BC237B
Amplifier Transistors
NPN Silicon
Features
• Pb−Free Packages are Available*
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COLLECTOR
1
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Collector −Emitter Voltage
VCEO
45
Vdc
Collector −Emitter Voltage
VCES
50
Vdc
Collector −Emitter Voltage
VEBO
6.0
Vdc
Collector Current − Continuous
IC
100
mAdc
Total Power Dissipation @ TA = 25°C
Derate above TA = 25°C
PD
350
2.8
mW
mW/°C
Total Power Dissipation @ TA = 25°C
Derate above TA = 25°C
PD
1.0
8.0
W
mW/°C
Operating and Storage Temperature
Range
TJ, Tstg
−55 to +150
°C
2
BASE
3
EMITTER
TO−92
CASE 29
STYLE 17
1
12
3
STRAIGHT LEAD
BULK PACK
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Thermal Resistance, Junction−to−Ambient
RqJA
357
°C/W
Thermal Resistance, Junction−to−Case
RqJC
125
°C/W
2
3
BENT LEAD
TAPE & REEL
AMMO PACK
MARKING DIAGRAM
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
BC23
7B
AYWW G
G
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Package
Shipping†
TO−92
5000 Units / Bulk
BC237BG
TO−92
(Pb−Free)
5000 Units / Bulk
BC237BRL1G
TO−92
(Pb−Free)
2000 / Tape & Reel
Device
BC237B
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2007
March, 2007 − Rev. 5
1
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
BC237/D
BC237B
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
45
−
−
6.0
−
−
−
−
0.2
0.2
15
4.0
−
150
−
(IC = 2.0 mA, VCE = 5.0 V)
200
290
460
(IC = 100 mA, VCE = 5.0 V)
−
180
−
−
−
0.07
0.2
0.2
0.6
−
−
0.6
−
0.83
1.05
−
0.55
−
0.5
0.62
0.83
−
0.7
−
−
150
100
200
−
−
Unit
OFF CHARACTERISTICS
Collector −Emitter Breakdown Voltage
(IC = 2.0 mA, IB = 0)
V(BR)CEO
Emitter −Base Breakdown Voltage
(IE = 100 mA, IC = 0)
V(BR)EBO
Collector Cutoff Current
(VCE = 50 V, VBE = 0)
(VCE = 50 V, VBE = 0) TA = 125°C
V
V
ICES
nA
mA
ON CHARACTERISTICS
hFE
DC Current Gain
(IC = 10 mA, VCE = 5.0 V)
Collector −Emitter On Voltage
(IC = 10 mA, IB = 0.5 mA)
(IC = 100 mA, IB = 5.0 mA)
VCE(sat)
Base −Emitter Saturation Voltage
(IC = 10 mA, IB = 0.5 mA)
(IC = 100 mA, IB = 5.0 mA)
VBE(sat)
Base−Emitter On Voltage
(IC = 100 mA, VCE = 5.0 V)
(IC = 2.0 mA, VCE = 5.0 V)
(IC = 100 mA, VCE = 5.0 V)
VBE(on)
−
V
V
V
DYNAMIC CHARACTERISTICS
fT
Current −Gain — Bandwidth Product
(IC = 0.5 mA, VCE = 3.0 V, f = 100 MHz)
(IC = 10 mA, VCE = 5.0 V, f = 100 MHz)
MHz
Collector−Base Capacitance
(VCB = 10 V, IC = 0, f = 1.0 MHz)
Cobo
−
−
4.5
pF
Emitter−Base Capacitance
(VEB = 0.5 V, IC = 0, f = 1.0 MHz)
Cibo
−
8.0
−
pF
Noise Figure
(IC = 0.2 mA, VCE = 5.0 V, RS = 2.0 kW, f = 1.0 kHz, Df = 200 Hz)
NF
−
2.0
10
http://onsemi.com
2
dB
BC237B
1.0
VCE = 10 V
TA = 25°C
1.5
0.9
0.8
V, VOLTAGE (VOLTS)
hFE, NORMALIZED DC CURRENT GAIN
2.0
1.0
0.8
0.6
0.4
0.7
VBE(sat) @ IC/IB = 10
VBE(on) @ VCE = 10 V
0.6
0.5
0.4
0.3
0.2
0.3
VCE(sat) @ IC/IB = 10
0.1
0.2
0.2
0.5
1.0
2.0
5.0
10
20
50
IC, COLLECTOR CURRENT (mAdc)
100
0
0.1
200
Figure 1. Normalized DC Current Gain
0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
20 30
IC, COLLECTOR CURRENT (mAdc)
50 70 100
Figure 2. “Saturation” and “On” Voltages
10
400
300
7.0
C, CAPACITANCE (pF)
200
VCE = 10 V
TA = 25°C
100
80
60
TA = 25°C
Cib
5.0
3.0
Cob
2.0
40
30
20
0.5 0.7
1.0
2.0 3.0
5.0 7.0 10
20
IC, COLLECTOR CURRENT (mAdc)
30
1.0
0.4
50
Figure 3. Current−Gain — Bandwidth Product
r b, BASE SPREADING RESISTANCE (OHMS)
f T, CURRENT−GAIN BANDWIDTH PRODUCT (MHz)
TA = 25°C
0.6 0.8 1.0
2.0
4.0 6.0 8.0 10
VR, REVERSE VOLTAGE (VOLTS)
Figure 4. Capacitances
170
160
150
VCE = 10 V
f = 1.0 kHz
TA = 25°C
140
130
120
0.1
0.2
0.3
0.5
1.0
2.0 3.0
IC, COLLECTOR CURRENT (mAdc)
5.0
Figure 5. Base Spreading Resistance
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3
10
20
40
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TO−92 (TO−226)
CASE 29−11
ISSUE AM
SCALE 1:1
1
12
3
STRAIGHT LEAD
BULK PACK
DATE 09 MAR 2007
2
3
BENT LEAD
TAPE & REEL
AMMO PACK
A
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.
