EMI5204MUTAG

EMI5204MU, EMI5206MU, EMI5208MU Four-Six-Eight-Channel EMI Filter with Integrated ESD Protection The EMI520xMU Series are a 4, 6, 8−channel (C−R−C) Pi−style EMI filter array with integrated ESD protection. Its typical component values of R = 100  and C = 7 pF deliver a cutoff frequency of 250 MHz and stop band attenuation greater than 20 dB from 800 MHz to 5.0 GHz. This performance makes the part ideal for parallel interfaces with data rates up to 167 Mbps in applications where wireless interference must be minimized. The specified attenuation range is very effective in minimizing interference from 2G/3G, GPS, Bluetooth® and WLAN signals. The EMI520xMU Series is available in the low−profile 4, 6, 8−lead, 0.5mm thick UDFN packages with 0.4mm lead pitch. http://onsemi.com MARKING DIAGRAMS 8 1 12 1 • ±8.0 kV ESD Protection on each channel (IEC61000−4−2 Level 4, 1 XX M G Contact Discharge) • R/C Values of 100  and 7 pF deliver Exceptional S21 Performance • Characteristics of 250 MHz f3dB and 20 dB Stop Band Attenuation from 800 MHz to 5.0 GHz Integrated EMI/ESD System Solution in UDFN Package Offers Exceptional Cost, System Reliability and Space Savings This is a Pb−Free Device 54 MG G 1 56 MG G UDFN12 CASE 517BD 1 16 Features/Benefits • UDFN8 CASE 517BC UDFN16 CASE 517BE 58 MG G 1 = Specific Device Code = Date Code = Pb−Free Package (*Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. Applications • EMI Filtering for LCD and Camera Data Lines • EMI Filtering and Protection for I/O Ports and Keypads 0 −5 R=100  Filter + ESDn Cd = 7 pF Cd = 7 pF Filter + ESDn S21 (dB) −10 −15 −20 −25 −30 See Table 1 for pin description −35 −40 1E+6 10E+6 100E+6 1E+9 10E+9 FREQUENCY (Hz) Figure 1. Electrical Schematic © Semiconductor Components Industries, LLC, 2011 July, 2011 − Rev. 0 Figure 2. Typical Insertion Loss Curve 1 Publication Order Number: EMI5204MU/D EMI5204MU, EMI5206MU, EMI5208MU 1 2 3 4 1 2 3 4 5 6 1 2 3 4 5 6 7 8 GND GND GND 8 7 6 5 EMI5204MU 12 1110 9 8 7 EMI5206MU 1615141312 11 10 9 EMI5208MU Figure 3. Pin Diagram (Bottom View) Table 1. FUNCTIONAL PIN DESCRIPTION Filter Device Pins Description EMI5204MU EMI5206MU EMI5208MU Filter 1 1&8 1 & 12 1 & 16 Filter + ESD Channel 1 Filter 2 2&7 2 & 11 2 & 15 Filter + ESD Channel 2 Filter 3 3&6 3 & 10 3 & 14 Filter + ESD Channel 3 Filter 4 4&5 4&9 4 & 13 Filter + ESD Channel 4 Filter 5 5&8 5 & 12 Filter + ESD Channel 5 Filter 6 6&7 6 & 11 Filter + ESD Channel 6 Filter 7 7 & 10 Filter + ESD Channel 7 Filter 8 8&9 Filter + ESD Channel 8 GND Ground Ground Pad GND GND MAXIMUM RATINGS Parameter ESD Discharge IEC61000−4−2 Symbol Value Unit VPP 8.0 kV Contact Discharge Operating Temperature Range TOP −40 to 85 °C Storage Temperature Range TSTG −55 to 150 °C TL 260 °C Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) Parameter Maximum Reverse Working Voltage Breakdown Voltage Symbol Test Conditions Min Typ VRWM 5.0 V 8.0 V 100 nA 115  IR = 1.0 mA Leakage Current IR VRWM = 3.3 V Resistance RA IR = 10 mA Diode Capacitance Cd VR = 2.5 V, f = 1.0 MHz 7.0 11 pF Line Capacitance CL VR = 2.5 V, f = 1.0 MHz 14 22 pF 3 dB Cut−Off Frequency (Note 1) f3dB Above this frequency, appreciable attenuation occurs 250 http://onsemi.com 2 85 7.0 Unit VBR 1. 50  source and 50  load termination. 