according to the resistor RSET. To place the device into “zero current” shutdown mode, the EN/DIM pin must be held low for 3 ms typical. Block Diagram LED4 LED3 Undervoltage Lockout LED2 VIN LED1 VIN Reference Voltage RSET EN/DIM Current Setting DAC Serial Interface Register 4 Current Sink Regulators 100 kW GND Figure 15. CAT4004A Functional Block Diagram www.onsemi.com 6 CAT4002A, CAT4004A Basic Operation Table 7. DIMMING LEVELS The CAT400XA uses tightly matched current sinks to accurately regulate LED current in each channel proportional to the current sourced from the RSET pin. There are 32 different settings for LED brightness that can be programmed through the EN/DIM pin. Tight current regulation for all channels is possible over a wide range of input and LED voltages due to independent current sensing circuitry on each channel. Each LED channel needs a minimum of 50 mV headroom to sink a constant regulated current of 20 mA. If the input supply falls below 2.0 V typical, the under−voltage lockout circuit disables all LED channels and resets the circuit to default values. Any unused LED channels should be left open. Full Scale (Current in %) Dimming Pulses [n] 100 0 97 1 94 2 90 3 87 4 84 5 81 6 77 7 74 8 LED Current Selection 0.6 V R SET 10 11 61 12 58 13 55 14 52 15 48 16 45 17 42 18 39 19 35 20 32 21 29 22 26 23 23 24 19 25 16 26 13 27 10 28 6 29 3 30 0 31 100 32 ǒ3131* nǓ The full scale current is calculated from the above formula with n equal to zero. The EN/DIM pin has two primary functions. One function enables and disables the device. The other function is LED current dimming with 32 different levels by pulsing the input signal, as shown on Figure 16. On each consecutive pulse rising edge, the LED current is decreased by about 3.2% (1/31th of the full scale value). After 30 pulses, the LED current is 3.2% of the full scale current. On the 31st pulse, the current drops to zero, and then goes back to full scale on the following pulse. Each pulse width should be between 200 ns and 100 ms. Pulses faster than the minimum TLO may be ignored and filtered by the device. Pulses longer than the maximum TLO may shutdown the device. By pulsing the EN/DIM signal at high frequency, the LED current can quickly be set to zero. The LED driver enters a “zero current” shutdown mode if EN/DIM is held low for 3 ms typical. The dimming level is set by the number of pulses on the EN/DIM after the power−up, as shown in Table 7. 9 68 65 After power−up, the LED current is set by the external resistor (RSET) value and the number of pulses (n) on the EN/DIM input as follows: LED current + 125 71 THI EN/DIM TLO TPWRDWN TLED 100% LED Current Shutdown 100% 97% 94% 32 Levels 3% 0% Figure 16. EN/DIM Digital Dimming Timing Diagram www.onsemi.com 7 Shutdown CAT4002A, CAT4004A Example of Ordering Information (Note 4) Prefix Device # Suffix CAT 4004A HU2 −G T3 Package Lead Finish G: NiPdAu Tape & Reel (Note 6) T: Tape & Reel 3: 3,000 Units / Reel Company ID (Optional) HU2: UDFN SD: SC70 Product Number 4002A 4004A Table 8. ORDERING INFORMATION Part Number CAT4002ASD−GT3 CAT4004AHU2−GT3 2. 3. 4. 5. 6. Package Quantity per Reel SC70−6 3,000 UDFN−8 (2 x 2 mm) 3,000 All packages are RoHS−compliant (Lead−free, Halogen−free). The standard lead finish is NiPdAu. The device used in the above example is a CAT4004AHU2−GT3 (UDFN, NiPdAu, Tape & Reel, 3,000/Reel). For additional package and temperature options, please contact your nearest onsemi Sales office. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 8 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SC−88 (SC−70 6 Lead), 1.25x2 CASE 419AD ISSUE A DATE 07 JUL 2010 1 D e e E1 E SYMBOL MIN A 0.80 MAX 1.10 A1 0.00 0.10 A2 0.80 1.00 b 0.15 0.30 0.18 c 0.10 D 1.80 2.00 2.20 E 1.80 2.10 2.40 E1 1.15 1.25 1.35 0.65 BSC e L 0.26 L1 0.36 0.46 0.42 REF 0.15 BSC L2 TOP VIEW NOM θ 0º 8º θ1 4º 10º q1 A2 A q b q1 L L1 A1 SIDE VIEW c L2 END VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-203. DOCUMENT NUMBER: DESCRIPTION: 98AON34266E Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. SC−88 (SC−70 6 LEAD), 1.25X2 PAGE 1 OF 1 onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UDFN8, 2x2 CASE 517AW ISSUE A 1 SCALE 2:1 ÇÇ ÇÇ E DETAIL A ALTERNATE CONSTRUCTIONS 0.10 C 2X L L L1 PIN ONE REFERENCE 2X B A D DATE 13 NOV 2015 0.10 C TOP VIEW DETAIL B A 0.10 C A3 A1 0.08 C A1 SIDE VIEW NOTE 4 C D2 DETAIL A 1 8X 4 SEATING PLANE 5 e e/2 A3 ALTERNATE CONSTRUCTION MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.18 0.30 2.00 BSC 1.50 1.70 2.00 BSC 0.80 1.00 0.50 BSC 0.20 0.45 −−− 0.15 GENERIC MARKING DIAGRAM* 8X 1 b 0.10 C A B 0.05 C NOTE 3 BOTTOM VIEW RECOMMENDED SOLDERING FOOTPRINT* 1.73 PACKAGE OUTLINE DETAIL B DIM A A1 A3 b D D2 E E2 e L L1 L E2 8 ÇÇ ÇÇ ÉÉ MOLD CMPD EXPOSED Cu NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINALS AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 5. FOR DEVICE OPN CONTAINING W OPTION, DETAIL B ALTERNATE CONSTRUCTION IS NOT APPLICABLE. 8X 0.50 XX MG G XX = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. 2.30 1.00 1 8X 0.50 PITCH 0.30 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON34462E UDFN8, 2X2 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. 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