STRAIGHT LEAD
BULK PACK
R
P
L
SEATING
PLANE
K
DIM
A
B
C
D
G
H
J
K
L
N
P
R
V
D
X X
G
J
H
V
C
SECTION X−X
N
1
INCHES
MIN
MAX
0.175
0.205
0.170
0.210
0.125
0.165
0.016
0.021
0.045
0.055
0.095
0.105
0.015
0.020
0.500
--0.250
--0.080
0.105
--0.100
0.115
--0.135
---
MILLIMETERS
MIN
MAX
4.45
5.20
4.32
5.33
3.18
4.19
0.407
0.533
1.15
1.39
2.42
2.66
0.39
0.50
12.70
--6.35
--2.04
2.66
--2.54
2.93
--3.43
---
N
A
R
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. CONTOUR OF PACKAGE BEYOND
DIMENSION R IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P
AND BEYOND DIMENSION K MINIMUM.
BENT LEAD
TAPE & REEL
AMMO PACK
B
P
T
SEATING
PLANE
G
K
DIM
A
B
C
D
G
J
K
N
P
R
V
D
X X
J
V
1
C
N
SECTION X−X
MILLIMETERS
MIN
MAX
4.45
5.20
4.32
5.33
3.18
4.19
0.40
0.54
2.40
2.80
0.39
0.50
12.70
--2.04
2.66
1.50
4.00
2.93
--3.43
---
STYLES ON PAGE 2
DOCUMENT NUMBER:
STATUS:
98ASB42022B
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
TO−92 (TO−226)
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
3
TO−92 (TO−226)
CASE 29−11
ISSUE AM
DATE 09 MAR 2007
STYLE 1:
PIN 1. EMITTER
2. BASE
3. COLLECTOR
STYLE 2:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
STYLE 3:
PIN 1. ANODE
2. ANODE
3. CATHODE
STYLE 4:
PIN 1. CATHODE
2. CATHODE
3. ANODE
STYLE 5:
PIN 1. DRAIN
2. SOURCE
3. GATE
STYLE 6:
PIN 1. GATE
2. SOURCE & SUBSTRATE
3. DRAIN
STYLE 7:
PIN 1. SOURCE
2. DRAIN
3. GATE
STYLE 8:
PIN 1. DRAIN
2. GATE
3. SOURCE & SUBSTRATE
STYLE 9:
PIN 1. BASE 1
2. EMITTER
3. BASE 2
STYLE 10:
PIN 1. CATHODE
2. GATE
3. ANODE
STYLE 11:
PIN 1. ANODE
2. CATHODE & ANODE
3. CATHODE
STYLE 12:
PIN 1. MAIN TERMINAL 1
2. GATE
3. MAIN TERMINAL 2
STYLE 13:
PIN 1. ANODE 1
2. GATE
3. CATHODE 2
STYLE 14:
PIN 1. EMITTER
2. COLLECTOR
3. BASE
STYLE 15:
PIN 1. ANODE 1
2. CATHODE
3. ANODE 2
STYLE 16:
PIN 1. ANODE
2. GATE
3. CATHODE
STYLE 17:
PIN 1. COLLECTOR
2. BASE
3. EMITTER
STYLE 18:
PIN 1. ANODE
2. CATHODE
3. NOT CONNECTED
STYLE 19:
PIN 1. GATE
2. ANODE
3. CATHODE
STYLE 20:
PIN 1. NOT CONNECTED
2. CATHODE
3. ANODE
STYLE 21:
PIN 1. COLLECTOR
2. EMITTER
3. BASE
STYLE 22:
PIN 1. SOURCE
2. GATE
3. DRAIN
STYLE 23:
PIN 1. GATE
2. SOURCE
3. DRAIN
STYLE 24:
PIN 1. EMITTER
2. COLLECTOR/ANODE
3. CATHODE
STYLE 25:
PIN 1. MT 1
2. GATE
3. MT 2
STYLE 26:
PIN 1. VCC
2. GROUND 2
3. OUTPUT
STYLE 27:
PIN 1. MT
2. SUBSTRATE
3. MT
STYLE 28:
PIN 1. CATHODE
2. ANODE
3. GATE
STYLE 29:
PIN 1. NOT CONNECTED
2. ANODE
3. CATHODE
STYLE 30:
PIN 1. DRAIN
2. GATE
3. SOURCE
STYLE 31:
PIN 1. GATE
2. DRAIN
3. SOURCE
STYLE 32:
PIN 1. BASE
2. COLLECTOR
3. EMITTER
STYLE 33:
PIN 1. RETURN
2. INPUT
3. OUTPUT
STYLE 34:
PIN 1. INPUT
2. GROUND
3. LOGIC
STYLE 35:
PIN 1. GATE
2. COLLECTOR
3. EMITTER
DOCUMENT NUMBER:
STATUS:
98ASB42022B
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
TO−92 (TO−226)
http://onsemi.com
2
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 2 OFXXX
3
DOCUMENT NUMBER:
98ASB42022B
PAGE 3 OF 3
ISSUE
AM
REVISION
ADDED BENT−LEAD TAPE & REEL VERSION. REQ. BY J. SUPINA.
DATE
09 MAR 2007
ON Semiconductor and
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2007
March, 2007 − Rev. 11AM
Case Outline Number:
29
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