6.0 Max 100 MHz EMI5204MU, EMI5206MU, EMI5208MU Theory of Operation From this it can be seen that a square wave consists of odd order harmonics and to fully construct a square wave n must go to infinity. However, to retain an acceptable portion of the waveform, the first two terms are generally sufficient. These two terms contain about 85% of the signal amplitude and allow a reasonable square wave to be reconstructed. Therefore, to reasonably pass a square wave of frequency x the minimum filter bandwidth necessary is 3x. All ON Semiconductor EMI filters are rated according to this principle. Attempting to violate this principle will result in significant rounding of the waveform and cause problems in transmitting the correct data. For example, take the filter with the response shown in Figure 4 and apply three different data waveforms. To calculate these three different frequencies, the 3 dB, 6 dB, and 9 dB bandwidths will be used. The EMI520x combines ESD protection and EMI filtering conveniently into a small package for today’s size constrained applications. The capacitance inherent to a typical protection diode is utilized to provide the capacitance value necessary to create the desired frequency response based upon the series resistance in the filter. By combining this functionality into one device, a large number of discrete components are integrated into one small package saving valuable board space and reducing BOM count and cost in the application. Application Example The accepted practice for specifying bandwidth in a filter is to use the 3 dB cutoff frequency. Utilizing points such as the 6 dB or 9 dB cutoff frequencies results in signal degradation in an application. This can be illustrated in an application example. A typical application would include EMI filtering of data lines in a camera or display interface. In such an example it is important to first understand the signal and its spectral content. By understanding these things, an appropriate filter can be selected for the desired application. A typical data signal is pattern of 1’s and 0’s transmitted over a line in a form similar to a square wave. The maximum frequency of such a signal would be the pattern 1−0−1−0 such that for a signal with a data rate of 100 Mbps, the maximum frequency component would be 50 MHz. The next item to consider is the spectral content of the signal, which can be understood with the Fourier series approximation of a square wave, shown below in Equations 1 and 2 in the Fourier series approximation. Equation 1: x(t) + a 1 2 1 ) sinǒ(2n * 1)  0tǓ 2  n + 1 2n * 1  ƪ ƫ (eq. 1) Equation 2 (Simplified form of Equation 1): x(t) + 1 ) 2 ǒ Ǔ 2 sin  0t  ƪ 1 (eq. 2) ) p20 sinǒ3 0tǓ 3 ) p20 sinǒ5 0tǓ 5 )AAA ƫ −3 dB MAGNITUDE (dB) −6 dB −9 dB f1 100k 1M 10M f2 f3 100M 1G 10G FREQUENCY (Hz) Figure 4. Filter Bandwidth multiply the result by two). The following table gives the bandwidth values and the corresponding maximum supported frequencies and the third harmonic frequencies. From the above paragraphs it is shown that the maximum supported frequency of a waveform that can be passed through the filter can be found by dividing the bandwidth by a factor of three (to obtain the corresponding data rate http://onsemi.com 3 EMI5204MU, EMI5206MU, EMI5208MU the third harmonic term is significantly attenuated. This serves to round the signal edges and skew the waveform, as is shown in Figure 5b. In the case that a 100 MHz signal is input to this filter, the third harmonic term is attenuated even further and results in even more rounding of the signal edges as is shown in Figure 5c. The result is the degradation of the data being transmitted making the digital data (1’s and 0’s) more difficult to discern. This does not include effects of other components such as interconnect and other path losses which could further serve to degrade the signal integrity. While some filter products may specify the 6 dB or 9 dB bandwidths, actually using these to calculate supported frequencies (and corresponding data rates) results in significant signal degradation. To ensure the best signal integrity possible, it is best to use the 3 dB bandwidth to calculate the achievable data