M1MA142WKT1

M1MA141WKT1, M1MA142WKT1 Preferred Device Common Cathode Silicon Dual Switching Diode This Common Cathode Silicon Epitaxial Planar Dual Diode is designed for use in ultra high speed switching applications. This device is housed in the SC−70 package which is designed for low power surface mount applications. Features http://onsemi.com CATHODE 3 • Fast trr, < 3.0 ns • Low CD, < 2.0 pF • Pb−Free Packages are Available 1 MAXIMUM RATINGS (TA = 25°C) Rating Reverse Voltage M1MA141WKT1 M1MA142WKT1 Peak Reverse Voltage M1MA141WKT1 M1MA142WKT1 Forward Current Single Dual Peak Forward Current Single Dual Peak Forward Surge Current M1MA141WKT1 M1MA142WKT1 IFSM (Note 1) IFM 225 340 mAdc 500 750 IF 100 150 mAdc VRM 40 80 mAdc Symbol VR 40 80 Vdc Value Unit 3 ANODE 2 Vdc 1 2 SC−70 (SOT−323) CASE 419 STYLE 5 MARKING DIAGRAM Mx M G G THERMAL CHARACTERISTICS Rating Power Dissipation Junction Temperature Storage Temperature Symbol PD TJ Tstg Max 150 150 −55 to + 150 Unit mW °C °C Mx = Device Code x = T for 141 U for 142 M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. ORDERING INFORMATION Device M1MA141WKT1 M1MA141WKT1G M1MA142WKT1 M1MA142WKT1G Package SC−70 SC−70 (Pb−Free) SC−70 SC−70 (Pb−Free) Shipping † 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. t = 1 SEC †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Preferred devices are recommended choices for future use and best overall value. © Semiconductor Components Industries, LLC, 2005 1 November, 2005 − Rev. 7 Publication Order Number: M1MA141WKT1/D M1MA141WKT1, M1MA142WKT1 ELECTRICAL CHARACTERISTICS (TA = 25°C) Characteristic Reverse Voltage Leakage Current M1MA141WKT1 M1MA142WKT1 Forward Voltage Reverse Breakdown Voltage M1MA141WKT1 M1MA142WKT1 Diode Capacitance Reverse Recovery Time (Figure 1) 2. trr Test Circuit Condition VR = 35 V VR = 75 V IF = 100 mA IR = 100 mA Symbol IR Min − Max 0.1 Unit mAdc VF VR − 40 80 1.2 − Vdc Vdc VR = 0, f = 1.0 MHz IF = 10 mA, VR = 6.0 V, RL = 100 W, Irr = 0.1 IR CD trr (Note 2) − − 2.0 3.0 pF ns http://onsemi.com 2 M1MA141WKT1, M1MA142WKT1 RECOVERY TIME EQUIVALENT TEST CIRCUIT INPUT PULSE tr tp t A RL 10% Irr = 0.1 IR 90% VR t p = 2 ms tr = 0.35 ns IF = 10 mA VR = 6 V RL = 100 W IF OUTPUT PULSE trr t Figure 1. Recovery Time Equivalent Test Circuit 100 IF, FORWARD CURRENT (mA) TA = 85°C 10 TA = −40°C IR , REVERSE CURRENT (μA) 10 TA = 150°C TA = 125°C 1.0 0.1 TA = 85°C TA = 55°C 1.0 TA = 25°C 0.01 TA = 25°C 0 10 20 30 40 VR, REVERSE VOLTAGE (VOLTS) 50 0.1 0.2 0.4 0.6 0.8 1.0 VF, FORWARD VOLTAGE (VOLTS) 1.2 0.001 Figure 2. Forward Voltage Figure 3. Reverse Current 0.68 CD, DIODE CAPACITANCE (pF) 0.64 0.6 0.56 0.52 0 2 4 6 8 VR, REVERSE VOLTAGE (VOLTS) Figure 4. Diode Capacitance http://onsemi.com 3 M1MA141WKT1, M1MA142WKT1 PACKAGE DIMENSIONS SC−70 (SOT−323) CASE 419−04 ISSUE M D e1 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. HE 1 2 E b e A 0.05 (0.002) A2 L c DIM A A1 A2 b c D E e e1 L HE MIN 0.80 0.00 0.30 0.10 1.80 1.15 1.20 2.00 MILLIMETERS NOM MAX 0.90 1.00 0.05 0.10 0.7 REF 0.35 0.40 0.18 0.25 2.10 2.20 1.24 1.35 1.30 1.40 0.65 BSC 0.425 REF 2.10 2.40 MIN 0.032 0.000 0.012 0.004 0.071 0.045 0.047 0.079 INCHES NOM 0.035 0.002 0.028 REF 0.014 0.007 0.083 0.049 0.051 0.026 BSC 0.017 REF 0.083 MAX 0.040 0.004 0.016 0.010 0.087 0.053 0.055 0.095 A1 STYLE 5: PIN 1. ANODE 2. ANODE 3. CATHODE SOLDERING FOOTPRINT* 0.65 0.025 0.65 0.025 1.9 0.075 0.9 0.035 0.7 0.028 SCALE 10:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Japan : ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Phone: 81−3−5773−3850 Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. http://onsemi.com 4 M1MA141WKT1/D