rate. Table 2. FREQUENCY CHART Bandwidth Maximum Supported Frequency Third Harmonic Frequency 3 dB − 100 MHz 33.33 MHz (f1) 100 MHz 6 dB − 200 MHz 66.67 MHz (f2) 200 MHz 9 dB − 300 MHz 100 MHz (f3) 300 MHz Considering that 85% of the amplitude of the square is in the first two terms of the Fourier series approximation most of the signal content is at the fundamental (maximum supported) frequency and the third harmonic frequency. If a signal with a frequency of 33.33 MHz is input to this filter, the first two terms are sufficiently passed such that the signal is only mildly affected, as is shown in Figure 5a. If a signal with a frequency of 66.67 MHz is input to this same filter, Input Waveform Output Waveform a) Frequency = f1 Input Waveform b) Frequency = f2 Input Waveform Output Waveform Output Waveform c) Frequency = f3 Figure 5. Input and Output Waveforms of Filter ORDERING INFORMATION Package Shipping† EMI5204MUTAG UDFN8 (Pb−Free) 3000 / Tape & Reel EMI5206MUTAG UDFN12 (Pb−Free) 3000 / Tape & Reel EMI5208MUTAG UDFN16 (Pb−Free) 3000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Bluetooth is a registered trademark of Bluetooth SIG. http://onsemi.com 4 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UDFN8, 1.7x1.35, 0.4P CASE 517BC ISSUE A 8 1 SCALE 4:1 DATE 11 AUG 2022 GENERIC MARKING DIAGRAMS* 1 XX MG G 1 XXXMG G XXX = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. DOCUMENT NUMBER: DESCRIPTION: 98AON47060E UDFN8, 1.7x1.35, 0.4P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UDFN12, 2.5x1.35, 0.4P CASE 517BD−01 ISSUE O 12 1 DATE 18 NOV 2009 SCALE 4:1 A B D 2X 0.10 C PIN ONE REFERENCE 2X L1 ÉÉÉ ÉÉÉ 0.10 C DETAIL A E OPTIONAL CONSTRUCTIONS TOP VIEW DETAIL B (A3) A1 0.05 C NOTE 4 A1 SIDE VIEW 12X 6 1 C SEATING PLANE MOLD CMPD DETAIL B OPTIONAL CONSTRUCTION DETAIL A D2 L ÇÇ ÇÇ ÉÉ EXPOSED Cu A 0.05 C 12X L L A3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.25 mm FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DIM A A1 A3 b D D2 E E2 e K L L1 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 2.50 BSC 1.90 2.10 1.35 BSC 0.30 0.50 0.40 BSC 0.15 −−− 0.20 0.30 −−− 0.05 GENERIC MARKING DIAGRAM* E2 XX MG G 12 K 7 e 12X 1 b XX = Specific Device Code M = Month Code G = Pb−Free Package (Note: Microdot may be in either location) 0.10 C A B BOTTOM VIEW 0.05 C NOTE 3 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. RECOMMENDED SOLDERING FOOTPRINT* PACKAGE OUTLINE 12X 2.20 0.40 1.55 0.50 12X 0.40 PITCH 0.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON47061E UDFN12, 2.5X1.35, 0.4P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UDFN16, 3.3x1.35, 0.4P CASE 517BE−01 ISSUE O 16 DATE 18 NOV 2009 1 SCALE 4:1 A B D 2X 0.10 C PIN ONE REFERENCE 2X 0.10 C L1 ÉÉÉ ÉÉÉ DETAIL A E OPTIONAL CONSTRUCTIONS TOP VIEW EXPOSED Cu A DETAIL B 0.05 C (A3) 16X A1 0.05 C NOTE 4 16X A1 SIDE VIEW SEATING PLANE C 8 1 ÇÇ ÇÇ ÉÉ MOLD CMPD DETAIL B OPTIONAL CONSTRUCTION DETAIL A D2 L L L A3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.25 mm FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DIM A A1 A3 b D D2 E E2 e K L L1 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 3.30 BSC 2.70 2.90 1.35 BSC 0.30 0.50 0.40 BSC 0.15 −−− 0.20 0.30 −−− 0.05 GENERIC MARKING DIAGRAM* E2 XX MG G K 16 9 e 16X 1 b XX = Specific Device Code M = Month Code G = Pb−Free Package (Note: Microdot may be in either location) 0.10 C A B BOTTOM VIEW 0.05 C NOTE 3 RECOMMENDED SOLDERING FOOTPRINT* PACKAGE OUTLINE 3.00 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. 16X 0.40 1.55 0.50 16X 0.40 PITCH 0.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON47062E UDFN16, 3.3X1.35, 0.4P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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